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研究生:廖珮如
研究生(外文):Pei-Ru Liao
論文名稱:手持裝置TDMA雜訊之分析與抑制
論文名稱(外文):Analysis and Suppression of TDMA Noise for Handheld Device
指導教授:余政杰余政杰引用關係
口試委員:黃育賢鄭群星
口試日期:2013-07-18
學位類別:碩士
校院名稱:國立臺北科技大學
系所名稱:電資碩士班
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2013
畢業學年度:101
語文別:中文
論文頁數:119
中文關鍵詞:分時多工存取印刷電路板串擾電容濾波
外文關鍵詞:TDMAPCBCross talkde-coupling capacitor filter.
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本研究透過佈線分析、金屬屏蔽與元件濾波方式來改善手持裝置中因分時多工存取(Time Division Multiple Access ; TDMA)產生之雜訊(Noise)干擾。藉由印刷電路板(Printed Circuit Board ; PCB)以及軟性電路板(Flex Printed Circuit ; FPC)上的走線分析,以及實際傳輸線串擾的模擬與量測,確認干擾源來自天線發射時耦合至一FPC軟板音頻路徑上。
本文提供三種方式在行動電話傳輸語音訊號時的耳機聽筒遭受GSM850, GSM900之TDMA雜訊干擾,透過對雜訊源做走線調整、金屬屏蔽、電容濾波等方式做分析改善,藉此了解抑制方式的選用。由頻譜分析儀量測,調整走線前量測雜訊干擾功率為-86.91 dBm,改善後為-91.46 dBm,可改善4.55 dB;使用金屬屏蔽方式量測雜訊干擾能量為-86.91 dBm,改善後為-112.3 dBm,可改善25.39 dB;使用電容濾波量測雜訊干擾功率為-86.91 dBm,改善後為-105.99 dBm,可改善19.08 dB。
針對音頻改善測試,使用頻譜分析儀與示波器去量測音頻訊號改善程度,在一FPC軟板上以金屬屏蔽效果最好,但是在成本與時間限制考量下,使用電容濾波改善輻射干擾是較可行的方案。


This work focuses on the reduction of TDMA noise for handheld devices. There are several approaches to achieve this objective, including PCB layout modification, metal shielding, and capacitor filtering.
Through layout routing analysis in PCB and FPC board as well as the simulation and measurement of cross talk between transmission lines, the noise source can be confirmed by coupling the audio path when antenna transmits signals.
After that the three reduction methods will be applied. Depend on measured results in spectrum analyzer, the measured noise spur is -86.91 dBm for failed device. (1) After modifying layout routing, the measured noise spur for 217 Hz is -96.41 dBm which is improved by 4.55 dB. (2) By using metal shielding on audio path, the measured noise spur is -112.3 dBm which is improved by 25.39 dB. (3) By using de-coupling capacitor, the measured noise spur is -105.99 dBm which is improved by 19.08 dB.
For audio test, uses spectrum analyzer and scope to measure the improved level. Shielding the related components on FPC has the best effective. However, if takes the cost and time limitation into account, using components to reduce interference is a more feasible solution.


中文摘要 i
英文摘要 ii
致謝 iii
目錄 iv
表目錄 viii
圖目錄 ix
第一章 緒論 1
1.1 研究背景 1
1.2 研究動機與目的 1
1.3 研究方法 2
1.4 論文大綱 3
第二章 雜訊干擾與防治 4
2.1 電磁干擾基礎知識 4
2.2 干擾源傳播途徑與形式 5
2.2.1 共模與差模干擾傳播途徑 6
2.2.2 串音干擾傳播途徑 6
2.3 TDMA簡介與干擾的成因 7
2.3.1 GSM系統架構 8
2.3.2 TDMA雜訊成因 11
2.4 干擾的防治與理論 13
2.4.1 佈線調整 13
2.4.2 金屬屏蔽 15
2.4.3 元件濾波 16
第三章 手持通訊系統架構介紹 19
3.1 手機系統介紹 19
3.2 系統電路架構 20
3.2.1 音頻硬體架構 22
3.2.2 Layout佈線架構 22
3.2.3 手機組裝架構 24
3.3 電聲元件介紹 26
3.3.1 揚聲器特性與電路介紹 26
3.3.2 受話器特性與電路介紹 28
3.3.3 麥克風種類與特性介紹 29
3.3.4 麥克風電路設計 30
3.3.5 麥克風抗噪原理 32
3.3.6 雙麥克風擺放配置 33
3.4 手機語音品質未來趨勢 34
第四章 手持系統測試認證介紹 35
4.1 測試規範組織架構 36
4.2 音頻測試國際標準介紹 36
4.2.1 3GPP 36
4.2.2 GCF與PTCRB 37
4.3 TDMA Noise測試設備與方法 39
4.3.1 測試儀器與設備 39
4.3.2 測試設備架設 40
4.3.3 TDMA Noise品質量測 42
4.3.3.1 測試條件 42
4.3.3.2 測試步驟與方法 42
第五章 電路模擬與實測 45
5.1 EMI模擬軟體簡介 45
5.1.1 EMI模擬軟體執行流程 45
5.1.2 EMI模擬軟體設計準則 45
5.1.3 EMI模擬軟體參數設定 46
5.1.4 HFSS參數設定 51
5.2 PCB系統模擬結果 53
5.2.1 EMI 模擬軟體之聽筒(Receiver)模擬結果 53
5.2.1.1 REC_N 模擬結果 53
5.2.1.2 REC_P 模擬結果 54
5.2.2 EMI 模擬軟體之耳機(Earphone)模擬結果 55
5.2.2.1 耳機麥克風(HPH_MIC)模擬結果 55
5.2.2.2 耳機電源(HSED_BIAS1)模擬結果 56
5.2.3 HFSS 走線串擾模擬 57
5.3 實測結果 59
5.3.1 TDMA Noise實測圖 59
5.3.2 走線串擾(Cross Talk)實測圖 62
5.4 實測與模擬比較 63
5.4.1 EMI 模擬軟體之模擬與實測結果 63
5.4.2 HFSS模擬與實測結果 64
第六章 研究成果與討論 65
6.1 音頻電路干擾源分析 65
6.1.1 音頻佈線分析 66
6.1.1.1 印刷電路板佈線分析 67
6.1.1.2 軟性電路板佈線分析 72
6.2 改善結果 79
6.2.1 耳機模式 79
6.2.1.1 Layout分析與改善 79
6.2.1.2 金屬屏蔽 82
6.2.1.3 元件濾波 87
6.2.2 手持模式 96
第七章 結論 104
參考文獻 106

附錄
A 於2013年全國電磁相容技術與實務研討會發表之會議論文 110
A.1全國電磁相容技術與實務研討會論文審稿函 111
A.2 手持裝置TDMA雜訊之分析與抑制 112
研究心得 119


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