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研究生(外文):CHI-I CHIU
論文名稱(外文):A Study for the Heat Dissipation of the High Power LED Lamps
指導教授(外文):Yeong-Shu Chen
口試委員(外文):Yu-Cai LinTe-Yen Huang
外文關鍵詞:Heat DissipationHigh Power LEDLamps
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The overheat problem for those LED lamps will either damage the LED chips or cause the downgrade of the light intensity. The cooling mechanism consists of a metal fin or similar heat dissipation devices in contact with the PCB circuit board to lower the temperature. This study conducted a series of experiments by taking various LED lamps on the current market for examining the heat dissipation problem s. It is aimed to explore the relating methods or parameters that can have the best performance in the heat reduction effects for high-power LED lamps.
Firstly, factors for the optimum fin spacing to reduce the temperature on the LED surface are studied. By building the numerical simulation models followed by the making of the prototype, various fin numbers on the LED circuit board temperature reduction were tested. Also, the use of different materials of the PCB substrate on the increase of temperature, and the tightening pressure of the screws on the LED light plate were tested as well. Based on the theory of heat conduction, temperature of the LED chip is checked for avoiding the light intensity downgrading during the long term use of the LED. All these tests come with a continuous temperature recording following UL safety regulations to make sure all the studied factors on the heat reduction still comply with the regulations.
Finally, through all the experimental results and experiences in the LED lighting industry, the study integrated all the heat problems of the current LED lighting products on the market. It is concluded that with larger cooling fin area does not necessary to result in good heat dissipations. And the ceramic substrates are the best choice for high power lamps applications. Besides, the screws that generate the pressure in normal direction have apparent effects on the overall heat dissipation. All these findings are essential factors for the LED lamp applications. The corresponding results are believed to be beneficial in the cooling design of LED lamps.
中文摘要 i
英文摘要 ii
目錄 iii
圖目錄 v
表目錄 viii
符號說明 ix
第一章 緒論 1
1.1 前言 1
1.2 研究目的 2
1.3 文獻回顧 3
1.4 研究架構 5
第二章 LED燈介紹 6
2.1 LED燈的優缺點 6
2.2 LED的照明運用 7
2.3 LED照明與傳統照明比較 9
2.4 LED燈具之散熱結構介紹 11
2.5 全球白熾燈禁用時間表 15
2.6 全球各種LED燈具介紹與通用燈頭分類表 17
2.7 LED燈具之溫度量測規範 25
第三章 解決高功率LED燈具之散熱方法 27
3.1 鰭片間距探討 27
3.2 運用不同材質之LED散熱PCB基板 36
3.3 螺絲鎖附的壓力對熱傳導的影響 41
第四章 實驗設備與方法 55
4.1 實驗設備 55
4.2 實驗步驟 59
第五章 實驗結果與分析 74
5.1 實驗數據 74
5.2 實驗結果分析 83
第六章 結論與未來展望 90
6.1 結論 90
6.2 未來展望 93
參考文獻 94
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