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研究生:紀彥廷
論文名稱:電鍍銅添加劑劣化變因與耐用性之研究
論文名稱(外文):Study of degrading factors and working life of additives in copper electroplating
指導教授:袁維勵
指導教授(外文):Wei-Li Yuan
口試委員:許健興翁于晴
口試委員(外文):Chien-Hsing HsuYu-Ching Weng
口試日期:2013-07-19
學位類別:碩士
校院名稱:逢甲大學
系所名稱:化學工程學系
學門:工程學門
學類:化學工程學類
論文種類:學術論文
論文出版年:2013
畢業學年度:101
語文別:中文
論文頁數:72
中文關鍵詞:不溶性陽極氧化還原電位光澤劑
外文關鍵詞:insoluble anodeoxidation-reduction potentialbrightener
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  • 被引用被引用:1
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本論文主要研究使用不溶性陽極(氧化銥)電鍍時,會使電鍍液中的光澤劑產生大量消耗之問題。同時,我們使用可溶性陽極(磷銅)作為對照組觀察電鍍時兩者間之差異。利用氧化還原電位計監控在陰極附近電鍍液之氧化還原電位。結果發現電解液中的氧化還原電位皆有隨時間下降之趨勢,然而使用磷銅陽極電鍍時,因僅僅產生微量之氧氣,其氧化還原電位下降速率較為緩慢。故我們推測氧化銥陽極所產生之大量氧氣為消耗光澤劑的主要原因。
欲解決光澤劑被快速損耗之問題,實驗中將陽極包覆濾袋使形成的氧氣泡易於匯聚並上浮離開鍍液,從而減少氧氣溶入鍍液中以延長工作壽命。結果顯示透氣度最低之濾袋可以將工作壽命延長兩個小時以上。不過,該工時與使用可溶性陽極者仍相差甚遠。我們進一步在不溶性陽極與濾袋間流通氮氣藉以加速移除氧氣,可再延長鍍液大約20%的工作壽命,且氧化還原電位隨時間之下降也發現有趨於平緩的現象。
The thesis investigated the problem of large consumption of brightener during electroplating using an insoluble anode (iridium oxide). Meanwhile, we used a soluble anode (phosphorus copper) as a control to compare the differences in plating between the two kinds of anode. An oxidation-reduction potential meter was used to monitor the oxidation-reduction potential of the plating solution around the cathode. Results show that the oxidation-reduction potential of the electrolyte decreased with time for both anodes while the rate of decrease was slower for the phosphorus copper anode because only a small amount of oxygen was produced. Hence the large amount of oxygen generated by the iridium oxide anode was considered the main factor to consume the brightener.
To solve the problem of brightener being quickly consumed, a bag was used to wrap the anode for the formed oxygen bubbles to merge easily and to float up and leave the plating solution, reducing the dissolution of oxygen into the plating solution and extending the working life. Results show that the working life could be extended by more than two hours by using the anode bag with the lowest permeability of gas. By flowing nitrogen between the insoluble anode and the bag to expedite the removal of oxygen, the working life of the plating solution could be extended again by about 20% with a curve more leveled off of oxidation-reduction potential against time.
總目錄 iv
圖目錄 vii
表目錄 ix

第一章 緒論 1
1.1前言 1
1.2印刷電路板製程簡介 1
1.3印刷電路板的種類 4
1.3.1單面印刷電路板 4
1.3.2雙面印刷電路板 5
1.3.3多層印刷電路板 6
1.3.4軟性印刷電路板 7
1.4研究動機 8
第二章 文獻回顧 9
2.1電鍍基礎 9
2.1.1電鍍原理 9
2.1.2法拉第定律 10
2.1.3鍍銅的演進 11
2.1.4分佈力(throwing power) 12
2.2影響鍍銅之要素 13
2.2.1電流密度(current density) 13
2.2.2電鍍槽液基本組成 14
2.2.3陽極型態(anode type) 15
2.2.4電源供應方式(power supply) 17
2.3電鍍添加劑的種類與介紹 18
2.3.1光澤劑(brightener) 19
2.3.2平整劑(leveler) 21
2.3.3載運劑(carrier) 22
2.4極化現象 23
2.4.1活性極化 23
2.4.2濃度極化 23
2.4.3電阻極化 24
第三章 實驗方法 25
3.1實驗藥品 25
3.2實驗儀器 26
3.3實驗步驟 28
3.3.1電鍍槽液配製 28
3.3.2槽液濃度分析 28
3.3.3電鍍步驟 29
第四章 結果與討論 33
4.1不溶性陽極與可溶性陽極對光澤劑之消耗 33
4.2使用透氣度不同之濾袋改善光澤劑壽命 36
4.3不同電流密度與氧化還原電位之關係 40
4.4氧化還原電位與鍍液中各成分之關係 42
4.5填充氮氣改善光澤劑作用時間 45
第五章 結論 50
參考文獻 52
附錄 56
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