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研究生:詹瑋億
研究生(外文):Wei-yi Chan
論文名稱:發光二極體封裝之雷射共晶固晶製程
論文名稱(外文):Laser Soldered Eutectic Die-Bonding Processes in the LED Packaging
指導教授:光灼華
指導教授(外文):Jao- hwa Kuang
學位類別:碩士
校院名稱:國立中山大學
系所名稱:機械與機電工程學系研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:163
中文關鍵詞:固晶共晶雷射熱應力殘留應力
外文關鍵詞:Die BondingEutecticLaserThermal StressResidual Stress
相關次數:
  • 被引用被引用:0
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  • 下載下載:44
  • 收藏至我的研究室書目清單書目收藏:1
本文主要在探討由雷射功率控制於共晶固晶製程中,對固晶之效益及固晶過程中對各其他元件材料的溫度與應力影響。文中之雷射固晶製程係用波長940nm的連續式二極體雷射,經由透鏡聚焦局部加熱氮化鋁基板背面一段時間,藉熱傳導將熱能傳至附著於基板另一面之晶粒與錫金層,使其介面間之錫金共晶焊料超過共晶點溫度,焊接磊晶晶粒於基板上。文中利用有限元素套裝軟體MSC. Marc中之熱-彈-塑模式,配合隨溫度變化之材料特性,進行整個雷射加熱之模擬工作。文中並配合實驗結果透過逆算工程修正有限元素模式中部份參數,如:氮化鋁對此波長雷射之吸收率、氮化鋁熱傳導係數、比熱及自然對流係數,以確保在溫度方面之數值結果與實驗量測差異維持於10%以內。文中首先控制雷射功率使基板令面之錫金合金層溫度介於300 ~325 間,並分析雷射加熱過程中,組件之溫度分布與熱應力變化;同時探討冷卻後各焊面間之殘留應力分布。研究中亦探討了雷射位置偏移、聚焦、離焦、雷射入射基板角度,以及雙束雷射對製程之可能影響。極盼此研究結果有助於國內高功率磊晶固晶製程之建立。
The effect of laser power pattern on the temperature and thermal stress distributions in LED die bonding process is investigated in this work. The wavelength of 940nm diode laser source is used in this study. The laser light is focus on the back of an AlN substrate. The eutectic Au80Sn20 solder metallized between die and substrate is soldered by the heat conducted from the controlled laser power. The finite element package software-MSC. Marc is employed to simulate the laser soldering process. The thermal-elastic-plastic models of the solid elements are used. The temperature dependent material properties are applied to characterize the temperature variation effect during the die bonding. The measured temperature data have also been used to derive the absorption coefficient, conductivity, specific heat of AlN substrate and the convection coefficient in free convection via the inverse engineering process. A difference between the simulated and measured temperature can be kept in 10%. The temperature and thermal stress distributions during the die bonding process have been simulated and studied. The distributions of residual stress induced in this die bonding process have also been studied. The effects of different laser soldering parameters, e.g. focus shift, defocus, inclined angle, on the die bonding are also studied.
論文審定書 i
謝誌 ii
摘要 iii
Abstract iv
目錄 v
圖目錄 viii
表目錄 xiii
符號說明 xiv
第一章 緒論 1
1.1前言 1
1.2 研究動機 5
1.3 文獻回顧 6
1.4 組織章節 9
第二章 研究理論與方法 10
2.1逆算工程 10
2.2實驗設置 13
2.3熱傳分析理論 21
2.4應力分析理論 22
2.5 牛頓-拉弗森法(Newton-Raphson Method) 24
第三章 有限元素模型建立 28
3.1 幾何外觀與接觸設定 28
3.2 初始狀態與邊界條件 33
3.2.1自然熱對流與雷射熱源 33
3.2.2 位移拘束條件 37
3.3 網格切割與斂散性分析 41
3.4 材料參數與熱對流係數 53
3.4.1 材料模型與參數 53
3.4.2 敏感度分析 57
3.4.3 目標搜尋 64
3.5 模型驗證 69
第四章 數值結果與討論 73
4.1 製程參數介紹與各材料狀況 73
4.1.1 基板與接合墊 77
4.1.2 錫金共晶合金 82
4.1.3 磊晶層 87
4.1.4 襯底 90
4.2 雷射參數 97
4.2.1 雷射位置偏移 97
4.2.2 聚焦與離焦 103
4.2.3 雷射傾角 107
4.2.4 雙束雷射間距 111
4.3 吸嘴參數 114
4.3.1 等效吸嘴長度 114
4.3.2 吸取壓力 117
4.3.3 下壓負重 122
4.4 基板參數 124
4.4.1 基板長寬 124
4.4.2 薄化基板 127
4.4.3 溝槽深度 131
第五章 結論與未來工作 135
5.1 結論 135
5.2 未來工作 136
參考文獻 137
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