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研究生:曾柏源
研究生(外文):Tseng, Po-Yuan
論文名稱:模仁材料與圖案對超音波奈米轉印技術之影響
論文名稱(外文):Impacts of Mold Material and Pattern Size for Ultrasonic Nanoimprint Lithography
指導教授:陳榮順陳榮順引用關係林建宏林建宏引用關係
指導教授(外文):Chen, RongshunLin, Chien-Hung
學位類別:碩士
校院名稱:國立清華大學
系所名稱:奈米工程與微系統研究所
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:72
中文關鍵詞:奈米轉印超音波模仁電鑄
相關次數:
  • 被引用被引用:0
  • 點閱點閱:337
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  • 下載下載:12
  • 收藏至我的研究室書目清單書目收藏:0
本研究設計以及製造不同材料與圖案的模仁,包含微米矽模仁、次微米矽模仁以及微米鎳模仁,並成功的開發其超音波奈米轉印微影技術。研究結果顯示在室溫下能將不同材料、不同線寬等級的模仁圖案轉印至PET基板上。超音波奈米轉印微影技術主要是利用超音波產生振動使模仁與聚合物產生摩擦並提升溫度至聚合物的玻璃轉換溫度之上,再利用壓力使模仁壓入因高溫軟化的聚合物內。研究中以填滿率作為評量轉印效果品質的性能指標,並利用田口品質方法求得不同形式模仁之最佳化製程參數,最後探討模仁材料以及圖案對超音波奈米轉印微影技術的影響。
摘要 I
致謝 II
目錄 III
圖目錄 VI
表目錄 IX
第一章 緒論 1
1.1 前言 1
1.2 研究背景與動機 3
1.3 文獻回顧 7
1.3.1 奈米轉印微影技術 7
1.3.2 超音波奈米轉印微影技術 10
1.4 論文架構 14
第二章 超音波奈米轉印微影技術 15
2.1 超音波奈米轉印系統 15
2.2 超音波奈米轉印流程 17
2.3 矽模仁製作 18
2.3.1 微米矽模仁製程 19
2.3.2 次微米矽模仁製程 21
2.4 鎳模仁製作 23
2.4.1 電鑄原理 23
2.4.2 微米鎳模仁製程 28
2.5 田口品質工程方法 32
2.5.1 目標函數 32
2.5.2 因子水準的建立 35
2.5.3 直交表與S/N比 37
2.5.4 回應表 39
2.5.5 變異數分析 40
2.6 轉印材料 41
第三章 實驗結果與討論 42
3.1 模仁製作成果 42
3.1.1 微米矽模仁 42
3.1.2 次微米矽模仁 45
3.1.3 微米鎳模仁 48
3.2 表面抗沾黏處理 51
3.3 轉印實驗結果 52
3.3.1 微米矽模仁轉印實驗結果 52
3.3.2 次微米矽模仁轉印實驗結果 55
3.3.3 微米鎳模仁轉印實驗結果 57
3.3.4 最佳化水準 60
3.4 模仁材料與圖案對轉印之影響 64
第四章 結論及未來工作 67
4.1 結論 67
4.2 未來工作 68
參考文獻 69
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[30] 林建宏,"超音波奈米轉印技術,"國立清華大學博士論文,民國九十六年。
[31] 王志祐,"加熱輔助超音波奈米轉印技術,"國立清華大學碩士論文,民國九十九年。
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