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研究生:廖婉如
研究生(外文):Wan-Ru Liao
論文名稱:射出成型溫度效應與壓力效應對黏度的影響
論文名稱(外文):Effects of Temperature and Pressure on Viscosity in Injection Molding
指導教授:林鴻佳
學位類別:碩士
校院名稱:國立虎尾科技大學
系所名稱:航空與電子科技研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2013
畢業學年度:101
語文別:中文
論文頁數:82
中文關鍵詞:剪切稀化零剪切黏度剪切黏度黏彈性流體無因次化
外文關鍵詞:Shear thinningZero-shear viscosityShear viscosityViscoelastic fluidDimensionless
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射出成型的製程中融膠的流動過程都需要考慮到溫度和壓力對融膠黏度對成型過程所造成的影響,黏度是反映流體流動黏性阻力大小的指標,尤其在高分子流體的應用上,黏度受到剪切率影響非常明顯,是流體材料隨應變抵抗其迅速變形的一種能力。
以往塑膠材料的黏度都需使用流變儀器才能得知。本研究利用流體力學與流變學為基礎,搭配使用電腦輔助工程分析(CAE)之模流分析軟體(Moldflow)進行射出成型製程模擬,得到理論分析的結果再反推算低剪切狀態的黏度。最後所得到的結果可再與流變儀結果進行比對。本研究同時也探討無因次分析中黏度對於無因次係數所造成的影響。


Determining the flow behavior and knowing the rheological properties are important for injection molding process. Plastic material is termed viscoelastic due to molten plastics behave both viscously and elastically. The flow process in injection mold involve mainly shear of the melt. Injection molding is implemented that the melt is injected into the mold and then the part is ejected after the part cooling down.
During the cavity of the mold is filled, a steady flow is necessary for good outside quality. Different molding parameters will cause melt viscosity change and reflect on the molding quality. It is important to study the melt state for evaluating the molding quality. In this study, the effects of temperature and pressure on the viscosity are studied. The fundamental formulation to determine the viscosity is derived first, a few CAE simulations are implemented to validate the result. The results show that a accurate model foe viscosity can be used to predict the real molding condition.


摘要........................................................................................................................ i
Abstract .................................................................................................................ii
誌謝......................................................................................................................iv
目錄....................................................................................................................vi
表目錄................................................................................................................ix
圖目錄................................................................................................................. x
符號說明............................................................................................................xiii
第一章 緒論...................................................................................................... 1
1.1 前言......................................................................................................... 1
1.2文獻回顧................................................................................................. 6
1.2.1高分子加工相關研究.................................................................. 6
1.2.2高分子聚合物材料性質相關研究............................................ 11
1.3研究動機與目的................................................................................... 14
1.4論文架構............................................................................................... 15
第二章 高分子聚合物材料黏度性質........................................................ 17
2.1高分子聚合物之黏度定義................................................................... 19
2.2流變學理論........................................................................................... 25
第三章 黏度及無因次化分析.................................................................... 30
3.1分析方法............................................................................................... 30 vi
3.1.1實驗設備.................................................................................... 30
3.1.2材料選用.................................................................................... 32
3.1.3基準模型.................................................................................... 34
3.2電腦輔助工程分析............................................................................... 34
3.2.1模型建立.................................................................................... 35
3.2.2模擬軟體.................................................................................... 36
3.3分析流程............................................................................................... 36
第四章 結果與討論......................................................................................... 40
4.1高分子聚合物充填狀態....................................................................... 40
4.2剪切率與剪應力之比........................................................................... 42
4.3黏度曲線建構....................................................................................... 47
4.4無因次化充填分析............................................................................... 50
4.5無因次化體積流率分析....................................................................... 54
4.6無因次化黏度分析............................................................................... 57
第五章 結論與未來展望................................................................................. 60
5.1無因次化分析....................................................................................... 60
5.2真實黏度分析....................................................................................... 61
5.3 未來展望.............................................................................................. 63
參考文獻........................................................................................................... 64 vii
附錄A............................................................................................................... 67
A-1 材料PC 280℃.................................................................................... 67
A-2 材料PC 290℃.................................................................................... 68
A-3 材料PC 300℃.................................................................................... 69
A-4 材料PC 310℃.................................................................................... 70
A-5 材料PC 320℃.................................................................................... 71
附錄B ............................................................................................................... 72
B-1 材料PP 200℃..................................................................................... 72
B-2 材料PP 220℃..................................................................................... 73
B-3 材料PP 240℃..................................................................................... 74
B-4 材料PP 260℃..................................................................................... 75
B-5 材料PP 280℃..................................................................................... 76
Extended Abstract ............................................................................................. 77
口試審查Q&A................................................................................................... 80
個人簡歷............................................................................................................. 82

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