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研究生:曾思瑋
研究生(外文):Zeng,SiWei
論文名稱:防護線貫孔間距大小對抑制高速電路板之研究
論文名稱(外文):Study on Different Spacing Size of the Guard Trace Ground Vias to Reduce Crosstalk of High-Speed Circuits Board
指導教授:周允仕
指導教授(外文):Chou,YunHsih
口試委員:阮全平黃中信
口試委員(外文):Juan,ChuanPingHuang,ChungHsin
口試日期:2012-07-21
學位類別:碩士
校院名稱:聖約翰科技大學
系所名稱:電子工程系碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:46
中文關鍵詞:串音干擾防護線
外文關鍵詞:CrosstalkGuard Trace
相關次數:
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  • 下載下載:21
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本研究主要是探討訊號在高速傳輸時所造成電磁干擾、信號品質等問題,藉著使用防護線鑽孔的方式改善電流迴路路徑,抑制遠端以及近端所造成的串音干擾。本論文使用0.8 mm厚度的印刷電路板,傳輸防護線結構主要是由三條等長等寬的50Ω傳輸線所構成,架構是以3倍線寬的經驗公式做為侵略線與犧牲線的間距,再由1/2λ、1/4λ及3/8λ的距離來做為防護線貫孔間距,這幾種方式都有顯著改善近端與遠端串音干擾的現象,且在1/4λ及3/8λ防護線的貫孔間距抑制效果較傳統型防護線改善約10db左右。我們亦使用1/4λ及3/8λ來做為場牆貫孔間距大小之實驗,發現在加入場牆之後近端串音方面無太大的抑制效果,但在遠端串音方面可以多改善3db左右,信號通道方面也明顯地變好,另外3/8λ防護線的信號通道S參數量測結果顯示在三個頻率點有很大的塌陷,再加入場牆之後讓信號通道可以顯示出跟理想值一樣的衰減。
This study is mainly to investigate the issues of electromagnetic interference (EMI) and signal integrity (SI) when a signal is in high speed transmission. It considers the implementation of Via in the Guard Traces to improve the current feedback path and consequently to suppress the far-end and near-end crosstalk.
In the measurement test it exploits 0.8mm think printed circuit board; the transmission Guard Trace is built from three equal length and equal width 50 Ω transmission lines, it follows the traditional rule of thumb with three times of the line width as the guard separation between the Aggression line and the Victim line. It measures the crosstalk with 1/2λ、1/4λ and 3/8λ as the Via spacing in the Guard Trace. It shows from measurement results that it has 10 dB improvement in the interference suppression than the traditional Guard Trace with 1/4λ and 3/8λ Via spacing. We also perform the measurements with 1/4λand 3/8λ Via spacing in the field wall environment it shows that it does not have any significant interference suppression in the near end crosstalk, however, it does have 3dB improvement in the far end crosstalk suppression and the signal integrity also improves when it passes through the channel.

摘要
目錄
表目錄
圖目錄
第一章 緒論
1.1 研究動機
1.2 章節介紹
第二章 傳輸線理論與串音干擾的關係
2.1 傳輸線理論
2.2 傳輸線反射與阻抗匹配
2.3 串音干擾的原因
2.4 串音干擾防治對策
2.4.1 使用3-w 分隔Trace法則
2.4.2 迴路結構
2.4.3 終端阻抗匹配
2.4.4 防護線
第三章 抑制串音干擾的設計結構與實驗結果
3.1 防護線的架構
3.2 貫孔距離的變化對近遠端串音干擾的影響
3.3 場牆貫孔距離變化對近遠端串音干擾的影響
第四章 結論與未來展望
4.1 研究心得
4.2 未來展望
參考文獻


[1]. 蔡政憲,吳霖堃,胡竹生, “Investigations of the Effect of the Guard Trace of Digital High-Speed on Board-level EMI”,國立交通大學電機學院 電機與控制學程碩士論文,2009年06月
[2].Kyoungho Lee, Hyun-Bae Lee, Hae-Kang Jung, Jae-Yoon Sim “A Serpentine Guard Trace to Reduce the Far-End Crosstalk Voltage and the Crosstalk Induced Timing Jitter of Parallel Microstrip Lines”, IEEE Transactions On Advanced Packaging, VOL. 31, NO. 4, November 2008
[3].W.-T. Huang, C.-H. Lu and D.-B. Lin, “Suppression Of Crosstalk Using Serpentineguard Trace Vias ” , Progress In Electromagnetics Research, Vol. 109, 37 61, 2010
[4]. Eric Bogatin, “Signal integrity :Simplified, Prentice Hall PTR”, September 15, 2003
[5]. 黃群富,蕭弘清,薛光華”Effects on Signal Integrity of Meander Line on High-Speed Digital Circuits”,國立臺灣科技大學 電機工程系碩士學位論文,2004年6月
[6].C.C.Chai, B.K.Chung, H.T.Chuah,” Simple Time-Domain Expressions For Prediction Of Crosstalk On Coupled Microstrip Line”, Progress In Electromagnetics Research, PIER 39, pp. 147–175, 2003
[7].W.-T. Huang, C.-H. Lu and D.-B. Lin,” The Optimal Number And Location Of Grounded Vias To Reduce Crosstalk”, Progress In Electromagnetics Research, PIER 95, pp. 241-266, 2009
[8].Chen H. and Zhang Y. X.,“A Synthetic Design Of Eliminating Crosstalk Within Mtls”, Progress In Electromagnetics Research, PIER 76, pp. 211–221, 2007.
[9].Wei-Da Guo, Guang-Hwa Shiue, Chien-Min Lin, Member, “Comparisons Between Serpentine and Flat Spiral Delay Lines on Transient Reflection/Transmission Waveforms and Eye Diagrams”, IEEE Transactions On Microwave Theory And Techniques, VOL. 54, NO. 4, April 2006
[10].Jing Zhou, Wei Gao, Baoxia Li, Qidong Wang, Xia Zhang, Liqiang Cao, Lixi Wan, “Ground Via Optimization on Substrate for High Speed Signal Transmission”, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, pp. 567-570, 16-19 Aug., 2010
[11]. Wei-Da Guo, Guang-Hwa Shiue, Chien-Min Lin, ”Comparisons Between Serpentine and Flat Spiral Delay Line on Transient Reflection/Transmission Waveforms and Eye Diagrams”, IEEE Transactions On Microwave Theory And Techniques, VOL. 54, NO. 4, APRIL 2006
[12]. Chun-Te Wu, Guang-Hwa Shue, Sheng-Mou Lin, Ruey-Beei Wu, ”Composite Effects of Reflections and Ground Bounce for Signal Line Through a Split Power Plane”, IEEE Transactions On Advanced Packaging, VOL. 25, NO. 2, MAY 2002
[13]. Mu-Shui Zhang, Yu-Shan Li, Chen Jia, and Li-Ping Li,” Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages Mu-Shui Zhang, Yu-Shan Li, Chen Jia, and”, IEEE Transactions On Microwave Theory And Techniques, VOL. 55, NO. 5, MAY 2007
[14]. P. Kirawanich, N. E. Islam, S. J. Yakura, “An Electromagnetic Toplogy Approach: Crosstalk Characterization Of The Unshielded Twisted-pair Cable”, Progress In Electromagnetics Research, PIER 58, 285–299, 2006F

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