臺灣博碩士論文加值系統

隨著半導體產業的蓬勃發展，對產品封裝良率的要求也日益提高，其中銲線製程對於整體封裝產出的良率影響極大。本文旨在提出一套操作簡單的製程改善方法，來幫助準確找出多重品質最佳參數組合，解決以往只針對單一品質特性做最佳化的問題，並縮短製程改善時間，以降低生產成本，提高產品良率，同時增加獲利空間。
本研究以改善BGA銅線銲接製程為目標，經由實驗證明，本文結合田口品質工程、主成份分析以及模糊邏輯推論等製程改善方法，確實能夠有效找出多重品質最佳參數組合。這不僅是一套操作簡單的方法，也是真正符合實用需求的系統。

The requirement for yield rate is even higher than before due to the rapid development in semi-conductor industry. And the wire bonding process is one of the most important factors to overall production yield rate. The purpose of this study is to propose a method which can be operated easily to solve the issue of previous researches that can only focus on single quality characteristic then find out the optimal parameters combination of multiple qualities so that shorten the process improvement time, lower the production cost, increase the production yield rate, and enlarge the profit margin.
The goal of this research is to improve the Cu wire bonding process of BGA production. According the experiment result, the proposed method which combines Taguchi Method, Principal Component Analysis, and Fuzzy Logic can actually find out the optimal parameters combination of multiple quality characteristics effectively. This is not only a method that can be easily operated but also a system that meets the real demands.

摘要 I
Abstract II
誌謝 III
目錄 IV
圖目錄 VI
表目錄 VIII
第一章 緒論 1
1.1 前言 1
1.2 研究動機與目的 4
1.3 文獻回顧 4
1.4 論文架構 9
第二章 研究方法與設備 11
2.1 BGA (Ball Grid Array) 封裝製程介紹 11
2.2 銅線銲接形成過程（Wire Bonding Process Cycle） 13
2.3 Wire Bond銲接主要參數 15
2.4 田口穩健設計（Taguchi’s method） 19
2.5 主成份分析法（Principal Component Analysis , PCA） 21
2.6 模糊邏輯理論（Fuzzy Logic Theory） 23
2.7 實驗設備與數據檢測方法 25
第三章 應用主成份分析法搭配田口方法開發銅線封裝多目標最佳化製程技術 33
3.1 前言 33
3.2 實驗設備與材料 35
3.3 實驗參數設計 36
3.4 實驗方法與步驟 42
3.5 實驗結果與分析 47
3.6 結論 56
第四章 應用主成份分析法與模糊理論搭配田口方法開發銅線封裝多目標最佳化製程技術 57
4.1 前言 57
4.2 實驗設備與材料 60
4.3 實驗參數設計 61
4.4 實驗方法與步驟 68
4.5 實驗結果與分析 77
4.6結論 87
第五章 結論與未來展望 89
5.1 結論 89
5.2 未來展望 90
參考文獻 91

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