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[1]D. M. Chapin, C. S. Fuller and G. L. Pearson, “A New Silicon p-n Junction Photocell for Converting Solar Radiation into Electrical Power, J. Appl. Phys, Vol. 25, 676-677, (1954) [2]蔡進譯,超高效率太陽電池從愛因斯坦的光電效應談起,物理雙月刊,第二十七卷第五期 [3]P. Doshi, A. Rohatgi, M. Ropp, Z. Chen, D. Ruby, D. L. Meier, “Rapid thermal processing of high-efficiency silicon solar cells with controlled in-situ annealing, Solar Energy Materials and Solar Cells, Vol. 41-42, 31-39, (1996) [4]U. Mohr, R. Leihkauf, K. Jacob, “Phosphorus distribution probles in 100-silicon using a spin-on source at low temperatures, Appl. Phys., Vol. 64, No.1, 77-81, (1997) [5]P. Doshi and A. Rohatgi, “18% Efficient Silicon Photovoltaic Devices by Rapid Thermal Diffusion and Oxidation, IEEE Transactions on Electron Devices, Vol. 45, No. 8, 1710-1716, (1998) [6]V. V. Iyengar, B. K. Nayak, M. C. Gupta, “Silicon PV devices based on a single step for doping, anti-reflection and surface passivation, Solar Energy Materials & Solar Cells, Vol. 94, No.12, 2205-2211, (2010) [7]A. K. Chu, J. S. Wang, Z. Y. Tsai, C. K. Lee, A simple and cost-effective approach for fabricating pyramids on crystalline silicon wafers, Solar Energy Materials & Solar Cells, Vol. 93, No.8, 1276-1280, (2009) [8]A. Parretta, A. Sarno, P. Tortora, H. Yakubu, P. Maddalena, J. Zhao, A. Wang, Angle-dependent reflectance measurements on photovoltaic materials and solar cells, Optics Communications, Vol. 172, No. 1-6, 139-151, (1999) [9]I. Zubel and M. g. Kramkowska, The effect of isopropyl alcohol on etching rate and roughness of (1 0 0) Si surface etched in KOH and TMAH solutions, Sensors and Actuators A: Physical, Vol. 93, No. 2, 138-147, (2001) [10]P. Campbell, M. A. Green, High performance light trapping textures for monocrystalline silicon solar cells, Solar Energy Materials and Solar Cells, Vol. 65, No. 1-4, 369-375, (2001) [11]P. Doshi, G. E. Jellison, Jr., and A. Rohatgi, Characterization and optimization of absorbing plasma-enhanced chemical vapor deposited antireflection coatings for silicon photovoltaics, Applied Optics, Vol. 36, No. 30, 7826-7837, (1997) [12]D. S. Ruby, W. L. Wilbanks, C. B. Fieddermann, A Statistical Analysis of the Effect of PECVD Deposition Parameters on Surface and Bulk Recombination in Silicon Solar Cells, IEEE First WCPEC, Vol. 2, No. 5-9, 1335-1338, (1994) [13]Z. Chen, P. Sana, J. Salami and A. Rohatgi, A Novel and Effective Antireflection Coating PECVD SiO2/SiN for Si Solar Cells, IEEE Transactions on Electron Devices, Vol. 40, No. 6, 1161-1165, (1993) [14]M. J. Kerr, J. Schmidt and A. Cuevas, J. H. Bultman, Surface recombination velocity of phosphorus-diffused silicon solar cell emitters passivated with plasma enhanced chemical vapor deposited silicon nitride and thermal silicon oxide, Journal of Applied Physics, Vol. 89, No. 7, 3821-3826, (2001) [15]T. Saitoh, O. Kamataki and T. Uematsu, Optimization of Antireflection Film Structures for Surface-Passivated Crystalline Silicon Solar Cells, Jpn. J. Appl. Phys., Vol. 33, No.4A, 1809-1813, (1994) [16]C. Leguijt, P. Lölgen, J. A. Eikelboom, A. W. Weeber, F. M. Schuurmans, W. C. Sinke, P. F. A. Alkemade, P. M. Sarro, C. H. M. Marée and L. A. Verhoef, Low temperature surface passivation for silicon solar cells, Solar Energy Materials and Solar Cells, Vol. 40, No. 4, 297-345, (1996) [17]S. Narasimha, A. Rohatgi, and A. W. Weeber, An Optimized Rapid Aluminum Back Surface Field Technique for Silicon Solar Cells, IEEE Transactions on Electron Devices, Vol. 46, No. 7, 1363-1370, (1999) [18]A. Kaminskia, B. Vandellea, A. Favea, J.P. Boyeauxa, Le Quan Namb, R. Monnab, D. Sartib, A. Laugiera, Aluminium BSF in silicon solar cells, Solar Energy Materials and Solar Cells, Vol. 72, 373-379, (2002) [19]M. Kamp, M. Emmerling, S. Kuhn, A .Forchel, Nanolithography using a 100 kV electron beam lithography system with a Schottky emitter, Journal of Vacuum Science & Technology, Vol. 17, No. 1, 86-89, (1999) [20]S. Juhl and S. F. Lyuksyutov, Precise formation of nanoscopic dots on polystyrene film using z-lift electrostatic lithography, Applied Physics Letters, Vol. 85, No. 17, 3836-3838, (2004) [21]E. Miyauchi, H. Arimoto, H. Kitada, “Ion Species and Energy Control of Finely Focused RBs for Maskless in Situ Microfabrication Processes, Nuclear Instruments and Methods in Physics Research, Vol. 39, No. 1-4, 515-520, (1989) [22]H. W. Deckman, J. H. Dunsmuir, Natural lithograph, Applied Physics Letters, Vol. 41, No. 4, 377-379, (1982) [23]F. Jarai-Szabo, S. Astilean and Z. Neda, Understanding Self-Assembled Nanosphere Patterns, Chemical Physics Letters, Vol. 408, No. 4-6, 241-246, (2005) [24]V.Ng, Y.V.Lee, B.T.Chen and A.O.Adeyeye, Nanostructure Array Fabrication with Temperature-Controlled Self-Assembly Techniques, Nanotechnology, Vol. 13, No. 5, 554-558, (2002) [25]C. D. Dushkin, G. S. Lazarov, S.N. Kotsev, H. Yoshimura and K. Nagayama, Effect of Growth Conditions on the Structure of Two-Dimensional Latex Crystals: Experiment, Colloid and Polymer Science, Vol. 277, No. 10, 914-930, (1999) [26]K. Nagayama, Two-dimensional Self-Assembly of Colloids in Thin Liquid Films, Colloids and Surfaces, Vol. 109, 363-374, (1996) [27]G. M. Whitesides and B. Grzybowski, Self-Assembly at All Scales, Science, Vol. 295, No. 5564, 2418-2421, (2002) [28]N.D. Denkov, O.D. Velev, P.A. Kralchevsky, I.B. Ivanov, H. Yoshimura, K. Nagayama, Mechanism of Formation of Two-Dimensional Crystals from Latex Particles on Substrates, Langmuir, Vol. 8, No. 12, 3183-3190, (1992) [29]R. Micheletto, H. Fukuda and M. Ohtsu, A Simple Method for the Production of a Two-Dimensional, Ordered Array of Small Latex Particles,, Langmuir, Vol. 11, No. 9, 3333-3336, (1995) [30]J. C. Hulteen, R. P. van Duyne, Nanosphere Lithography: A Materials General Fabrication Process for Periodic Particle Array Surfaces, Journal of Vacuum Science and Technology, Vol. 13, No. 3, 1553-1558, (1995) [31]D. Wang and H. Mohwald, Rapid Fabrication of Binary Colloidal Crystals by Stepwise Spin-Coating, Advanced Material, Vol. 16, No. 3, 244-247, (2004) [32]Y. Xia, X. M. Zhao, G. M. Whitesides, Pattern transfer: Self-assembled monolayers as ultrathin resists, Microelectronic Engineering, Vol. 32, NO. 1-4, 255-268, (1996) [33]Y. Xia, and G. M. Whitesides, Soft Lithography, Angew. Chem. Int, Vol. 37, 550-575, (1998). [34]H. J. Nam, D. Y. Jung, G. R. Yi, and H. Choi, Close-Packed Hemispherical Microlens Array from Two-Dimensional Ordered Polymeric Microspheres, Langmuir, Vol. 22, No.17, 7358-7363, (2006) [35]Y. H. Kang, S. S. Ohb, Y. S. Kim, C. G. Choi, Fabrication of antireflection nanostructures by hybrid nano-patterning lithography, Microelectronic Engineering, Vol. 87, NO. 2, 125-128, (2010) [36]X. Y. Ling, C. Acikgoz, I. Y. Phang, M. A. Hempenius, D. N. Reinhoudt, G. J. Vancso and J. Huskens, 3D ordered nanostructures fabricated by nanosphere lithography using an organometallic etch mask, Nanoscale, Vol. 2, 1455-1460, (2010)
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