臺灣博碩士論文加值系統

隨著半導體元件朝著輕薄短小的趨勢下，元件構裝的散熱問題和熱應力問題也日益受到重視。構裝體在經過製造、測試及操作時，由於溫度及熱膨脹係數的不同，造成材料之間產生熱應力，這些問題對電子構裝產品而言都是需要努力去克服的。
本文利用有限元素數值模擬來分析充電器中傳統高功率二極體構裝在作用中產生的散熱特性及熱應力，採用工具則是ANSYS 13.0商業化軟體。因印刷電路板(Printed Circuit Board；PCB)結構十分複雜，為了能夠快速模擬計算其應力值，所以利用等效材料特性方程式先簡化了PCB之結構為等效材料；而整體模擬中的邊界條件則是由實驗所量測的溫度經過疊代所計算得知，並擷取充電器中高功率二極體構裝下印刷電路板之溫度和位移作為局部模擬的邊界條件。接著將構裝體詳細的內部結構建模作局部模擬分析，而後採用Z公司的新型高功率二極體構裝取代原來傳統高功率二極體構裝，並與原先的傳統構裝體作熱阻值及晶片應力分析比較。模擬結果發現新型高功率二極體構裝在熱阻值和晶片應力的表現較優於傳統高功率二極體構裝，因此可讓產品提昇可靠度。

As the trend of the semiconductor components was developed toward smaller and lighter, the thermal and thermo-stress problems on microelectronic packaging increase at the same time. Consequently, stresses are generated between the material in a packaging structure due to the differences on temperature distributions and the thermal expansion coefficient during manufacturing, testing and operation, and the problems need to be overcome for the packaging products.
This thesis uses the commercial ANSYS 13.0 finite element software to analyse the thermal and thermo-stress characteristics on high power diode packaging inside a typical power adapter. To this end, the equivalent equations to simplify the PCB(printed circuit board) material were first employed since the PCB structure is very complex. The global simulation were next performed with boundary conditions derived from iterations and verified through the comparisons with temperature measurements, and the temperature and displacement results on the PCB were then retrieved as the boundary conditions for the followed local simulations. Finally, The local models were built for both traditional diode packaging and the newly developed packaging with structure details, and thermal resistances and thermo-stresses on the models were next simulated. The results in this study shows that the newly designed packaging has better thermal resistance and smaller chip stresses than the traditional ones. Therefore, better reliability on the new packaging was verified through this work.

誌謝 ii
摘要 iii
ABSTRACT iv
目錄 v
表目錄 viii
圖目錄 ix
符號說明 xiii
1.緒論 1
1.1前言 1
1.2高功率二極體及其構裝 1
1.3研究動機與目的 3
1.4文獻回顧 3
1.5研究架構 5
2.理論分析 6
2.1熱分析 6
2.1.1傳導 6
2.1.2對流 7
2.1.3輻射 9
2.1.4熱平衡方程式 9
2.2熱應力理論分析 11
2.3等效材料分析 18
3.實驗規劃 25
3.1充電器規格介紹 25
3.2實驗儀器說明介紹 26
3.2.1溫度控制器 26
3.2.2數位電表 27
3.2.3負載台 28
3.2.4熱外線偵測儀 29
3.2.5實驗器材架設 30
3.3實驗流程 31
3.4實驗結果 31
4.研究流程與模型之建立 39
4.1研究流程 39
4.2模型之建立 41
4.2.1基本假設 41
4.2.2構裝體3D模型之建立 41
5.模擬分析結果與討論 53
5.1材料性質與邊界條件 53
5.2整體模擬分析 56
5.3局部模擬分析及比較 63
5.3.1溫度局部模擬結果 63
5.3.2應力局部模擬結果 76
6.結論與未來展望 87
6.1結論 87
6.2未來展望 87
參考文獻 89
論文發表 93
自傳 94

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