|
[1] 鄭志遠 (2011),矽基板面內共振的電子光斑干涉量測,國立交通大學機械工程學系碩士論文,新竹市,台灣。 [2] J. N. Butters and J. A. Leendertz (1971), “Speckle patterns and holographic techniques in engineering metrology,” Optics Laser Technol., 3(1), 26–30. [3] K. Høgmoen and O. J. Løkberg (1977), “Detection and measurement of small vibrations using electronic speckle pattern interferometry,” Applied Optics, 16(7), 1869-1875. [4] W.-C. Wang, C.-H. Hwang, and S.-Y. Lin (1996), “Vibration measurement by the time-average electronic speckle pattern interferometry methods,” Applied Optics, 35(22), 4502-4509. [5] C.-H. Huang and C.-C. Ma (2000), “Vibration of cracked circular plates at resonance frequencies,” Journal of Sound and Vibration, 236(4), 637-656. [6] V. M. Murukeshan, Y. F. Lai, V. Krishnakumar, L. S. Ong, and A. Asundi (2003), “Development of Matlab filtering techniques in digital speckle pattern interferometry,” Optics and Laser in Engineering, 39, 441-448. [7] C.-C. Ma, Y.-C. Lin, and H.-Y. Lin (2008), “Dynamic in-plane resonant characteristics of piezoceramic and piezolaminated composite plates,” IEEE Transactions on Ultrasonic, Ferroelectrics, and Frequency Control, 55(3), 526-537. [8] S. Ostapenko and I. Tarasov (2000), “Nonlinear resonance ultrasonic vibrationsin Czochralski-silicon wafers,” Applied Physics Letters, 76(16), 2217-2219. [9] S. Ostapenko, W. Dallas, D. Hess, O. Polupan, and J. Wohlgemuth (2006), “Crack detection and analyses using resonance ultrasonic vibrations in crystalline silicon wafers,” IEEE, 920-923. [10] S. Ostapenko, A.Belyaev, O. Polupan, W. Dallas, and D. Hes (2006), “Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers,” Applied Physics Letters, 88, 111907. [11] A. Belyaev, O. Polupan, S. Ostapenko, D. Hess, and J. P Kalejs (2006), “Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers,” Semiconductor Science and Technology, 21, 254-260. [12] W. Dallas, O. Polupan, and S. Ostapenko (2007), “Resonance ultrasonic vibration for crack detection in photovoltaic silicon wafers,” Measurement Science and Technology, 18, 852-858. [13] C. Hilmersson, D. P. Hess, W. Dallas, and S. Ostapenko (2007), “Crack detection in single-crystalline silicon wafers using impact testing,” Applied Acoustics, 69, 755–760 [14] A. Monastyrskyi, S. Ostapenko, O. Polupan, H. Maeckel, and M. A. Vazquez (2008), “Resonance ultrasonic vibrations for in-line crack detection in silicon wafers and Solar Cells,” IEEE the 33th Photovoltaic Specialists Conference . [15] A. Belyaev, Yu. Emirov, S. Ostapenko , I. Tarasov, V. Verstraten, M. Van Dooren, P. G. Fumei, G. Van Veghel, P. Bentz, and A. Van Der Heide (2009), “Yield enhancement for solar cell manufacturing using resonance ultrasonic vibrations inspection,” IEEE the 34th Photovoltaic Specialists Conference, 001918-001921. [16] Yu. Emirov, A. Belyaev, D. Cruson , I. Tarasov, A. Kumar, H. Wu, S. Melkote, and S. Ostapenko (2011), “Pinhole detection in si solar cell using resonance ultrasonic vibrations,” IEEE the 37th Photovoltaic Specialists Conference, 002161-002163. [17] 溫子逵 (2012),電子光斑干涉術應用於矽晶太陽能電池之裂縫檢測,國立交通大學機械工程學系博士論文,新竹市,台灣。 [18] ANSYS, Release 11.0 Documentation for ANSYS:Element Library. SAS IP, Inc., USA, 2007.
|