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研究生:Nguyen Van Cuong
研究生(外文):Nguyen Van Cuong
論文名稱:以超臨界二氧化碳混合電鍍液製備之電鍍鎳的機械性質研究
論文名稱(外文):Study on the mechanical properties of nickel coating electrodeposited in electrolyte mixed with supercritical carbon dioxide
指導教授:李春穎李春穎引用關係
指導教授(外文):Chun-Ying Lee
口試委員:林景崎張六文林 招松黃榮堂
口試委員(外文):Jing-Chie LinLiuwen ChangChao-Sung LinJung-Tang Huang
口試日期:2012-07-10
學位類別:博士
校院名稱:國立臺北科技大學
系所名稱:機電科技研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2012
畢業學年度:100
語文別:英文
論文頁數:102
中文關鍵詞:電鍍沉積超臨界二氧化碳內應力奈米晶鎳超臨界二氧化碳建壓二氧化碳氣泡後超臨界二氧化碳
外文關鍵詞:Electrodepositionsupercritical carbon dioxideinternal stressnano- crystalline nickelSc-CO2 chargingCO2 bubblepost Sc-CO2
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本論文研究在分別有、無混合超臨界二氧化碳的瓦特浴鍍液中進行各項控制參數下之鎳電鍍製程,由超臨界二氧化碳(Sc-CO2)輔助電鍍的試片分析與傳統電鍍試片進行機械性質比較,以研究超臨界二氧化碳在製程中所扮演之角色。探討不同微結構、結晶狀態電鍍層之內應內為本研究的重要研究任務之一。此外,發展所謂的後超臨界二氧化碳(post Sc-CO2)電鍍新製程技術也是本研究的重要貢獻。
實驗結果顯示,在超臨界二氧化碳電鍍的鎳鍍層比起傳統電鍍較有光亮平整和較高硬度的表面。然而,藉由穿透式電子顯微鏡(TEM)和原子力顯微鏡(AFM)的實驗中發現在超臨界二氧化碳電鍍鎳層中存在著奈米等級的針孔,而這些針孔就是在超臨界二氧化碳高壓環境下影響鍍層的內應力,這種結果造成了在超臨界二氧化碳電鍍鎳的試片內應力遠遠大過於傳統電鍍鎳的鍍層。研究中也發現了鎳鍍層的內應力與其晶粒尺寸和X光繞射量測之{200} /{111} 晶格優選方向峰值比值成反比關係。較小的晶粒尺寸,伴隨有較高{111}優選方位,導致高內應力的鍍層,反之亦然。本研究提出之理論模型考量晶粒尺寸和結晶的優選方向,其結果和不同實驗參數下製備的鍍層內應力量測結果有著相當的一致性。此外,在超臨界二氧化碳混和之電鍍液中加入了界面活性劑會提高鎳鍍層的內應力。然而,要有效的降低鍍層的內應力,可以藉由以下的四個方法來進行改善:提高電流密度、增加鍍液溫度、降低電鍍槽體壓力和在電鍍液中加入糖精(Saccharin)。
另外一方面,藉由後超臨界二氧化碳混合瓦特浴電鍍液之電鍍製程,可以獲得晶粒尺寸小於50 nm之鎳鍍層。後超臨界二氧化碳鎳鍍層具有大於650 Hv之硬度,但是比起超臨界二氧化碳電鍍鎳有明顯的下降且晶粒尺寸稍有變大,雖然如此,後超臨界環境下的電鍍層表面還是較光亮、平整,且在大氣中進行之後超臨界電鍍層,也在鍍層中量測碳原子的存在。顯然地,後超臨界二氧化碳電鍍鎳製程提供了一種新的超臨界電鍍方法,可以提供較大工件及連續電鍍在超臨界二氧化碳輔助下改善鍍層性質之可行性。最後,本論文提供如何進一步提高鎳鍍層的機械性質及促進新電鍍製程實用化之方法建議。


The electrodeposition of nickel film, with and without the mixing of supercritical carbon dioxide (Sc-CO2) in the Watts bath electrolyte, was performed in this work under various plating conditions. The specimens from Sc-CO2 assisted plating were then analyzed and the results were compared with their conventional counterparts for the discussion of the underlined mechanisms. A thorough study on the internal stress in deposited nickel film, its controlled mechanism and the relationship between crystalline structure and internal stress, was one of the important tasks of this study. A proposed new electroplating technique so-called post Sc-CO2 was the other useful contribution.
As the results, the Ni films plated in Sc-CO2 had brighter, smoother surface, smaller grains and higher hardness than that plated in conventional electrolyte without Sc-CO2. However, there existed more nano-sized pinholes observed by SEM, TEM and AFM measurements on the Sc-CO2 specimens. This special appearance affected coating properties under such a high pressure condition through the Sc-CO2 charging. The result showed that the internal stress in the nickel film plated through the Sc-CO2 method was significantly higher than that in the conventional one. A relationship was found that the internal stress of the Ni coating was inversely proportional to its grain size and the Ni{200}/Ni{111} peak fraction in the measured X-ray diffraction pattern. The smaller grain size, accompanied with higher Ni{111} texture, resulted in higher internal stress of the coating, and vice versa. A proposed theoretical model, which took both the grain size and preferred crystalline orientation into account, correlated closely with experimental results in the internal stress of the coatings prepared using different processes. The presence of surfactant in the Sc-CO2 electrolyte increased the internal stress of Ni coating. However, a reduction of internal stress was made possible by varying four factors: the raising of current density, the increasing of plating temperature, the lowering of plating pressure, and the addition of saccharin into electrolyte.
On the other hand, by using the post Sc-CO2 mixed electrolyte, the obtained nickel coating had the grain size in the range less than 50nm. The micro hardness of post Sc-CO2 nickel film was greater than 650 Hv. Both the grain size and hardness of the post Sc-CO2 specimen fall between its conventional and real Sc-CO2 counterparts. Moreover, the post Sc-CO2 specimen had bright, smooth, and uniform surface. The incorporation of C in Ni electrodeposit was also detected in the post Sc-CO2 coating, which had been plated under the atmospheric condition. Apparently, this new plating method presents a promising alternative to solve the issues associated with the requirement of large autoclave for big work-piece and the adaption to continuous electroplating for using supercritical plating method.
Finally, this work investigated how to further enhance the mechanical properties of the nickel deposited films as well as the facilitation of the electrodeposition via this new electroplating method. Some useful suggestions for designing Sc-CO2 electroplating system and configuring plating condition were also addressed.


摘要 i
Abstract iii
Acknowledgements iv
Contents v
List of Tables viii
List of Figures ix
Chapter 1 Introduction 1
Chapter 2 Background 3
2.1 Introduction 3
2.2 Supercritical carbon dioxide 3
2.3 Nickel 5
2.4 Electrodeposition 8
2.4.1 Fundamentals and terminologies 8
2.4.2 Electrodeposition using electrolyte mixed with Sc-CO2 11
2.4.3 Periodic plating characteristics 11
2.5 Internal stress in coatings 13
2.6 Literature review 14
2.7 Motivation of this study 18
Chapter 3 Experimentation 20
3.1 Introduction 20
3.2 Experiment details 21
3.2.1 Materials 21
3.2.2 Apparatus 23
3.2.3 Analyses 27
3.2.4 Grain size and micro hardness measurements 27
3.2.5 Internal stress measurement 28
Chapter 4 Mechanical properties of nickel electrodeposits 31
4.1 Introduction 31
4.2 Surface morphology 31
4.3 Crystal texture and microhardness 32
4.4 Effect of Boric acid on surface morphology and crystal orientation 35
4.5 Presence of nano-sized pinholes in deposit 38
4.6 Defects on nickel coating 46
Chapter 5 Internal stress in nickel coatings 48
5.1 Introduction 48
5.2 Internal stress of coating 48
5.3 Determination of Sc-CO2 recharge effect 51
5.4 The effects of plating pressure and temperature 54
5.5 The effect of plating current density 56
5.6 The effect of additives in the electrolyte 59
5.7 Relationship between crystallite structure and internal stress 61
Chapter 6 The post Sc-CO2 electroplating- A new technique 68
6.1 Introduction 68
6.2 Appratus and process procedure 70
6.2.1 Plating system 70
6.2.2 Evaluation of CO2 diffusing/releasing from electrolyte 72
6.2.3 Electroplating procedure 75
6.3 Surface morphology of nickel coating 76
6.3.1 Effects of duration of post Sc-CO2 electrolyte exposure 76
6.3.2 Effects of electrodeposition time 78
6.3.3 Comparison between different plating methods 79
6.3.4 Effects of Saccharin 82
6.4 Crystal structure and hardness 83
6.5 Incorporation of carbon in nickel coating 88
Chapter 7 Conclusions 91
7.1 Conclusions 91
7.2 Suggestions for future works 92
List of publications 94
Literature references 95
Nomenclatures 101


[1] Haruki, M., Yawata, H., Nishimoto, M., Tanto, M., Kihara, S. i., and Takishima, S., "Study on phase behaviors of supercritical CO2 including surfactant and water," Fluid Phase Equilibria, Vol. 261, No. 1-2, 2007, pp. 92-98.
[2] Yoshida, H., Sone, M., Mizushima, A., Abe, K., Tao, X. T., Ichihara, S., and Miyata, S., "Electroplating of nanostructured nickel in emulsion of supercritical carbon dioxide in electrolyte solution," Chemistry Letters, No. 11, 2002, pp. 1086-1087.
[3] Cabañas, A., Long, D. P., and Watkins, J. J., "Deposition of Gold Films and Nanostructures from Supercritical Carbon Dioxide," Chemistry of Materials, Vol. 16, No. 10, 2004, pp. 2028-2033.
[4] Shinoda, N., Shimizu, T., Chang, T. F. M., Shibata, A., and Sone, M., "Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles," Microelectronic Engineering, 2012, pp. (article inpress).
[5] http://en.wikipedia.org/wiki/Carbon_dioxide, June, 2012.
[6] http://www.chem1.com/acad/webtext/states/changes.html, June, 2012.
[7] Johns, K., and Stead, G., Supercritical Fluids for Coatings - from Analysis to Xenon Fluoropolymers 2, Springer US, 2002.
[8] Davis, J. R., and Committee, A. S. M. I. H., ASM specialty handbook : nickel, cobalt, and their alloys, ASM International, Materials Park, OH, 2000.
[9] Kuck, P. H., "Mineral Yearbook 2006: Nickel," United States Geological Survey, 2006.
[10] Chung, S. T., Huang, H. C., Pan, S. J., Tsai, W. T., Lee, P. Y., Yang, C. H., and Wu, M. B., "Material characterization and corrosion performance of nickel electroplated in supercritical CO2 fluid," Corrosion Science, Vol. 50, No. 9, 2008, pp. 2614-2619.
[11] Schlesinger, M., and Paunovic, M., Modern Electroplating, Wiley-Interscience, 2000.
[12] Dennis, J. K., and Such, T. E., Nickel and Chromium plating, Wiley, 1972.
[13] Yan, H., Sone, M., Mizushima, A., Nagai, T., Abe, K., Ichihara, S., and Miyata, S., "Electroplating in CO2-in-water and water-in-CO2 emulsions using a nickel electroplating solution with anionic fluorinated surfactant," Surface and Coatings Technology, Vol. 187, No. 1, 2004, pp. 86-92.
[14] Kim, W., and Weil, R., "Pulse plating effects in nickel electrodeposition," Surface and Coatings Technology, Vol. 38, No. 3, 1989, pp. 289-298.
[15] Chang, T. F. M., Sone, M., Shibata, A., Ishiyama, C., and Higo, Y., "Bright nickel film deposited by supercritical carbon dioxide emulsion using additive-free Watts bath," Electrochimica Acta, Vol. 55, No. 22, 2010, pp. 6469-6475.
[16] Vogt, H., "The Concentration Overpotential of Gas Evolving Electrodes as a Multiple Problem of Mass Transfer," Journal of the Electrochemical Society, Vol. 137, No. 4, 1990, pp. 1179-1184.
[17] Weil, R., "Origins of stress in electrodeposits-part I," Plating, Vol. 57, No. 12, 1970, pp. 1231-1237.
[18] Hong, K. M., Kim, M. S., and Chung, J. G., "Characteristics of a nickel film electroplated on a copper substrate in supercritical CO2," Journal of Industrial and Engineering Chemistry, Vol. 10, No. 4, 2004, pp. 683-689.
[19] Kim, M. S., Kim, J. Y., Kim, C. K., and Kim, N. K., "Study on the effect of temperature and pressure on nickel-electroplating characteristics in supercritical CO2," Chemosphere, Vol. 58, No. 4, 2005, pp. 459-465.
[20] Kim, M. S., and Kim, C. K., "Nickel electroplating on copper substrate in plating solution containing high-density CO2," Journal of Industrial and Engineering Chemistry, Vol. 11, No. 6, 2005, pp. 876-882.
[21] Chung, S. T., and Tsai, W. T., "Nanocrystalline Ni-C electrodeposits prepared in electrolytes containing supercritical carbon dioxide," Journal of the Electrochemical Society, Vol. 156, No. 11, 2009, pp. D457-D461.
[22] Yoshida, H., Sone, M., Mizushima, A., Yan, H., Wakabayashi, H., Abe, K., Tao, X. T., Ichihara, S., and Miyata, S., "Application of emulsion of dense carbon dioxide in electroplating solution with nonionic surfactants for nickel electroplating," Surface and Coatings Technology, Vol. 173, No. 2-3, 2003, pp. 285-292.
[23] Yoshida, H., Sone, M., Wakabayashi, H., Yan, H., Abe, K., Tao, X. T., Mizushima, A., Ichihara, S., and Miyata, S., "New electroplating method of nickel in emulsion of supercritical carbon dioxide and electroplating solution to enhance uniformity and hardness of plated film," Thin Solid Films, Vol. 446, No. 2, 2004, pp. 194-199.
[24] Wakabayashi, H., Sato, N., Sone, M., Takada, Y., Yan, H., Abe, K., Mizumoto, K., Ichihara, S., and Miyata, S., "Nano-grain structure of nickel films prepared by emulsion plating using dense carbon dioxide," Surface and Coatings Technology, Vol. 190, No. 2-3, 2005, pp. 200-205.
[25] Chang, T. F. M., and Sone, M., "Function and mechanism of supercritical carbon dioxide emulsified electrolyte in nickel electroplating reaction," Surface and Coatings Technology, Vol. 205, No. 13-14, 2011, pp. 3890-3899.
[26] Tsuru, Y., Nomura, M., and Foulkes, F. R., "Effects of chloride, bromide and iodide ions on internal stress in films deposited during high speed nickel electroplating from a nickel sulfamate bath," Journal of Applied Electrochemistry, Vol. 30, No. 2, 2000, pp. 231-238.
[27] Zhu, B., Asaro, R. J., Krysl, P., Zhang, K., and Weertman, J. R., "Effects of grain size distribution on the mechanical response of nanocrystalline metals: Part II," Acta Materialia, Vol. 54, No. 12, 2006, pp. 3307-3320.
[28] Saitou, M., Oshiro, S., and Sagawa, Y., "Scaling behavior of internal stress in electrodeposited nickel thin films," Journal of Applied Physics, Vol. 104, 2008, pp.
[29] Thompson, C. V., and Carel, R., "Stress and grain growth in thin films," Journal of the Mechanics and Physics of Solids, Vol. 44, No. 5, 1996, pp. 657-673.
[30] Tushinsky, L., Kovensky, I., Plokhov, A., Sindeyev, V., and Reshedko, P., Coated Metal: Structure and Properties of Metal Coating Compositions, Springer, 2002.
[31] Weil, R., "Origins of stress in electrodeposits-part II," Plating, Vol. 58, 1971, pp. 50-56.
[32] Weil, R., "Origins of stress in electrodeposits-part III," Plating, Vol. 58, 1971, pp. 137-146.
[33] Popov, K. I., Krstajić, N. V., and Popov, S. R., "Fundamental aspects of plating technology I: The determination of the optimum deposition current density," Surface Technology, Vol. 20, No. 3, 1983, pp. 199-202.
[34] El-Sherik, A. M., Erb, U., and Page, J., "Microstructural evolution in pulse plated nickel electrodeposits," Surf. Coat. Technol., Vol. 88, 1996, pp. 70-78.
[35] Adachi, H., Taki, K., Nagamine, S., Yusa, A., and Ohshima, M., "Supercritical carbon dioxide assisted electroless plating on thermoplastic polymers," The Journal of Supercritical Fluids, Vol. 49, No. 2, 2009, pp. 265-270.
[36] Chen, C.-Y., Lin, K.-Y., Tsai, W.-T., Chang, J.-K., and Tseng, C.-M., "Electroless deposition of Ni nanoparticles on carbon nanotubes with the aid of supercritical CO2 fluid and a synergistic hydrogen storage property of the composite," International Journal of Hydrogen Energy, Vol. 35, No. 11, 2010, pp. 5490-5497.
[37] Stangl, M., Lipták, M., Acker, J., Hoffmann, V., Baunack, S., and Wetzig, K., "Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines," Thin Solid Films, Vol. 517, No. 8, 2009, pp. 2687-2690.
[38] Rashidi, A. M., and Amadeh, A., "The effect of saccharin addition and bath temperature on the grain size of nanocrystalline nickel coatings," Surface and Coatings Technology, Vol. 204, No. 3, 2009, pp. 353-358.
[39] Chung, C. K., Chang, W. T., and Hung, S. T., "Electroplating of nickel films at ultra low electrolytic temperature," Microsystem Technologies, Vol. 16, No. 8-9, 2010, pp. 1353-1359.
[40] G. Richardson, B. S., "Comparative study of three internal stress measurement methods," Proc. AESF Symposium Proceedings, 1997 Electroforming Course and Symposium, pp. 21-29.
[41] http://rsbweb.nih.gov/ij/download.html, June, 2012.
[42] Costea, C., Duliu, O. G., Danis, A., and Szobotka, S., "SEM investigations of CR-39 and Mica-Muscotive solid state nuclear track detectors," Romanian Reports in Physics, Vol. 63, No. 1, 2011, pp. 86-94.
[43] Hearne, S. J., and Floro, J. A., "Mechanisms inducing compressive stress during electrodeposition of Ni," J. Appl. Phys., Vol. 97, 2005, pp. 0149011-0149016.
[44] Janssen, G. C. A. M., Abdalla, M. M., van Keulen, F., Pujada, B. R., and van Venrooy, B., "Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers," Thin Solid Films, Vol. 517, No. 6, 2009, pp. 1858-1867.
[45] Klein, C. A., "How accurate are Stoney''s equation and recent modifications," Journal of Applied Physics, Vol. 88, No. 9, 2000, pp. 5487-5489.
[46] Meyers, M. A., and Chawla, K. K., Mechanical Behavior of Materials Prentice Hall, New Jersey, US, 1999.
[47] Tsuru, Y., Nomura, M., and Foulkes, F. R., "Effects of boric acid on hydrogen evolution and internal stress in films deposited from a nickel sulfamate bath," Journal of Applied Electrochemistry, Vol. 32, No. 6, 2002, pp. 629-634.
[48] Hoare, J. P., "On the role of bocric acid in the Watts bath," Journal of the Electrochemical Society, Vol. 133, No. 12, 1986, pp. 2491-2494.
[49] Wofford, W. T., Gloyna, E. F., and Johnston, K. P., "Boric acid equilibria in near-critical and supercritical water," Journal Name: Industrial and Engineering Chemistry Research; Journal Volume: 37; Journal Issue: 5; Other Information: PBD: May 1998, 1998, pp. Medium: X; Size: pp. 2045-2051.
[50] Wu, Y., Chang, D., Kim, D., and Kwon, S.-C., "Influence of boric acid on the electrodepositing process and structures of Ni–W alloy coating," Surface and Coatings Technology, Vol. 173, No. 2–3, 2003, pp. 259-264.
[51] Nakahara, S., "Microscopic mechanism of the hydrogen effect on the ductility of electroless copper," Acta Metallurgica, Vol. 36, No. 7, 1988, pp. 1669-1681.
[52] Dalla Torre, F., Van Swygenhoven, H., and Victoria, M., "Nanocrystalline electrodeposited Ni: Microstructure and tensile properties," Acta Materialia, Vol. 50, No. 15, 2002, pp. 3957-3970.
[53] Dhanuka, V. V., Dickson, J. L., Ryoo, W., and Johnston, K. P., "High internal phase CO2-in-water emulsions stabilized with a branched nonionic hydrocarbon surfactant," Journal of Colloid and Interface Science, Vol. 298, No. 1, 2006, pp. 406-418.
[54] Budevski, E., Staikov, G., and Lorenz, W. J., "Electrocrystallization Nucleation and growth phenomena," Electrochimica Acta, Vol. 45, No. 15-16, 2000, pp. 2559-2574.
[55] Chung, C. K., Chang, W. T., Chen, C. F., and Liao, M. W., "Effect of temperature on the evolution of diffusivity, microstructure and hardness of nanocrystalline nickel films electrodeposited at low temperatures," Materials Letters, Vol. 65, No. 3, 2011, pp. 416-419.
[56] Thompson, C. V., "Structure evolution during processing of polycrystalline films," Annual Review of Materials Science, Vol. 30, 2000, pp. 159-190.
[57] Natter, H., and Hempelmann, R., "Nanocrystalline metals prepared by electrodeposition," Zeitschrift fur Physikalische Chemie, Vol. 222, No. 2-3, 2008, pp. 319-354.
[58] Natter, H., Schmelzer, M., and Hempelmann, R., "Nanocrystalline nickel and nickel-copper-alloys: Synthesis, characterization, and thermal stability," Journal of Materials Research, Vol. 13, No. 5, 1998, pp. 1186-1197.
[59] Kang, J. X., Zhao, W. Z., and Zhang, G. F., "Influence of electrodeposition parameters on the deposition rate and microhardness of nanocrystalline Ni coatings," Surface and Coatings Technology, Vol. 203, No. 13, 2009, pp. 1815-1818.
[60] Moti, E., Shariat, M. H., and Bahrololoom, M. E., "Influence of cathodic overpotential on grain size in nanocrystalline nickel deposition on rotating cylinder electrodes," Journal of Applied Electrochemistry, Vol. 38, No. 5, 2008, pp. 605-612.
[61] Eigeldinger, J., and Vogt, H., "The bubble coverage of gas-evolving electrodes in a flowing electrolyte," Electrochimica Acta, Vol. 45, No. 27, 2000, pp. 4449-4456.
[62] Kim, S. H., Sohn, H. J., Joo, Y. C., Kim, Y. W., Yim, T. H., Lee, H. Y., and Kang, T., "Effect of saccharin addition on the microstructure of electrodeposited Fe-36 wt.% Ni alloy," Surface and Coatings Technology, Vol. 199, No. 1, 2005, pp. 43-48.
[63] Armyanov, S., and Sotirova-Chakarova, G., "Hydrogen desorption and internal stress in nickel coatings obtained by periodic electrodeposition," Journal of the Electrochemical Society, Vol. 139, No. 12, 1992, pp. 3454-3457.
[64] Hoffman, R. W., "Stresses in thin films: The relevance of grain boundaries and impurities," Thin Solid Films, Vol. 34, No. 2, 1976, pp. 185-190.
[65] Nix, W. D., and Clemens, B. M., "Crystallite coalescence: A mechanism for intrinsic tensile stresses in thin films," Journal of Materials Research, Vol. 14, No. 8, 1999, pp. 3467-3473.
[66] Raghunathan, K., and Weil, R., "The effects of some plating variables on the structure of thin nickel electrodeposits," Surface Technology, Vol. 10, No. 5, 1980, pp. 331-342.
[67] Seel, S. C., Thompson, C. V., Hearne, S. J., and Floro, J. A., "Tensile stress evolution during deposition of Volmer-Weber thin films," Journal of Applied Physics, Vol. 88, No. 12, 2000, pp. 7079-7088.
[68] Czerwinski, F., "Grain size-internal stress relationship in iron-nickel alloy electrodeposits," Journal of the Electrochemical Society, Vol. 143, No. 10, 1996, pp. 3327-3332.
[69] Rahman, M. Z., Sone, M., Eguchi, M., Ikeda, K., Miyata, S., and Yamamoto, T., "Hardness and Young''s modulus of Nickel coating produced from emulsion of Sc-CO2 estimated by nanoindentation," Proc. International Conference on Mechanical Engineering, 2005, pp. 28-23.
[70] Chang, L., Chen, C. H., and Fang, H., "Electrodeposition of Ni P alloys from a Sulfamate electrolyte relationship between bath pH and Structural characteristics," Journal of the Electrochemical Society, 2008, pp. D57-D61.
[71] Kim, S. P., Choi, H. M., and Choi, S. K., "A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering," Thin Solid Films, Vol. 322, No. 1-2, 1998, pp. 298-302.
[72] Lin, C. S., Lee, C. Y., Chen, F. J., and Li, W. C., "Structural evolution and internal stress of nickel-phosphorus electrodeposits," Journal of the Electrochemical Society, Vol. 152, No. 6, 2005, pp. C370-C375.
[73] Huang, Y. Y., Zhou, Y. C., and Pan, Y., "Effects of hydrogen adsorption on the surface-energy anisotropy of nickel," Physica B: Condensed Matter, Vol. 405, No. 5, 2010, pp. 1335-1338.
[74] Vitos, L., Ruban, A. V., Skriver, H. L., and Kollár, J., "The surface energy of metals," Surface Science, Vol. 411, No. 1-2, 1998, pp. 186-202.
[75] Snabre, P., and Magnifotcham, F., "Formation and rise of a bubble stream in a viscous liquid," The European Physical Journal B - Condensed Matter and Complex Systems, Vol. 4, No. 3, 1998, pp. 369-377.
[76] Epstein, P. S., and Plesset, M. S., "On the Stability of Gas Bubbles in Liquid-Gas Solutions " Journal of Chemical Physics, Vol. 18, No. 11, 1950, pp. 1505-1509.
[77] Craig, V. S. J., "Bubble coalescence and specific-ion effects," Current Opinion in Colloid and Interface Science, Vol. 9, No. 1-2, 2004, pp. 178-184.
[78] Lessard, R. R., and Zieminski, S. A., "Bubble Coalescence and Gas Transfer in Aqueous Electrolytic Solutions," Industrial & Engineering Chemistry Fundamentals, Vol. 10, No. 2, 1971, pp. 260-269.
[79] Ribeiro Jr, C. P., and Mewes, D., "The effect of electrolytes on the critical velocity for bubble coalescence," Chemical Engineering Journal, Vol. 126, No. 1, 2007, pp. 23-33.
[80] Holmes, J. D., Ziegler, K. J., Audriani, M., Lee, C. T., Bhargava, P. A., Steytler, D. C., and Johnston, K. P., "Buffering the Aqueous Phase pH in Water-in-CO2 Microemulsions," The Journal of Physical Chemistry B, Vol. 103, No. 27, 1999, pp. 5703-5711.
[81] Shoda, M., and Ishikawa, Y., "Carbon dioxide sensor for fermentation systems," Biotechnology and Bioengineering, Vol. 23, 1981, pp. 461-466.


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