臺灣博碩士論文加值系統

相變化材料（PCM, Phase Change Material）在固態或液態的相變化（熔解或凝固）過程中，能有效地儲存或釋放大量的潛熱，因此，在能量儲存與環境控制材料的應用上，相變化材料是相當重要的擇材對象。例如：電子裝置、電池及生化儲存槽的相變化均溫環境；將微粒狀PCM注入熱流管路的流體中，以增強熱傳效益；熱控致動器的開發等。相變化材料與微粒包覆技術的研究已各自發展相當長的一段時間，然而結合兩者之優點以高分子包覆相變化材料，以形成『相變化材料微膠囊（microencapsulated PCM, mPCM）』之相關研究，卻是近年來備受關注的課題。
　　本研究將微膠囊相變化材料與鋁蜂巢建築構造結合，利用鋁蜂巢作為結構支撐與熱傳通道，研製而成「內含微膠囊相變化材料之熱控模組」，藉由實驗方式探討此新穎熱控模組於等熱通量熔解時的熱傳特性。文中亦將分析熔解線的移動速率（亦即深度的推進量）以及不同Ste與Sb數時的暫態熱傳量，研究成果將可提供實際熱流能量管理之用。

During the processes of melting or solidification, a phase change material（PCM） can effectively release or store a significant amount of latent heat. The temperature of a PCM can also be stably maintained during the latent heat transfer process. Therefore, in the application of energy storage and thermal environmental control, PCM is a very promising material choice. Integrating building materials with PCM for environmental control has been achieved by three PCM treatment methods: adding PCM particles during material production processing（particularly microencapsulated PCM, mPCM）, laminating PCM onto construction panels, or forming a form-stable PCM.
　　This study combined building construction and thermal technology by using mPCM（core material: paraffin; melting temperature：37°C） and aluminum honeycomb structures（25.4 mm thick; 8 mm core cell） to construct a mPCM honeycomb module and to analyze its heat transfer characteristics using experimental methods. The time variations of melting fraction with respect to Stefan number (Ste), subcooling (Sb) and Fourier number were investigated.

目 次
摘要 iv
英文摘要 v
誌謝 vi
目次 vii
表目錄 ix
圖目錄 x
第一章　緒論 1
1-1 前言 1
1-2 文獻回顧 2
1-3 研究目的 8
1-4 本文架構 8
第二章　實驗材料之製備與熱物性質之量測 9
2-1 mPCM散熱模組材料 9
2-1-1 微膠囊相變化材料（mPCM） 9
2-1-2 鋁蜂巢材料 9
2-1-3 mPCM散熱模組之製備 10
2-2 熱物性質量測 10
2-2-1 DSC（Differential Scanning Calorimetry）之量測 10
2-2-2 比熱計算 11
2-2-3 熱傳導係數量測 12
2-3 量測誤差 12
第三章　實驗模型與量測方法 13
3-1 實驗模型與設備 13
3-1-1 實驗模型 13
3-1-2 實驗設備 14
3-2 實驗方法與步驟 17
3-3 不準度分析 18
第四章　結果與討論 19
4-1 熱物性質量測結果 19
4-1-1 潛熱及熔點量測 19
4-1-2 熱傳導係數 19
4-1-3 比熱 20
4-2 雙邊等溫邊界條件之熱傳過程 20
4-2-1 熔解過程 20
4-2-2 無熱源/水冷凝固過程 24
4-3 等熱通量熱源-等溫冷壁條件之熱傳過程 25
4-3-1 熔解過程 25
4-3-2 無熱源/水冷凝固過程 29
4-4 等熱通量熱源-冷壁對流邊界之熱傳過程 30
4-4-1 熔解過程 30
4-4-2 無熱源/水冷凝固過程 34
第五章　結論 36
參考文獻 37
符號彙編 40

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