[1] E. H. Kisi and C. J. Howard, Engineering Materials, 153/154 (1998) 1-36.
[2] R. H. J. Hannink, M. J. Murray, H. G. Scott, Wear, 100 (1984) 355-366.
[3] A. D. Brailsford, M. Yussouff, and E. M. Logothetis, Sensors and Actuators, 44 (1997) 321-326.
[4] D. Gosset, M. Dollé, D. Simeone, G. Baldinozzi and L. Thomé, Journal of Nuclear Materials, 373 (2008) 123-129.
[5] K. Negita and H. Takao, J. Phys. Chem. Solids, 50 (1989) 325-331.
[6] P. Bourguet, J. M. Dupart, and E. Tiran, P. Auvary, A. Guivarc’h, M. Salvi, and G. Pelous, P. Henoc, J. Appl. Phys, 51 (1980) 61-69.
[7] A. D. Marwick and R. C. Piller, Rad. Eff., 47 (1980) 195-201.
[8] R. E. J. Watkins, Rad. Eff., 84 (1984) 27-43.
[9] R. Schork, P. Pichler, A. Kluge, and H. Ryssel, Nucl. Instr. and Meth. B, 59/60 (1991) 499-503.
[10] G. Dearnaley, Rad. Eff., 63 (1982) 25-37.
[11] R. Wei, P. J. Wilbur, O. Ozturk and D. L. Williamson, Nucl. Instr. and Meth. B, 59/60 (1991) 731-736.
[12] D. L. Williamson, O. Ozturk, S. Glick, R. Wei, and P. J. Wilbur, Nucl. Instr. and Meth. B, 59/60 (1991) 737-741.
[13] Y. Miyagawa, M. Ikeyama, K. Saitoh, S. Nakao, and S. Miyagawa, Surf. Coat. Technol., 83 (1996) 275-279.
[14] R. Sizmann, J. Nucl. Mater., 69/70 (1978) 386-412.
[15] Y. Adda, M. Beyeler and G. Brebec, Thin Solid Films, 25 (1975) 107-156.
[16] G. J. Dienes and A. C. Damask, J. Appl. Phys., 29 (1958) 1713-1721.
[17] K. C. Russel, Proger. Mat. Sci. 28 (1984) 229-434.
[18] T. R. Anthony, Radiation Induced Voids in Metals, National Technical Information Service, Springfield, (1972) p. 630.
[19] R. A. Johnson and N. Q. Lam, Phys. Rev. B, 13 (1976) 4364-4375.
[20] R. A. Johnson and N. Q. Lam, Phys. Rev. B, 15 (1977) 1794-1800.
[21] N. Q. Lam, P. R. Okamoto, and R. A. Johnson, J. Nucl. Mater., 78 (1978) 408-418.
[22] P. R. Okamoto, L. E. Rehn, and R. S. Averback, J. Nucl. Mater., 108/109 (1982) 319-330.
[23] J. R. Manning, Bull. Am. Phys. Soc., 23 (1978) 287.
[24] J. R. Manning, Phase Stability During Irradiation, (1981), P. 3.
[25] H. Wiedersich, P. R. Okamoto, and N. Q. Lam, J. Nucl. Mater., 83 (1979) 98-108.
[26] W. Eckstein, Computer Simulation of Ion-Solid Interactions, Springer Series in Materials Science, 10 (1991) 33-39.
[27] J. F. Ziegler and J. P. Biersack, Treatise on Heavy-Ion Science, Plenum Press, New York, (1985) pp. 93-129.
[28] J. F. Ziegler and J. P. Biersack, Ion implantation techniques, 10 (1982) 122-156.
[29] F. Qunbo, W. Fuchi, Z. Huiling and Z. Feng, Molecular Simulation, 34 (2008) 1099-1103.
[30] 吳政興,納米級氧化鋯結晶製備,中央大學化工所碩士論文,(1998).[31] 邱碧秀,電子陶瓷材料,徐氏基金會出版,(1992) 296.
[32] K. Tanabe and T. Yamaguchi, Catal. Today, 20 (1994) 185-197.
[33] P. Charpentier, P. Fragnaud, D. M. Schleich, and E. Gehain, 135 (2000) 373-380.
[34] M. Ragheb, Pressurized Water Reactors, (2010).
[35] D. Simeone, D. Gosset, J. L. Bechade, and A. Chevarier, Journal of Nuclear Materials, 300 (2002) 27-38.
[36] J. A. Valdez, Z. Chi, and K. E. Sickafus, Journal of Nuclear Materials, 381 (2008) 259-266.
[37] A. Misra, S. Fayeulle, H. Kung, T. E. Mitchell, M. Nastasi, Nucl. Instrum. and Meth.B, 148 (1999) 211-215.
[38] A. Benyagoub, Nuclear Instruments and Methods in Physics Research B, 206 (2003) 132-138.
[39] A. Benyagoub, Physical Review B, 72 (2005) 1-7.
[40] D. Simeone, J. L. Bechade, D. Gosset, A. Chevarier, P. Daniel, H. Pilliaire, and G. Baldinozzi, Journal of Nuclear Materials, 281 (2000) 171-181.
[41] A. Benyagoub and F. Levesque, Europhys. Lett., 60 (2002) 580-586.
[42] R. Giulian, L. L. Araujo, P. Kluth, D. J. Sprouster, C. S. Schnohr, A. P. Byrne and M. C. Ridgway, J. Phys. D: Appl. Phys., 44 (2011) 155401.
[43] R. Giulian, L. L. Araujo, P. Kluth, D. J. Sprouster, C. S. Schnohr, A. P. Byrne and M. C. Ridgway, J. Phys. D: Appl. Phys., 44 (2011) 155402.
[44] X. L. Yan, J. C. Chen, J. Yu, and J. H. Hu,電工材料,第二期,(2003) 1.
[45] A. Undisz, U. Zeigmeister, M. Rettenmayr and M. Oechsle, Journal of Alloys and Compounds,438 (2007) 178-183.
[46] D. B. Williams, and C. B. Cater., Transmission Electron Microscopy, Plenum Company, New York, (1996) P. 131.
[47] R. C. Garvie, Journal of Physical Chemistry, 82 (1978) 218-224.
[48] S. Shukla and S. Seal, International Materials Reviews, 50 (2005) 45-64.