|
[1] D.B. Miracle, T. Egami, K.M. Flores, K.F. Kelton, MRS bulletin, 32 (2007) 629-634. [2] A. Hirata, L. Kang, T. Fujita, B. Klumov, K. Matsue, M. Kotani, A. Yavari, M. Chen, Science, 341 (2013) 376-379. [3] Y. Yokoyama, N. Nishiyama, K. Fukaura, H. Sunada, A. Inoue, (1999). [4] A. Inoue, Materials Science and Engineering: A, 304 (2001) 1-10. [5] M. Janik-Czachor, Materials Science and Engineering: A, 179–180, Part 1 (1994) 142-146. [6] J.F. Loffler, Intermetallics, 11 (2003) 529-540. [7] W. Klement, R. Willens, P. Duwez, (1960). [8] H.S. Chen, D. Turnbull, Acta Metallurgica, 17 (1969) 1021-1031. [9] H.S. Chen, Acta Metallurgica, 22 (1974) 1505-1511. [10] A. Inoue, T. Zhang, T. Masumoto, Materials transactions, JIM, 30 (1989) 965-972. [11] A. Inoue, A. Kato, T. Zhang, S.G. Kim, T. Masumoto, Materials Transactions, JIM, 32 (1991) 609-616. [12] T. Zhang, A. Inoue, T. Masumoto, Materials Transactions, JIM, 32 (1991) 1005-1010. [13] D. Turnbull, Contemporary physics, 10 (1969) 473-488. [14] S. Buzzi, K. Jin, P.J. Uggowitzer, S. Tosatti, I. Gerber, J.F. Loffler, Intermetallics, 14 (2006) 729-734. [15] B. Zberg, P.J. Uggowitzer, J.F. Loffler, Nature Materials, 8 (2009) 887-891. [16] J. Schroers, Q. Pham, A. Desai, Microelectromechanical Systems, Journal of, 16 (2007) 240-247. [17] J. Chu, H. Wijaya, C. Wu, T. Tsai, C. Wei, T. Nieh, J. Wadsworth, Applied physics letters, 90 (2007) 034101. [18] F. Qin, M. Yoshimura, X. Wang, S. Zhu, A. Kawashima, K. Asami, A. Inoue, Materials Transactions, 48 (2007) 1855-1858. [19] C.W. Chu, J.S.C. Jang, S.M. Chiu, J.P. Chu, Thin Solid Films, 517 (2009) 4930-4933. [20] J. Yao, C. Hostert, D. Music, A. Frisk, M. Bjorck, J. Schneider, Scripta Materialia, 67 (2012) 181-184. [21] T.M. Yue, Y.P. Su, H.O. Yang, Materials Letters, 61 (2007) 209-212. [22] T.M. Yue, Y.P. Su, Journal of Materials Science, 42 (2007) 6153-6160. [23] S. Ningshen, U. Kamachi Mudali, R. Krishnan, B. Raj, Surface and Coatings Technology, 205 (2011) 3961-3966. [24] H. Chou, J. Huang, L. Chang, Surface and Coatings Technology, 205 (2010) 587-590. [25] P.S. Chen, H.W. Chen, J.G. Duh, J.W. Lee, J.S.C. Jang, Surface and Coatings Technology, 231 (2013) 332-336. [26] J.P. Chu, JOM, 61 (2009) 72-75. [27] J.P. Chu, C.T. Lo, Y.K. Fang, B.S. Han, Applied Physics Letters, 88 (2006) -. [28] J.P. Chu, C.T. Liu, T. Mahalingam, S.F. Wang, M.J. O’Keefe, B. Johnson, C.H. Kuo, Physical Review B, 69 (2004) 113410. [29] J. Rivory, J. Frigerio, M. Harmelin, A. Quivy, Y. Calvayrac, J. Bigot, Thin Solid Films, 89 (1982) 323-327. [30] R. Schwarz, W. Johnson, Physical Review Letters, 51 (1983) 415. [31] Y. Liu, S. Hata, K. Wada, A. Shimokohbe, Japanese Journal of Applied Physics, 40 (2001) 5382. [32] S. Hata, K. Sato, A. Shimokohbe, Asia Pacific Symposium on Microelectronics and MEMS, International Society for Optics and Photonics, 1999, pp. 97-108. [33] S. Hata, T. Kato, T. Fukushige, A. Shimokohbe, Microelectronic engineering, 67 (2003) 574-581. [34] C.R. Pichard, C.R. Tellier, A.J. Tosser, Thin Solid Films, 62 (1979) 189-194. [35] I. Park, S.H. Ko, H. Pan, C.P. Grigoropoulos, A.P. Pisano, J.M. Frechet, E.S. Lee, J.H. Jeong, Advanced Materials, 20 (2008) 489-496. [36] K. Takenaka, N. Saidoh, N. Nishiyama, A. Inoue, Nanotechnology, 22 (2011) 105302. [37] C.L. Chiang, J.P. Chu, F.X. Liu, P.K. Liaw, R.A. Buchanan, Applied Physics Letters, 88 (2006) 131902. [38] C. Lee, J. Chu, W. Chang, J. Lee, J. Jang, P. Liaw, Thin Solid Films, (2013). [39] J. Jayaraj, D.J. Sordelet, D.H. Kim, Y.C. Kim, E. Fleury, Corrosion Science, 48 (2006) 950-964. [40] J.P. Chu, T.Y. Liu, C.L. Li, C.H. Wang, J.S. Jang, M.J. Chen, S.H. Chang, W.-C. Huang, Thin Solid Films, (2013). [41] H.W. Chen, K.C. Hsu, Y.C. Chan, J.G. Duh, J.W. Lee, J.S.C. Jang, G.J. Chen, Thin Solid Films, (2013). [42] M.L. Lee, K.K. Win, C.L. Gan, L.P. Shi, Intermetallics, 18 (2010) 119-122. [43] K. Takenaka, N. Togashi, N. Nishiyama, A. Inoue, Intermetallics, 18 (2010) 1969-1972. [44] S.P. Murarka, Materials Science &; Engineering R, 19 (1997) 87-151. [45] A.A. Istratov, E.R. Weber, Journal of The Electrochemical Society, 149 (2002) G21. [46] S.S. Wong, C. Ryu, H. Lee, A.L. Loke, K.W. Kwon, S. Bhattacharya, R. Eaton, R. Faust, B. Mikkola, J. Mucha, Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International, IEEE, 1998, pp. 107-109. [47] C.A. Chang, Journal of Applied Physics, 67 (1990) 566. [48] C. Lee, Y.L. Kuo, JOM, 59 (2007) 44-49. [49] ITRS, International Technology Roadmap for Semiconductors web site, http://public.itrs.net/ [50] N. Gjostein, Diffusion, ASM, Metals Park, Ohio, 1973, 241-274, (1973). [51] M. Hecker, R. Hubner, J. Acker, V. Hoffmann, N. Mattern, R. Ecke, S. Schulz, H. Heuer, C. Wenzel, H.J. Engelmann, Advanced Barriers for Copper Interconnects, Materials for Information Technology, Springer, 2005, pp. 283-295. [52] G. He, L. Yao, Z. Song, Y. Li, K. Xu, Vacuum, 86 (2012) 965-969. [53] K. Holloway, P.M. Fryer, C. Cabral, J.M.E. Harper, P.J. Bailey, K.H. Kelleher, Journal of Applied Physics, 71 (1992) 5433. [54] H. Yan, Y.Y. Tay, Y. Jiang, N. Yantara, J. Pan, M.H. Liang, Z. Chen, Applied Surface Science, 258 (2012) 3158-3162. [55] H. Ono, T. Nakano, T. Ohta, Applied physics letters, 64 (1994) 1511-1513. [56] S.Y. Chang, C.E. Li, S.C. Chiang, Y.C. Huang, Journal of Alloys and Compounds, 515 (2012) 4-7. [57] M.B. Takeyama, M. Sato, E. Aoyagi, A. Noya, Japanese Journal of Applied Physics, 49 (2010) 05FA06. [58] J. Reid, E. Kolawa, C. Garland, M.A. Nicolet, F. Cardone, D. Gupta, R. Ruiz, Journal of applied physics, 79 (1996) 1109-1115. [59] M. Ostling, S. Nygren, C.S. Petersson, H. Norstrom, R. Buchta, H.O. Blom, S. Berg, Thin Solid Films, 145 (1986) 81-88. [60] J. Li, H.S. Lu, Y.W. Wang, X.P. Qu, Microelectronic Engineering, 88 (2011) 635-640. [61] S.M. Yi, K.H. Jang, J.U. An, S.S. Hwang, Y.C. Joo, Microelectronics Reliability, 48 (2008) 744-748. [62] S. Tsukimoto, T. Kabe, K. Ito, M. Murakami, Journal of Electronic Materials, 36 (2007) 258-265. [63] S.M. Yi, J.U. An, S.S. Hwang, J.R. Yim, Y.H. Huh, Y.B. Park, Y.C. Joo, Thin Solid Films, 516 (2008) 2325-2330. [64] M.H. Tsai, C.W. Wang, C.H. Lai, J.W. Yeh, J.Y. Gan, Applied Physics Letters, 92 (2008) 052109. [65] J.S. Chen, J. Wang, Journal of The Electrochemical Society, 147 (2000) 1940-1944. [66] C.S. Chen, C.P. Liu, Journal of non-crystalline solids, 351 (2005) 3725-3729. [67] J.P. Chu, C.Y. Wang, L. Chen, Q. Chen, Surface and Coatings Technology, 205 (2011) 2914-2918. [68] J.P. Chu, J.C. Huang, J.S.C. Jang, Y.C. Wang, P.K. Liaw, JOM, 62 (2010) 19-24. [69] Y.L.Chou, J.P. Chu, V.S. John, MRS-T Annual meeting, 333 (2007). [70] B. Liu, D. Zhao, J. Xing, L. Yang, X. Zhang, J. Guo, X. Li, L. Ma, X. Zhang, Applied Physics A, 111 (2013) 841-844. [71] Y. Wang, F. Cao, M.L. Zhang, L. Shao, X.C. Li, Electrochemical and Solid-State Letters, 13 (2010) H128-H130. [72] P. Majumder, R. Katamreddy, C. Takoudis, Electrochemical and Solid-State Letters, 10 (2007) H291-H295. [73] N. Dalili, Q. Liu, D.G. Ivey, Journal of Materials Science, 48 (2013) 489-501. [74] D.C. Tsai, Y.L. Huang, S.R. Lin, D.R. Jung, S.Y. Chang, Z.C. Chang, M.J. Deng, F.S. Shieu, Surface and Coatings Technology, 205 (2011) 5064-5067. [75] Z. Lu, C. Liu, Acta Materialia, 50 (2002) 3501-3512. [76] D.A. Glocker, S.I. Shah, W.D. Westwood, Handbook of thin film process technology, Institute of Physics Pub., 1995. [77] T. Simes, S. Mellor, D. Hills, The Journal of Strain Analysis for Engineering Design, 19 (1984) 135-137. [78] W.D. Nix, Metallurgical transactions A, 20 (1989) 2217-2245. [79] D. Joslin, W. Oliver, Journal of Materials Research, 5 (1990) 123-126. [80] J. Pethicai, R. Hutchings, W. Oliver, Philosophical Magazine A, 48 (1983) 593-606. [81] W.C. Oliver, G.M. Pharr, Journal of materials research, 7 (1992) 1564-1583. [82] S.V. Hainsworth, H.W. Chandler, T.F. Page, Journal of Materials Research, 11 (1996) 1987-1995. [83] R.C. Chang, F.Y. Chen, C.E. Sun, Key Engineering Materials, 326 (2006) 357-360. [84] S. Bull, D. Rickerby, Surface and Coatings Technology, 42 (1990) 149-164. [85] S. Bull, Surface and Coatings Technology, 50 (1991) 25-32. [86] C.S. Chen, P. Yiu, C.L. Li, J.P. Chu, C.H. Shek, C.H. Hsueh, Materials Science and Engineering: A, 608 (2014) 258–264.. [87] P.S. Chen, H.W. Chen, J.G. Duh, J.W. Lee, J.S.C. Jang, Applied Physics Letters, 101 (2012) 181902. [88] C.Y. Chuang, J.W. Lee, C.L. Li, J.P. Chu, Surface and Coatings Technology, 215 (2013) 312-321. [89] P. Coddet, F. Sanchette, J. Rousset, O. Rapaud, C. Coddet, Surface and Coatings Technology, 206 (2012) 3567-3571. [90] Y.L. Deng, J.W. Lee, B.S. Lou, J.G. Duh, J.J. Chu, J.S.C. Jang, Surface and Coatings Technology, (2014). [91] E. Niu, L. Li, G. Lv, H. Chen, X. Li, X. Yang, S. Yang, Applied Surface Science, 254 (2008) 3909-3914. [92] I. Grimberg, V. Zhitomirsky, R. Boxman, S. Goldsmith, B. Weiss, Surface and Coatings Technology, 108 (1998) 154-159. [93] L. Hultman, Vacuum, 57 (2000) 1-30. [94] K.A. Gingerich, The Journal of Chemical Physics, 49 (2003) 14-18. [95] A. Horling, J. Sjolen, H. Willmann, T. Larsson, M. Oden, L. Hultman, Thin Solid Films, 516 (2008) 6421-6431. [96] C.H. Ma, J.H. Huang, H. Chen, Thin Solid Films, 418 (2002) 73-78. [97] H.M. Tung, J.H. Huang, D.G. Tsai, C.F. Ai, G.P. Yu, Materials Science and Engineering: A, 500 (2009) 104-108. [98] W. LaFontaine, B. Yost, C.Y. Li, Journal of Materials Research, 5 (1990) 776-783. [99] G.M. Pharr, W.C. Oliver, MRS Bulletin, 17 (1992) 28-33. [100] H. Chou, J. Huang, L. Chang, T. Nieh, Applied Physics Letters, 93 (2008) 191901. [101] A. Inoue, H.M. Kimura, T. Zhang, Materials Science and Engineering: A, 294–296 (2000) 727-735. [102] F. Zeng, Y. Gao, L. Li, D.M. Li, F. Pan, Journal of Alloys and Compounds, 389 (2005) 75-79. [103] H. Sheng, W. Luo, F. Alamgir, J. Bai, E. Ma, Nature, 439 (2006) 419-425. [104] S. Nowak, P. Ochin, A. Pasko, O. Maciejak, P. Aubert, Y. Champion, Journal of Alloys and Compounds, 483 (2009) 139-142. [105] C. Schuh, T. Nieh, Acta Materialia, 51 (2003) 87-99. [106] P. Burnett, D. Rickerby, Thin solid films, 154 (1987) 403-416. [107] S. Orimo, H. Fujii, T. Yoshino, Journal of alloys and compounds, 217 (1995) 287-294. [108] W. Fang, J. Wickert, Journal of Micromechanics and Microengineering, 6 (1996) 301. [109] R. Ploc, Journal of Nuclear Materials, 99 (1981) 124-128. [110] V. Uglov, V. Anishchik, V. Khodasevich, Z.L. Prikhodko, S. Zlotski, G. Abadias, S. Dub, Surface and Coatings Technology, 180 (2004) 519-525. [111] B.S. Suh, S.M. Choi, Y. Wee, J.E. Lee, J. Lee, S.J. Lee, S.G. Lee, H. Shin, N.I. Lee, H.K. Kang, Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International, IEEE, 2005, pp. 138-140. [112] M.B. Takeyama, T. Itoi, E. Aoyagi, A. Noya, Applied Surface Science, 190 (2002) 450-454. [113] M. Hecker, R. Hubner, Advanced Interconnects for ULSI Technology, (2012) 193-234. [114] A. Mayadas, M. Shatzkes, Physical Review B, 1 (1970) 1382. [115] S.H. Kim, K.T. Nam, A. Datta, K.B. Kim, Journal of applied physics, 92 (2002) 5512-5519. [116] D. Escobar, R. Ospina, A. Gomez, E. Restrepo-Parra, P. Arango, Materials Characterization, 88 (2014) 119-126. [117] C.Y. Yang, J. Jeng, J.S. Chen, Thin Solid Films, 420 (2002) 398-402. [118] C.Y. Yang, J.S. Chen, Journal of the Electrochemical Society, 150 (2003) G826-G830. [119] J. Murray, Bulletin of alloy phase diagrams, 4 (1983) 81-95. [120] K. Zeng, M. Hamalainen, H. Lukas, Journal of phase equilibria, 15 (1994) 577-586. [121] R. Arroyave, T. Eagar, L. Kaufman, Journal of alloys and compounds, 351 (2003) 158-170. [122] D.B. Butrymowicz, J.R. Manning, M.E. Read, Journal of Physical and Chemical Reference Data, 4 (1975) 177-250. [123] V.I. Trofimov, I.V. Trofimov, J.I. Kim, Thin Solid Films, 495 (2006) 398-403. [124] X. Wei, L. Shi, T.C. Chong, R. Zhao, H.K. Lee, Japanese journal of applied physics, 46 (2007) 2211. [125] N. Ohshima, Journal of applied physics, 79 (1996) 8357-8363.
|