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研究生:葉湘貽
研究生(外文):Hsiang-Yi Yeh
論文名稱:環境溫度對高功率白光LED 模組壽命影響之研究
論文名稱(外文):The Effect of Lifetime to the High Power White LED Module by Ambient Temperature Differences
指導教授:朱紹舒
指導教授(外文):Shao-Shu Chu
口試委員:姜庭隆徐榮昌
口試委員(外文):Ting-Lung ChiangJung-Chang Hsu
口試日期:2013-06-06
學位類別:碩士
校院名稱:崑山科技大學
系所名稱:機械工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2013
畢業學年度:101
語文別:中文
論文頁數:88
中文關鍵詞:發光二極體環境溫度壽命預估光衰
外文關鍵詞:light emitting diodeambient temperaturelifetime estimatedlight decay
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高功率發光二極體(Light Emitting Diode, LED)被稱為第四代照明光源,LED具有壽命長、體積小、重量輕、反應速度快、抗震性能好、結構簡單、節能環保等優點,在指示燈、信號燈、顯示幕、景觀照明等領域得到了廣泛的應用。但由於LED 在實際應用中出現了許多可靠性的問題,阻礙了LED的大規模應用,因此,LED 可靠性的問題正受到日益廣泛的關注和研究。引起LED 可靠性問題的主要原因是LED 技術還不成熟,很多結構設計、材料選擇和加工上的缺陷。在實際使用中一旦遇到惡劣的環境,這些缺陷就會被放大,使LED 提早失效。隨著發光效率與可靠度不斷的提升,LED研發重點由原先LED 元件發展,已逐漸轉向LED 模組構裝技術可靠度之研發。
  本論文主要從長時間和不同環境溫度使用下對LED模組可靠性的影響、失效分析等方面的進行探討。本研究使用三顆高功率LED以陣列串聯排列,鋁基板(MCPCB)佈線並結合相同散熱器構裝成為標準測試模組進行研究。針對該模組施予額定電流,並控制不同環境溫度35~85C之狀態下進行長時間量測,紀錄模組溫度變化與光衰現象;光學量測顯示高功率LED在高溫的環境溫度下,流明輸出強度有明顯的衰減,在1,000小時的量測中顯示模組最大光衰僅約22%,晶片接面溫度卻已趨近於晶片承受規範之最大工作溫度附近。應用外插法推算LED光衰,在最大環境工作溫度下,當其壽命值約50,000小時光衰達30%,可預測LED模組在實際運作下之接面溫度。然而高溫環境中LED接面溫度都偏高,高溫環境條件下模組失效、壽命或是光強度衰減是可預期的。

High power light emitting diode is referred to as the fourth generation light source. LEDs has a long life, small size, light weight, response fast, structural simple, energy saving, and environmental friendly. They have been widely used such as indicator lights, display screen, landscape lighting, and other lighting fields. In fact, the using of LEDs has been appeared in several reliability problems, which could be impeded to the future applications. Thus, the reliability of LEDs is became an issue that was brought in attention and lead to investigate their characteristics by researchers. Technically, they are mainly due to the imperfect manufacturing process, inherent structural design, material selections, and component defects. When LEDs were subjected to a harsh environment, those defects could be amplified and then it eventually will result to failure. With the luminous efficiency and reliability of LEDs are continuously improved, the research is focus from the component development of LED then turned to the reliability of LED module packaged.
  In this study, the uses of longtime tests under varying ambient temperatures are subjected on the LED module; therefore, their reliability, failure analysis, and other aspects are discussed. Three high power LED array are arranged in series on metal composite plate circuit board(MCPCB) that is conducted with the same heat sink and is defined as the standard test module. The module is supplied for a constant current, and the ambient temperatures are controlled in the range of 35~85C. For a longtime test, a data log system was continuously monitored the temperature variations and the lumen output. The results show high power LED module within a high temperature environment will cause the decaying of lumen intensity at the maximum 22% after 1,000 hours test. The junction temperature is already reached over the maximum operating temperature base on the manufacturer’s specification. Extrapolating method is applied to estimate LED failure in this study. When the maximum operating ambient temperature is selected for test, the lifetime of LED module is estimated to 50,000 hours after their lighting output is decaying to 30% of original lumen intensity.

中文摘要 i
英文摘要 iii
誌 謝 v
目 錄 vi
表 目 錄 ix
圖 目 錄 x
第一章 緒論 1
1.1 前言 1
1.2 文獻回顧 3
1.3 研究動機 8
1.4 論文架構 9
第二章 高功率白光LED概述 10
2.1 LED 背景 10
2.2 LED發光機制與構造 13
2.3 白光LED發光原理 17
2.3.1 白光LED發光方式 17
2.3.2 螢光粉發光原理 20
2.4 白光LED應用 23
2.5 LED熱傳途徑 26
2.6 LED失效模式 30
第三章 實驗設備與壽命預估量測方法 34
3.1 實驗流程與架構 34
3.2 實驗設備 35
3.2.1 分光輻射照度計 35
3.2.2 紅外線高溫計 36
3.2.3 溫度擷取設備 37
3.2.4 單通道直流手動控制電源 37
3.2.5 恆溫設備 38
3.3 實驗模組 39
3.3.1 高功率LED 39
3.3.2 金屬電路板 40
3.3.3 散熱鰭片 42
3.3.4 LED標準模組 42
第四章 實驗結果與討論 44
第五章 結論 60
參 考 文 獻 62
簡 歷 68
發表文章 70

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