|
[1] G. T. Lei,R. W. Techentin, and B. K. Gilbert,“High frequency characterization of power/ground-plane structures,”IEEE Trans. Microw. Theory Tech., vol. 47, no. 5, pp. 562-569, May 1999. [2] K. Ren, C. Y. Wu, and L. C. Zhang,“The restriction on delta-I noise along the power/gorund layer in the high-speed digital printed circuit board,”in Proc. IEEE Int. Electromagn. Compat. Symp., Denver, CO, Aug. 1998, pp.511-516. [3] T. Sudo, H. Sasaki, N. Masuda, and J. L. Drewniak,“Electromagnetic interference (EMI) of system-on-package (SOP),”IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 304-314, May 2004. [4] T. L. Wu, S. T. Chen, J. N. Hwang, and Y. H. Lin,“Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference plances of high-speed PCB,”IEEE Trans. Electromagn. Compat., vol. 46, no. 2, pp. 33-45, Feb. 2004. [5] S. Radu and D. Hockanson,“An investigation of PCB radiated emissions form simultaneous switching noise,”in Proc. IEEE Int. Electromagn. Compat. Symp., 1999, pp. 893-898. [6] Jongbae Park, Myunghyun Ha, Qin Li, “DDR Memory Channel Design from Passive Stub Equalizer Perspective,” DesignCon 2013 [7] Ki Hyuk Kim, Pavle Milosevic, and José E. Schutt-Ainé, “Cut-off Frequency Enhanced Hybrid Electromagnetic Bandgap (EBG) Structures with Wideband Noise Suppression Characteristics,” Antennas and Propagation Society International Symposium, 2007 IEEE, pp. 2913-2916 [8] S. Rylove, S. Reynolds, D. Storaska, B. Floyed, M. Kapur, T. Zwick,S. Gowda, and M. Sorna, “10+ Gbps 90-nm CMOS serial link demo inCBGA package,” IEEE J. Solid-State Circuits, vol. 40, no. 9, pp. 1987–1991, Sep. 2005. [9] ”Signal Integrity - Simplified”, Eric Bogatin, Prentice Hall PTR, 2003 [10] J. Liu and X. Lin, “Equalization in high-speed communication systems,” IEEE Circuits Syst. Mag., vol. 4, no. 2, pp. 4–17, 2004. [11] J. Fan, X. Ye, J. Kim, B. Alchambeault, and A. Orlandi, “Signal integrity design for high-speed digital circuits: progress and directions,” IEEE Trans. Electromagn. Compat., Vol. 52, No. 2, p. 392-400, May. 2010 [12] J. Shin and K. Aygun, “On-package continuous-time linear equalizer using embedded passive components,” in Proc. IEEE Symp. Electr. Perform. Electron. Packag., Oct., 2007, pp. 147–150. [13] Maxim Integrated Products, “Designing a simple, small, wide-band andlow-power equalizer for FR4 copper links,” in Proc. DesignCon, 2003,pp. 1–14. [14] R. M. Kurzrok, (2004, Oct.). “A review of key equalizer specifications and what they mean,” High Freq. Electron. Mag., vol. 3, no. 9, pp. 50–52. [Online]. Available: http://www.highfrequencyelectronics.com/Archives/Oct04/HFE1004_Kurzrok.pdf [15] K. J. Lee, S. Bhattacharya, M. Varadarajan, L. Wan, I. R. Abothu, V. Sundaram, P. Muthana, D. Balaraman, P. M. Raj, M. Swaminathan, S. Sitaraman, and R. Tummala, “Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates,” in Proc. IEEE Proc. Adv. Packag. Mater., Mar. 2005, pp. 249–254. [16] B. T. Etienne and P. A. Sandborn, “Optimizing embedded passive content in printed circuit boards,” IEEE Trans. Electron. Packag. Manuf., vol. 30,no. 4, pp. 246–257, Oct. 2007. [17] J. Lee, S. Ahn, S. Baek, Y. Kim, C. K. Yoon, and J. Kim, “Design and estimation of embedded passives in multiple line grid array (MLGA) package,” in Proc. IEEE Proc. Electron. Mater. Packag., Nov. 2000, pp. 340–345. [18] Y.-J Cheng,H-H Chuang,C-K Cheng,T-L Wu, , “Novel Differential-Mode Equalizer With Broadband Common-Mode Filtering for Gb/s Differential-Signal Transmission,” IEEE Trans. Compon. Packag. Manuf. Technol., vol. pp, no.99 2013 [19] Jongbae Park, Myunghyun Ha, Qin Li, “DDR Memory Channel Design from Passive Stub Equalizer Perspective,” DesignCon 2013 [20] E. Song, J. Cho, J. Kim, Y. Shim, G. Kim, and J. Kim, “Modeling and design optimization of a wideband passive equalizer on PCB based onnear-end crosstalk and reflections for high-speed serial data transmis-sion,” IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 410–420, May 2010. [21] M. Swaminathan, and A. E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Prentice-Hall, 2007 [22] 黃峻南,“多層高速數位電路板中接地彈跳雜訊對電源品質及其電磁輻射效應之模擬及量測,”中山大學碩士論文第三章,3.1~3.7, June 2002. [23] 張信珉,“新寬頻電磁能隙(EBG)結構以抑制地彈雜訊之研究,”中山大學碩士論文, April 2004. [24] E. Yablonovitch, ” photonic band-gap structures” J.Opt.Soc.Amer. B,Opt.Phys.,vol.10, pp.283-295, Feb.1993. [25] D. Sievenpiper, R. Broas, and E. Yablonovitch,“Antennas on high-impedence ground planes,”1999 IEEE MTT-S Digest, vol. 3, pp.1245-1248,June 1999. [26] D. Sievenpiper, L. Zhang, R. Broas, N. Alexopolous, and E. Yablonovitch,“High impedance electromagnetic surfaces with a forbidden frequency band,”IEEE Trans. Microw. Theory Tech., vol.47, no.11, pp.2059-2074, November 1999. [27] D.Sievenpiper, H. Hsu, J. Schaffner, G. Tangonan, R. Garcia, and S. Ontiveros,“Low-profile,four-sector diversity antenna on high-impedance ground plane, Electronics Letters, vol.36, no.16, pp.1343-1345, August 2000. [28] T. Kamgaing, and O. M. Ramahi,“A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface,”IEEE Microw. Wireless Compon. Lett., vol. 13, no.1, pp. 21-23, January 2003. [29] S. Shahparnia, and O. M. Ramahi,“Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces,”Electron. Lett., vol. 40, no. 2,pp. 98-100, Jan. 2004. [30] X. H. Wang, B. Z. Wang, Y. H. Bi, and W. Shao,“A Novel Uniplanar Compact Photonic Bandgap Power Plane With Ultra-Broadband Suppression of Ground Bounce Noise,”in IEEE Microw. Wireless Comp. Lett., vol. 16, no. 5, pp. 267-268, May 2006. [31] J. Qin, O. M. Ramahi,and V. Granatstein,“Novel Planar Electromagnetic Bandgap Structures for Mitigation of Switching Noise and EMI Reduction in High-Speed Circuits,”in IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp.661-669, Aug. 2007. [32] S. H. Joo, D. Y. Kim, and H. Y. Lee,“A S-Bridge Inductive Electromagnetic Bandgap Power Plane for Suppression of Ground Bounce Noise,”in IEEE Microw. Wireless Comp. Lett., vol. 17, no. 10, pp.709-711, Oct. 2007. [33] T.-L. Wu, Y.-H. Lin, T.-K. Wang, C.-C. Wang, and S.-T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” IEEE Trans. Microw. Theory Tech. (SCI, NSC 93-2213-E-110-010), vol. 53, no. 9, pp. 2935-2942, Sept. 2005
|