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研究生:韓鎮宇
研究生(外文):Cheng-Yu Han
論文名稱:電熱厚膜元件應用於熱澆道射出成型
論文名稱(外文):Implementation of Thick-Film Resistors into the Hot Sprue for Injection Molding
指導教授:林舜天林舜天引用關係
指導教授(外文):Shun-Tian Lin
口試委員:林舜天
口試日期:2012-07-09
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:機械工程系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:66
中文關鍵詞:熱澆道網印電熱膜
外文關鍵詞:Hot SprueScreen PrintingThick-Film Resistor
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熱澆道為塑膠射出成型及金屬粉末射出成型之重要工具。本研究”厚膜式熱澆道”之製造為利用特殊模具鋼,加工成設計完成之外觀後,以網印的方式將絕緣漿料及電阻漿料印刷上基材,再經過高溫燒結先後附著上噴嘴主件。可做出一體成型且最大直徑為13毫米之熱澆道噴嘴,藉由噴嘴主體直徑縮小使其澆口間距縮小,改善塑料之流動性,因此可應用在輕、薄、短小的零組件上。
本研究調配電阻漿與銀漿之比例,使導電材料在電路中可以適度產生聚集效應而形成導電凝團,讓加熱元件在小功率的電源供應下可以升到高溫、性能最佳化。以此方式製作電熱膜熱澆道,比較新式熱澆道與傳統線圈式熱澆道之性能,發現電熱膜熱澆道之加熱效率快、傳熱佳,加熱器與噴嘴口的溫差僅僅20℃左右;遠小於螺線圈熱澆道的60℃。
Hot spure is a very important device for plastic injection molding and metal injection molding. This research apply the thick-film technique on the special mold steel, which was design and manufacture. It was screen printing with insulate and resistance paste on it. The specimen was co-fired after attaching the main spray nozzle. The diameter of spray nozzle was control at the size of 13 mm. According to the diameter of spray nozzle, when the spur space is reduce the fluidity of paste is modify therefore it can be apply on small, light, and small component.
This research have develop a mixed paste consist of resistance paste and silver paste. The appropriate amount of paste was printed on the circuit. It triggered the conductive paste to aggregate and agglomerate which cause the power supply to apply a minimum small power to reach a high temperature and optimize the performance. This research was compare with the conventional hot spur with the screen print hot spur. It was detected that the screen print hot spur is more efficiency and conductive when co-firing. The heater and spray jet is control at 20℃ which is better than the conventional hot spur at 60℃.
目 錄
摘要…………………………………………………………….I
Abstract……………………………………………………….II
誌謝..………………………………………………………….III
目錄..………………………………………………………….IV
圖目錄.………………………………………………………..VI
表目錄..……………………………………………………..VIII
第一章 緒論…………………………………………………………1
1-1研究背景………………………………………………………1
1-2研究目的………………………………………………………3
第二章 基礎理論與文獻回顧………………………………………5
2-1射出成型之冷澆道與熱澆道…………………………………5
2-2熱澆道相比冷澆道之優缺點…………………………………7
2-3 熱澆道之溫控系統…………………………………………8
2-3.1 熱電偶…………………………………………………8
2-3.2 溫度控制器……………………………………………10
2-4電熱厚膜系統…………………………………………………13
2-4.1 簡介……………………………………………………13
2-4.2 厚膜導電機制…………………………………………15
2-4.3 厚膜電阻值之計算……………………………………19
2-4.4 厚膜導電機制…………………………………………20
2-4.5 厚膜加熱原理…………………………………………21
第三章 實驗方法與步驟……………………………………………23
3-1 實驗材料與設備………………………………………………23
3-2 實驗流程………………………………………………………24
3-3 網版印刷………………………………………………………33
第四章 結果與討論…………………………………………………38
4-1 不同比例混成之銀膠、電阻膠燒成膜電阻特性……………38
4-2 不同電阻之電熱膜加熱性質…………………………………41
4-3 熱澆道設計……………………………………………………49
4-4.1 熱澆道之外型設計………………………………………50
4-4.2 厚膜電阻電路設計………………………………………52
4-3.3 熱澆道加熱試驗…………………………………………54
4-4 電熱厚膜的破壞機制…………………………………………58
第五章 結論……………………………………………………………62
第六章 參考文獻.……………………………………………………64
參考文獻
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