臺灣博碩士論文加值系統

電子與3C資訊等產品之發展趨勢，已完全走向「輕、薄、短、小」的設計理念，產品的設計，強調產品的可攜性與輕便性，使得預防成品翹曲變形益顯重要，而射出成形過程中的殘留應力為其主要成因。
本論文研究之主要目的在研究Webcam後蓋射出產品的翹曲變形與殘留應力之關係，透過CAE分析軟體及田口法實驗方式，尋求最佳射出成條件，解決產品因翹曲所造成的問題點，進而提升產品的良率，確保其使用性及功能性，進而達到節約成本的目的。
研究在不同的熔膠溫度、模具溫度、保壓壓力和射出速率的製程參數下，對翹曲變形及殘留應力的影響做一研究與討論。研究中使用了以Moldflow做模擬，並和實際射出塑件做一比較。使用田口法實驗設計方法，有系統的減少了實驗的次數來進行製程參數的研究。實驗結果顯示，升高保壓壓力及熔膠溫度有助減少翹曲變形；其中，保壓壓力為最具影響力的因子。在殘留應力實驗上則以光彈法的觀察做一研究與討論。實驗結果顯示，升高保壓壓力及模具溫度有助於降低殘留應力；其中，保壓壓力為最具影響力的因子。當塑件內部殘留應力降低時其翹曲變形量亦隨之降低，兩者成一正比例關係。而保壓壓力為兩者共同之重要控制因子。

The development of electronic and communication products are in a revolution toward light、thin、short and small. The improvement of the manufacturing technique for plastics is becoming important. Warpage induced by residual stresses is the common defect of an injection molded products.
The major purpose of study investigate the relation between warpage and residual stress at injection molding stage. Both simulations using by CAE analysis application and Taguchi experiments method to find the best of molding condition for the warpage and residual stress reduced， to enhance the product yield rate and ensure its exercise and function are confidence， and also reduce our development term to save schedule and
cost.
Study on warpage and residual stress with different melt temperature， mold temperature， packing pressure and injection rate. Simulations using Moldflow application and its result compared with real injection samples. Taguchi experiments using is systematic and available to reduce the experiments times for performed the injection parameters simulations. It was shown that higher packing pressure and higher melt temperature could minimize the warpage. Especially，the packing pressure is the most effect factor for the warpage. The residual stresses measurement using the Photoelastic Method to make a trend discussion. It was shown that higher packing pressure and higher mold temperature could minimize the residual stresses. Especially，the packing pressure is the most effect factor for the residual stresses.
The warpage decreaes when the inner residual stresses is reduced，they into a directly proportional relationship between the residual stresses and the warpage. Especially，the packing pressure is the most common effect factor for the both.

目 錄

中文摘要--------------------------------------------------------- i
英文摘要--------------------------------------------------------- ii
誌謝---------------------------------------------------------------- iv
目錄---------------------------------------------------------------- v
表目錄------------------------------------------------------------- viii
圖目錄------------------------------------------------------------- x
第一章、緒論--------------------------------------------------- 1
1.1前言----------------------------------------------------------- 1
1.2射出成形簡介---------------------------------------------- 2
1.3文獻回顧---------------------------------------------------- 5
1.4研究動機與目標------------------------------------------- 9
1.5研究方法----------------------------------------------------- 9
1.6論文架構----------------------------------------------------- 12
第二章、實驗設備、材料與量測方法------------------- 13
2.1實驗設備----------------------------------------------------- 13
2.1.1射出成形機----------------------------------------------- 13
2.1.2模溫控制機----------------------------------------------- 15
2.2.3乾燥機------------------------------------------------------ 16
2.2.4實驗模具-------------------------------------------------- 18
2.2實驗材料---------------------------------------------------- 20
2.2.1聚碳酸酯(PC)-------------------------------------------- 20
2.3量測方法---------------------------------------------------- 23
2.3.1量測儀器簡介------------------------------------------- 23
2.3.2台灣科盛公司之應力偏光儀------------------------ 25
2.3.3多功能光彈儀 ---------------------------------------- 27
2.4量測方法說明--------------------------------------------- 28
2.4.1翹曲變形量測-------------------------------------------- 28
2.4.2翹曲變形影像量測儀(Venture CNC 3030)量測示意圖
----------------------------------------------------------------------- 33
2.4.3殘留應力之觀察及量測 ----------------------------- 34
第三章、理論簡介與分析----------------------------------- 35
3.1田口氏實驗計劃法---------------------------------------- 35
3.1.1簡介--------------------------------------------------------- 35
3.1.2田口方法的步驟----------------------------------------- 36
3.1.3變異數分析(Analysis Of Variance，ANOVA)----- 38
3.1.4本文所使用田口方法架構介紹--------------------- 39
3.1.4.1選定品質特性----------------------------------------- 39
3.1.4.2判定品質特性的理想機能------------------------- 40
3.1.4.3選擇控制因子和直交表---------------------------- 41
3.2殘留應力的量測─光彈實驗法----------------------- 44
3.2.1光彈法原理簡介---------------------------------------- 44
3.2.2自然光與偏振光---------------------------------------- 45
3.2.3雙折射(Birefringence)---------------------------------- 47
3.2.4光-應力定律(Stress-Optical Law)------------------- 49
3.2.5剪應力差積分法(Shear-Difference Method)---- 50
3.2.6平片偏光場光彈分析---------------------------------- 51
3.2.7圓偏光場光彈分析------------------------------------- 53
3.3實驗步驟----------------------------------------------------- 56
第四章、結果與討論----------------------------------------- 59
4.1翹曲變形研究---------------------------------------------- 59
4.1.1電腦模擬部分-------------------------------------------- 59
4.1.2射出實驗部份-------------------------------------------- 65
4.1.3田口確認實驗及討論---------------------------------- 70
4.1.3.1最佳控制因子及確認-------------------------------- 70
4.1.3.2田口法實驗之翹曲變形討論---------------------- 71
4.1.4變異數分析結果(ANOVA)----------------------------- 74
4.1.4.1電腦模擬ӯ品質特性變異數分析結果-------- 74
4.1.4.2實際射出ӯ品質特性變異數分析結果-------- 76
4.2殘留應力研究----------------------------------------------- 78
4.2.1電腦模擬部分-------------------------------------------- 80
4.2.2光彈實驗部分-------------------------------------------- 86
4.2.3田口確認實驗及討論---------------------------------- 112
4.2.3.1最佳控制因子及確認------------------------------- 112
4.2.3.2殘留應力討論----------------------------------------- 114
4.2.4變異數分析結果(ANOVA)----------------------------- 120
4.2.4.1電腦模擬S/N 比變異數分析結果--------------- 120
4.2.4.2光彈實驗S/N 比變異數分析結果--------------- 122
4.3翹曲變形與殘留應力討論------------------------------ 123
第五章、結論與建議----------------------------------------- 127
5.1結論----------------------------------------------------------- 127
5.2建議----------------------------------------------------------- 130
參考文獻---------------------------------------------------------- 131
作者簡介---------------------------------------------------------- 133

參考文獻

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