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研究生:沈瑞華
研究生(外文):Ruei-Hua Shen
論文名稱:使用指叉型電容架構於完全切開地平面之耦合線間改善信號品質及遠端串音干擾
論文名稱(外文):The Improvement of Signal Quality and Far-End Crosstalk for Coupled Microstrip Line Over a Completely Split Ground by Using Interdigital Capacitor
指導教授:林丁丙林丁丙引用關係
口試委員:曾昭雄吳宗霖吳瑞北
口試日期:2012-07-24
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:電腦與通訊研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:中文
論文頁數:56
中文關鍵詞:串音干擾信號完整性指叉型電容短路貫穿孔
外文關鍵詞:CrosstalkSingal integrityShorting-viaInterdigital capacitor
相關次數:
  • 被引用被引用:0
  • 點閱點閱:373
  • 評分評分:
  • 下載下載:38
  • 收藏至我的研究室書目清單書目收藏:0
在現代高速數位信號傳輸時,常需要將接地面作多個區塊的分割,最嚴重的情形甚至是將接地面整個切割開來,然而以訊號完整性角度而言,切割開來的部份卻會造成嚴重的訊號品質破壞及串音干擾的問題,我們提出使用指叉型電容架構的設計,利用位移電容的特性,在不需額外增加製造成本的情況下改善訊號品質及抑制遠端串音干擾,根據實驗的結果可以看出使用指叉型電容器架構與未使用架構下,在時域中其訊號品質上改善29.87%;而遠端串音干擾抑制了8.87%,而在眼圖的量測中,在位元率6 Gbps情況下其眼高的改善為59%,眼寬則增加7%,由實驗結果證明,我們所提出的指叉型電容器架構能節省製造成本並達到訊號品質的增強及遠端串音干擾抑制的效果。

In the modern generation of digitally high-speed data transmission, multiple power level demands may be required. In the view of signal integrity, the worst case is to cut completely a slit on the ground plane during traces traversing over because the scenario like that will lead to serious signal quality and crosstalk problems. So here we proposed one new solution to improve signal quality and far-end crosstalk (FEXT) by using interdigital capacitor. The basic working principle of this structure is by the property of the displacement capacitor and needs no extra components. The experimental results indicated that our solution could improve signal quality and reduce FEXT by 29.87% and 8.87% in the time domain, respectively. And the result of eye diagram under 6 Gbps bit rate also showed the improvement of eye height 59% and eye width 7%. The statement above showed that our design requires no extra components to improve signal quality and reduce FEXT.

目 錄

摘要 i
英文摘要 ii
誌 謝 iv
目 錄 v
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 研究背景 1
1.2 研究目的 2
1.3 研究方法與流程 4
第二章 串音干擾 5
2.1 傳輸線的基本特性 5
2.2 微帶傳輸線 5
2.3 串音干擾 7
2.3.1 電容性串音干擾 8
2.3.2 電感性串音干擾 10
2.3.3 總效應 12
2.4 文獻探討 12
2.4.1 3-W法則 12
2.4.2 加入去耦合電容 14
第三章 指叉型電容架構 16
3.1 指叉型電容架構之頻域分析 22
3.2 最佳化之指叉型電容器設計 30
第四章 模擬與實測結果之比較 33
4.1 指叉型電容的架構圖與模擬環境 33
4.2 指叉型電容器的實測結果比較 40
4.3 指叉型電容器之眼圖量測 46
4.4 模型化 50
第五章 結論與未來展望 52
5.1 結論 52
5.2 未來展望 53
參考文獻 54



參考文獻

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