[1]W. H. Cheng, W. H. Wang.,Y.M. Huang,H. Y. Chen,and H. H. Lin, 1995,”Failure mechanism of hole formation in laser welding technique for optoelectronic packaging,”Electronic Components an Technology Coference,Proceedings.,45th,pp.914-916.
[2]W. H. Cheng, W. H. Wang., Y.M. Huang,and H. H. Lin,1995,”Reduction of mircomovement in optoelectronic packaging,”Laser welding for Electro-Optics Society Annual Meeting Conference Proceedings 8th,Vol.1,pp.248-249 .
[3]B. Valk,R. Batting,and O. Anthamatten, 1995,”Laser welding for fiber pigtailing with long-term stability and sub micron accuracy,”Opt. Eng.,Vol.34,pp.2675-2682.
[4]P. Mueller and B. Valk,2000,”Automated fiber attachment for 980 nm pump modules,”Electronic Components and Technology Conference,Proceedings.50th,pp. 5-9.
[5]J.H. Kuang,M. T. Sheen,Z. C. Wang,G. L. Wang,and W. Cheng,2001,”Post-weld-shift in dual-in-line package,”IEEE Trans. On Advanced packaging.Vol.24,NO.1,pp.81-85.
[6]趙芝山,「雷射銲接於光通訊元件封裝之有限元素分析」, 國立交通大學碩士論文,民國九十年六月.[7] 蘇麗華,「光收發模組之光軸設計研究」,國立海洋大學碩士論文,民國九十六年六月。[8]許吉成,「以橢圓透鏡增加光纖訊號耦合效率之研究」,國立臺灣科技大學碩士論文,民國九十四年六月。[9]胡志允,「橢面微透鏡於雷射與光纖耦合效率」,國立臺灣科技大學碩士論文,民國九十七年六月。[10]張朝揚,「雷射光次模組中熱效應與耦光效率之分析」,國立國立高雄應用科技大學碩士論文,民國九十八年六月。