臺灣博碩士論文加值系統

本研究主要為探討添加微量Mg元素對Sn-0.7Cu無鉛銲錫合金熔點、顯微組織、機械性質及接合性能方面之影響。經由示差掃描熱量分析中可得知添加Mg元素後，Sn-0.7Cu合金之熔點降低約為227.88℃。顯微組織分析結果顯示Sn-0.7Cu與Sn-0.7Cu-0.01Mg銲錫合金為β-Sn+網狀的β-Sn+Cu6Sn5共晶的組成，而Sn-3Ag-0.5Cu合金為β-Sn+網狀的β-Sn+Ag3Sn+Cu6Sn5共晶的組成。在拉伸性能方面可以得知Mg元素的添加會降低Sn-0.7Cu合金之強度，但其伸長率有明顯的提升；此外，添加微量Mg元素可以提升合金之潤濕性能。接合性能實驗結果可發現，銲錫合金之界面反應層會隨儲存時間增加而變厚，且界面反應層之組織均為Cu6Sn5介金屬化合物；隨高溫熱儲存時間的增加，銲點強度則隨之下降，且觀察其破斷面發現，造成銲點破斷位置將由銲錫移至銲錫與界面反應層處。

The research was focused on the effects of Mg additions to Sn-0.7Cu lead-free solder on the melting point, microstructure, mechanical property, and joint performance. Results of differential scanning calorimeter analysis showed that alloying of Mg to Sn-0.7Cu decreased the melting temperature slightly where the melting temperature was 227.88 °C. The microstructures of Sn-0.7Cu and Sn-0.7Cu-0.01Mg solders could be clearly divided into two regions, it was identified that the dendrite arm was primary β-Sn phase while the interdendritic eutectic was the Cu6Sn5/β-Sn eutectic phase. However, the eutectic regions of ternary eutectic Sn-3Ag-0.5Cu solder were a mixture of fine intermetallic particles of Cu6Sn5 and Ag3Sn in the β-Sn matrix. The wetting property was improved by addition of Mg element into the Sn-0.7Cu solder alloy. The addition of Mg enhanced the elongation of the solders but decreased their tensile strength. The intermetallic compounds thickness gradually increased with the increase of aging time. The tensile strength of the joints decreased with the increase of aging time while the fracture site was moved from solder alloy to intermetallics interface.

目錄
摘要..................................................i
Abstract.............................................ii
誌謝..................................................iv
目錄..................................................v
表目錄................................................vii
圖目錄................................................viii
第一章 緒論.............................................1
第二章 文獻回顧..........................................3
2.1 電子構裝技術.........................................3
2.2 銲接................................................8
2.3 無鉛銲錫合金的開發....................................12
2.4 無鉛銲錫合金的性質需求.................................14
2.5 無鉛銲錫合金系統......................................27
2.6 無鉛銲錫的可銲錫性與助銲劑之使用.........................32
2.7 電子構裝之可靠度分析...................................34
2.8 微量Mg元素添加對無鉛銲錫合金的影響.......................39
第三章 實驗流程與方法......................................42
3.1實驗流程..............................................42
3.2示差掃描量熱分析.......................................44
3.3銲錫合金顯微組織觀察與成分分析............................45
3.4拉伸試驗..............................................46
3.5潤濕性試驗............................................48
3.6銲接試棒製備...........................................49
3.7 高溫儲存試驗..........................................50
3.8 銲點界面顯微組織觀察與分析..............................51
3.9 接合強度測試及破斷面分析................................52
第四章 實驗結果與討論......................................53
4.1 熱性質分析...........................................53
4.2 合金顯微組織與成分分析.................................54
4.3 拉伸性質.............................................57
4.4拉伸破斷面分析.........................................60
4.5潤濕特性分析...........................................62
4.6接合性能之界面組織分析...................................65
4.7接合性能之拉伸性質分析...................................70
第五章 結論...............................................77
參考文獻.................................................79
Extended Abstract.......................................83
簡歷(CV).................................................90 

表目錄
表2.1 預敷銲料的各種方法及優缺點.............................11
表2.2 無鉛銲錫合金成份熔點表................................16
表2.2 無鉛銲錫合金成分熔點表(續).............................17
表2.3 多種無鉛銲錫與Cu基材間潤濕角之比較......................19
表2.4 無鉛銲錫合金及導線架材料之基本物理性質...................21
表2.5為一般銲錫及導線架材料之室溫電阻係數值....................22
表2.6為目前常見銲錫用金屬的成本..............................26
表2.7為目前常見幾種無鉛銲錫組成的成本.........................27
表2.8為目前常見之助銲劑種類及其特性與應用......................34
表2.9 各種可靠度試驗條件及目的...............................37
表2.9 各種可靠度試驗條件及目的(續)...........................38
表2.10 不同比例Mg元素添加對合金熔點的影響.....................41
表4.1 三種銲錫合金之拉伸機械性質.............................58
 
圖目錄
圖2.1 電子構裝的功能.......................................3
圖2.2 電子層級的區分.......................................4
圖2.3 打線接合接合方式.....................................5
圖2.4 覆晶微互連用凸塊的示意圖...............................5
圖2.5 捲帶式自動接合方式....................................6
圖2.6 (a)表面黏著技術型(b)引腳插入型示意圖....................7
圖2.7 SMD雙面整體迴銲的技術過程.............................10
圖2.8 波銲法.............................................12
圖2.9 Sn-Pb合金的相圖.....................................14
圖2.10為潤濕反應的示意圖...................................17
圖2.11 介金屬化合物有助於阻礙裂縫生長示意圖....................29
圖2.12 故障的函數圖形......................................35
圖2.13 Sn-4Ag-0.5Cu-5Mg合金的顯微組織SEM圖.................41
圖3.1 實驗流程示意圖.......................................43
圖3.2 示差掃描量熱分析.....................................45
圖3.3 為場發射掃描式電子顯微鏡...............................46
圖3.4 合金拉伸試棒尺寸.....................................47
圖3.5 澆鑄完成後試片.......................................47
圖3.6 拉伸試驗機..........................................48
圖3.7潤濕性實驗示意圖......................................48
圖3.8 銲接試棒尺寸示意圖...................................50
圖3.9 Cu基材銲接試棒完成後之實體照片.........................50
圖3.10 為熱風循環烘箱......................................51
圖3.11 微負荷拉伸試驗機....................................52
圖4.1 三種銲錫合金之DSC分析曲線比較..........................54
圖4.2 Sn-0.7Cu合金的顯微組織圖.............................55
圖4.3 Sn-0.7Cu-0.01Mg合金的顯微組織圖......................55
圖4.4 Sn-0.7Cu-0.01Mg合金成分分佈情形......................56
圖4.5 Sn-3Ag-0.5Cu合金的顯微組織圖.........................57
圖4.6 三種銲錫合金之拉伸機械性質平均值比較.....................59
圖4.7 三種合金拉伸曲線圖...................................59
圖4.8 Sn-0.7Cu合金之拉伸破斷面SEM圖........................61
圖4.9 Sn-0.7Cu-0.01Mg合金之拉伸破斷面的SEM圖................61
圖4.10 Sn-3Ag-0.5Cu合金之拉伸破斷面的SEM圖..................61
圖4.11 銲錫合金之接觸角大小.................................63
圖4.12 銲錫合金之鋪展面積大小...............................63
圖4.13 Sn-0.7Cu合金之潤濕情形 (a)鋪展面積 (b)接觸角..........64
圖4.14 Sn-0.7Cu-0.01Mg合金之潤濕情形 (a)鋪展面積 (b)接觸角...64
圖4.15 Sn-3Ag-0.5Cu合金之潤濕情形 (a)鋪展面積 (b)接觸角......64
圖4.16 Sn-0.7Cu銲點經150℃高溫儲存後之SEM圖.................66
圖4.17 Sn-0.7Cu-0.01Mg銲點經150℃高溫儲存後之SEM圖..........68
圖4.18 Sn-3Ag-0.5Cu銲點經150℃高溫儲存後之SEM圖.............69
圖4.19 界面反應層厚度與高溫儲存時間關係圖.....................70
圖4.20 三種銲錫合金銲點之平均強度比較........................73
圖4.21 三種銲錫合金銲點強度與高溫儲存時間關係..................73
圖4.22 Sn-0.7Cu銲點經150℃高溫儲存拉伸斷裂SEM圖..............74
圖4.23 Sn-0.7Cu-0.01Mg銲點經150℃高溫儲存拉伸斷裂SEM圖.......75
圖4.24 Sn-3Ag-0.5Cu銲點經150℃高溫儲存拉伸斷裂SEM圖..........76

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