臺灣博碩士論文加值系統

現今電子IC封裝的製程中，封膠是保護晶片穩定性一個非常重要的過程，封膠材料(Epoxy Molding Compound, EMC)於熟化成型的過程(Curing process)中與封裝機台的模具表面產生黏著之現象，稱為黏著效應(Adhesion effects)。當黏著效應過大，會影響IC成品在脫離模具的過程中產生缺角、表面不平整…等等的表面破壞，而導致封膠失敗、生產效率降低與可靠度(Reliability)不佳…等結果，因此，如何利用特殊的表面處理(Surface treatment)、鍍層(Coating)以及熱處理(Heat treatment)…等方式，加以有效率地降低因黏著效應在模具表面及試片表面所產生的黏模力(Adhesion force)，是產業界及研究單位現在與未來所重視的主要發展課題。
本研究是利用本實驗室自行研究完成的自動化電子封裝黏模力檢測設備與量測技術，在過往本實驗室的研究中，皆沒有探討量測試片表面鍍層的熱穩定性，在本研究中將試片做完鍍層之後，會探討預氧化處理在不同鍍層時所產生的表面氧化物，並觀察其氧化處理前後(即熱處理前後)的影響，同時將當今業界封裝模具常用的Cr系列鍍層與高溫模具常用的Ti系列鍍層使用於封裝模具的黏著效應之穩定性加以比較，亦會觀察當今光學鏡頭用的模造玻璃常使用的Ni系列鍍層，其熱穩定性於封裝製程的製程溫度時是否仍然穩定，觀察其黏著效應，進行黏模力測試。
最後，本論文針對預氧化處理前後的試片，進行四百模次的黏著效應實驗，觀察黏模力的變化趨勢，透過線性迴歸分析(Linear regression)將實驗數據擬合出一條黏模力特性曲線(Characteristic curve)，分別將每組實驗所擬合出的特性曲線進行比對，了解在預氧化處理前後以及不同鍍層時所產生的表面氧化層對於封膠材料的黏著影響程度，用以判斷出最佳的清模時機，以及這些鍍層是否能有效地降低因黏著效應所產生的不良影響。

Potting compound plays a crucial role in maintaining the stability of chip while packaging the electronic integrated circuit (IC). During the process of curing, the phenomenon of Epoxy Molding Compound (EMC) adhering to the surface of packaging molds is called adhesion effects. However, overreaction of the effect during mold releasing causes damages to the surface of IC products, including defective edge and uneven surface, which might result in the failure of packaging, low efficiency, and low reliability. Therefore, how to efficiently cut down the adhesion force between the surface of molds and specimen with special surface treatment, such as coating and heat treatment, has been emphasized and regarded as an important issue for academic research and industrial institutions.
In the present study, automatic electronic packaging testing equipment and measuring technique made in our laboratory are used to examine the adhesion force. Previous studies failed to explore and measure the heat stability of the chips coating. Therefore, after coating the chips, this research aims to: 1. investigate surface oxide created in different coating and observe the effect before and after the Pre-Oxidation treatment; 2. compare stability of adhesion effect between two different kinds of coating, including T-series coating commonly used in industrial community and Ti-series coating commonly used for molds with high heat; and 3. observe and test the heat stability and adhesion effect of the Ni-series coating commonly used for the molding glass of optical lens to see the stability under the temperature of packaging.
Finally, the adhesion effect experiments on speciemen’s pre-oxidation treatment for 400 shots are carried out to observe the changing trends of adhesion force. Through the anaysis of linear regression, the results of the characteristic curve of eah experiment are produced and compared to understand the different adhesion effect while packaging before and after pre-oxidation treatment and surface oxide created in different coating. Findings in the present study are expected to judge the best time for mold cleaning and to see whether these coatings can effeciently cut down the negative influences of adhesion effects or not.

摘要 I
Abstract II
表目錄 V
圖目錄 VI
第一章 緒論 1
1-1 前言 1
1-2 封裝製程簡介 3
1-3 封裝模具的黏著問題 5
1-4 研究目的 7
1-5 文獻回顧 8
1-5-1 封膠材料的固化理論 8
1-5-2 封膠材料的黏著性值 8
1-5-3 IC封裝模具表面的鍍層處理 9
1-5-4 量測方式的相關文獻 9
1-5-5 黏著強度的量測規範 11
第二章 量測原理與實驗設備說明 16
2-1 黏著強度量測原理 16
2-2 量測試片與封膠材料的使用準則 17
2-2-1 量測試片之製作 17
2-2-2 封膠材料使用準則 18
2-3 正向與剪向複合機台介紹 21
2-3-1 模壓機單元 23
2-3-2 模具單元 25
2-3-3 灌膠伺服單元 30
2-3-4 黏模力檢測裝置 31
2-4 機台控制系統 33
2-5 數據資料擷取系統 35
2-6 量測過程與結果 38
第三章 正向黏模力之不同鍍層實驗 42
3-1 實驗目的 42
3-2 實驗規劃與實驗製程參數 43
3-2-1 試片鍍層及預氧化處理溫度選用 44
3-2-2 封膠材料使用 45
3-2-3 預氧化處理 45
3-3 實驗結果及比較 46
3-3-1 無預氧化處理溫度之實驗結果 46
3-3-2 預氧化處理溫度為170oC 之實驗結果 51
3-3-3 實驗結果的比較 55
第四章 金屬鍍層試片之黏模效應實驗 57
4-1 實驗目的 57
4-2 實驗規劃與實驗製程參數 57
4-2-1 試片鍍層選用 57
4-2-2試片與封膠材料接觸面積 57
4-2-3 實驗製程參數 58
4-3 黏模效應實驗 59
4-3-1無預氧化處理之Ti金屬鍍層試片之黏模效應實驗 59
4-3-2經170oC預氧化處理之Ti金屬鍍層試片之黏模效應實驗 65
4-4 實驗結果比較 71
第五章 結論與未來展望 74
5-1結論 74
5-2未來展望 75
參考文獻 76
References 76

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