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研究生:陳俊華
研究生(外文):Chun-Hua Chen
論文名稱:三穩態微機構的設計與分析
論文名稱(外文):Design and analysis of a tristable micromechanism
指導教授:王東安
指導教授(外文):Dung-An Wang
口試委員:林哲信李佳言
口試委員(外文):Che-Hsin LinChia-Yen Lee
口試日期:2014-07-28
學位類別:碩士
校院名稱:國立中興大學
系所名稱:精密工程研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2014
畢業學年度:102
語文別:中文
論文頁數:69
中文關鍵詞:撓性三穩態機構撓性雙穩態機構微機電系統
外文關鍵詞:Tristable micromechanismbistableMicroelectromechanical System
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一個撓性三穩態機構,是由,微觀的撓性雙穩態機構內部再鑲嵌一組雙穩態機構。此撓性機構在一段直線運動的範圍內,擁有三個穩定且平衡位置。此撓性三穩態的機構是源自於兩個不同負載的撓性雙穩態機構。此撓性三穩態機構的特性進行了實驗的驗證。證實了,此撓性三穩態機構的力與位移曲線在 260 μm 位移的範圍內的呈現三個穩態位置。

隨著小型化時代的來臨,許多微觀的結構都藉由微機電系統(MEMS)來製造。因此增加了結構的複雜性以及減縮了其尺寸,因此,在量測力與位移特性時變得更加具有挑戰性。因此,為了量測此微觀機構因而開發了此量測裝置,其裝配了位移平台以及微型荷重元傳感器。藉此設備來證明一個撓性雙穩態機構的力與位移特性。
A tristable micromechanism with a bistable mechanism embedded in a surroundingbistable mechanism is developed. Three stable equilibrium positions are within therange of the linear motion of the mechanism. The tristability of the mechanismoriginates from the different actuation loads of the two bistable mechanisms.Thecharacteristics of the mechanism are verified by experiments. The force versusdisplacement curve of the mechanism exhibits the tristable behavior within adisplacement range of 230 μm .

With the advancement of miniaturization, many micromechanisms are fabricatedby Microelectromechanical System (MEMS) processes. Most characterization methodsof micromechanisms rely on optical or tactile techniques. Due to increasing complexityand decreasing size of microsystems, it becomes more challenging to measure theforce-displacement characteristics of micromechanisms. Therefore, a device of in-planeforce measurement of micromechanisms is developed, which is equipped withtranslation stages and a miniature load cell. Force-displacement characterization of aconstant-force tristable micromechanism using the developed device is demonstrated.
致謝….i
摘要…ii
Abstract….iii
目錄….iv
圖目錄….vi
第一章緒論….1
1.1前言…1
1.2研究動機與目的…2
1.3文獻回顧…3
1.3.1撓性機構…3
1.3.2撓性雙穩態機構…4
1.3.3撓性多穩態機構….5
1.4論文架構…6
第二章基礎理論與分析模擬….15
2.1前言….15
2.2基礎理論….15
2.2.1撓性三穩態機構….16
2.2.2三穩態機構之工作原理….16
2.3設計模擬分析….18
2.3.1設計流程….18
2.3.2設計…19
2.3.3分析模擬….20
第三章實驗製程…30
3.1前言…30
3.2製作流程說明…30
3.2.1光罩設計…31
3.2.2電鍍結構層的設計…32
3.2.3犧牲層的設計…32
3.3實驗製程規畫…34
3.3.1基板種子層製作…34
3.3.2微影製程…35
3.3.3電鍍製程…37
3.3.4蝕刻製程…38
3.3.5釋放製程…39
第四章量測方法、結果與討論…52
4.1前言…52
4.2量測方法…52
4.3量測結果…53
4.4量測結果與模擬誤差探討…54
4.4.1微影製程的誤差探討…54
4.4.2電鍍製程的誤差探討…55
4.4.3尺寸的誤差探討…57
4.4.4量測系統的誤差探討…57
第五章結論…65
5.1結論…65
5.2未來展…65
參考文獻…66
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