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研究生:朱騰漳
研究生(外文):Teng-Jhang Jhu
論文名稱:以1 × 2垂直分岔高分子聚合物光路實現單晶片20-Gbps矽基光學連接模組
論文名稱(外文):Chip-Level 20-Gbps Optical Interconnect Modules with Polymer-Based 1 × 2 Vertically Optical Splitters Realized on Silicon Substrate
指導教授:伍茂仁
指導教授(外文):Mount-Learn Wu
學位類別:碩士
校院名稱:國立中央大學
系所名稱:光電科學與工程學系
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2013
畢業學年度:101
語文別:中文
論文頁數:67
中文關鍵詞:波導高分子聚合物光聯接
外文關鍵詞:polymwerwaveguideoptical interconnecton-chip
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本論文提出一個具有1  2分光能力的矽基光連接模組。此模組利用45微反射面達成光訊號垂直耦合,並透過高分子聚合物波導和擁有3個45微反射面的矽基板整合,實現垂直耦合、分岔光路雙輸出的矽基光學平台。利用覆晶封裝製程,在發射端和兩個輸出端封裝主動元件,完成具有收發端的光連接模組。此光連接模組具有垂直光學耦合能力、1  2雙輸出分光器、發射端和接收端,為一完整的晶片上光連接模組。
此光連接模組的光學耦合效率兩輸出通道分別是23.73%和23.53%,模組總損耗為-3.26dB。輸入訊號10GHz的高頻量測結果,雙輸出通道的眼高皆約有250mV,並且通過誤碼率測試,皆低於10-12等級,證明本研究架構具有雙輸出通道單晶片20-Gbps的資料傳輸能力。

In this thesis, A polymer waveguide monolithically integrated with three Si-based 45° reflectors realized on a Si substrate is proposed to form a 1 × 2 vertically optical splitter. A VCSEL chip at the input port and two PD chips at two output ports are flip-chip assembled.
In this thesis, we propose an intra-chip 10-Gbps optical interconnect module using a silicon optical bench (SiOB) integrated with polymer waveguides and silicon-based 45˚ micro-reflector.
This optical connection module optical coupling efficiency at two output channels of 23.73% and 23.53%, and the total optical insertion loss of 3.26 dB with a splitting ratio of 1:1 is obtained for the proposed splitter. The clear eye patterns with a transmission rate of 10 Gbps at two output ports are demonstrated and verify that the 1 × 2 vertical splitter is suitable for the optical interconnects with multiple output ports. The 10-Gbps error-free performance of receiver side is also achieved at the level of 10-12 even the VCSEL is biased at 5 mA.

摘要 i
目錄 iii
圖目錄 iv
表目錄 ix
第一章 緒論 1
1-1 研究動機與目的 1
第二章 垂直耦合分岔雙輸出光學連接模組設計 11
2-1 垂直耦合分岔光學連接模組結構尺寸以及光學設計 12
2-2 高頻傳輸線設計模擬與分析 18
第三章 垂直耦合分岔雙輸出光學連接模組設計製作開發 24
3-1 具45°微反射面矽基光學平台製程與開發 24
3-1.1 矽基光學平台製程開發 25
3-1.2 45°微反射面金屬製程開發 27
3-2 具分光結構之高分子聚合物波導製作 29
3-3.1 高頻傳輸線金屬製作 34
3-3.2 焊料銦金屬製作 36
3-3.3 元件覆晶封裝製程 37
第四章 垂直耦合分岔雙輸出光學連接模組之量測與分析 40
4-1 具分光結構高分子聚合物波導之光學與元件特性量測 40
4-1.1面射型雷射與光檢測器特性量測 40
4-1.2高分子聚合物波導光學特性量測 44
4-2 垂直分岔雙輸出光連接模組高頻特性量測 46
4-2.1 高頻傳輸線特性量測 46
4-2.2 雙輸出光學連接模組頻率響應量測 50
4-2.3 雙輸出光學連接模組眼圖量測 53
第五章 結論與未來展望 63
參考文獻 65

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[10]A. Shacham, K. Bergman, and L. P. Carloni, BOn the design of a photonic network-on-chip, presented at the Int. Symp. etworks-on-Chips, Princeton, NJ,May 2007, paper 2.1.
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