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研究生:巫宜頻
研究生(外文):Yi-Pin Wu
論文名稱:金/錫-鋅合金/銅三明治反應偶之界面反應
論文名稱(外文):Interfacial Reactions of the Au/Sn-xZn/Cu sandwich structure couples
指導教授:顏怡文
指導教授(外文):Yee-Wen Yen
口試委員:顏怡文
口試委員(外文):Yee-Wen Yen
口試日期:2014-01-10
學位類別:碩士
校院名稱:國立臺灣科技大學
系所名稱:材料科學與工程系
學門:工程學門
學類:材料工程學類
論文種類:學術論文
論文出版年:2014
畢業學年度:102
語文別:中文
論文頁數:114
中文關鍵詞:錫-鋅合金界面反應
外文關鍵詞:Sn-Zn alloysinterfacial reactions
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本研究將兩種不同厚度的Sn-xZn(x=1、5、9、20與40 wt%)銲料分別與Au及Cu兩種常見的導線材製做成三明治反應偶,於160oC下進行20至1000小時的界面反應。
結果顯示,在Sn-1Zn系統中,與Au端反應後界面主要生成Au-Sn二元系統的介金屬相,並且Cu原子會擴散至Au端反應生成Cu6Sn5相;當Zn含量增加至20與40 wt%後,界面則是以Au-Zn二元相為主。然而在Sn-5Zn/Au與Sn-9Zn/Au反應偶中,因為存在Zn含量分布不均的情況,故在界面處會同時觀察到有Au-Sn與Au-Zn兩種系統的相生成以及一個Au-Sn-Zn三元介穩相。
而與Cu端反應的結果中,只有Sn-1Zn/Cu反應偶界面有CuZn及Cu6Sn5相生成,當Zn含量增加後,界面則轉變成以Cu5Zn8相為主。當時效效時間增長後,Sn-xZn/Au反應偶之介金屬相也隨之變厚,且在Zn含量小於20 wt%的系統中,可發現Cu原子會逐漸固溶入介金屬相中。Sn-xZn/Cu反應偶的部分則是隨時效時間增長,Cu5Zn8相會有明顯的熟化現象。當銲料厚度變厚時,會使Cu原子擴散至Au端的情況變慢,但並無造成生成相的轉變,而是僅有固溶入介金屬相的時間點不同。
In this study, the Sn-xZn solders (x=1, 5, 9, 20 and 40 wt%) with two kinds of thickness and the Au and Cu metals were prepared to form sandwich reaction couples then aged at 160oC for 20 to 1000 h.
The results showed that the Au-Sn binary phases were form at the Sn-1Zn/Au interface and Cu diffused to the Au side to form Cu6Sn5 phase. When the Zn content increased to 20 and 40 wt%, there were Au-Zn binary phases form at the interface. But the Sn-5Zn/Au and Sn-9Zn/Au couples, there were Au-Sn, Au-Zn binary phases and also a Au-Sn-Zn ternary metastable phase form at the interface simultaneously.
To react with Cu substrate, the CuZn and Cu6Sn5 phases were found at the Sn-1Zn/Cu couple. And the IMC transformed into Cu5Zn8 phase when the Zn content increased. When aged for a long time, the IMCs became thicker than before. Besides, the Cu dissolves into the IMCs when Zn content less than 20 wt%. At the Sn-xZn/Cu reaction couples, there were significantly ripening phenomenon at the Cu5Zn8 phase with increasing of the aging time. And the diffusion rate of Cu was decreased with increasing the thickness of solders. This did not cause any phase transitions, but the Cu would dissolved into the IMCs at different aging times.
目 錄
摘要
Abstract
誌謝
目錄
圖目錄
表目錄
第一章、前言
第二章、文獻回顧
2-1 電子構裝概論
2-1.1 覆晶接合技術
2-2 無鉛銲料簡介
2-3 界面反應與擴散理論
2-3.1 界面反應理論
2-3.2 擴散理論
2-4 界面反應相關文獻
2-4.1 Sn-Cu/Au系統界面反應
2-4.2 Sn-Zn/Au系統界面反應
2-4.3 Sn-Zn/Cu系統界面反應
2-4.4 相關系統界面反應
第三章、實驗方法
3-1 Sn-xZn合金與Au、Cu基材製備
3-2 Au/Sn-xZn/Cu反應偶製備
3-3 金相處理
3-4界面觀察與分析
第四章、結果與討論
4-1 Au/Sn-xZn/Cu之界面反應(銲料厚度為0.5 mm)
4-1.1 Au/Sn-xZn/Cu(x=1 wt%)反應偶
4-1.2 Au/Sn-xZn/Cu(x=5與9 wt%)反應偶
4-1.3 不同Zn含量對Sn-xZn/Au界面反應之影響
4-2 Au/Sn-xZn/Cu之界面反應(銲料厚度為1 mm)
4-2.1 Au/Sn-xZn/Au(x=1 wt%)反應偶
4-2.2 Au/Sn-xZn/Cu(x=5與9 wt%)反應偶
4-3 Au/Sn-xZn/Cu(x= 20與40 wt%)之界面反應
4-3.1 Au/Sn-xZn/Cu(x= 20 wt%)反應偶
4-4 Au/Sn-xZn/Cu反應偶之界面反應路徑
4-4.1 Sn-1Zn/Au反應偶
4-4.2 Sn-xZn/Au(x=5與9 wt%)反應偶
4-4.3 Sn-xZn/Au(x=20與40 wt%)反應偶
4-3.4 Sn-xZn/Cu(x=1、5、9、20與40 wt%)之反應路徑
4-5 不同銲料厚度對生成介金屬相的影響
4-5.1 Sn-1Zn/Au反應偶
4-4.2 Sn-5Zn/Au與Sn-9Zn/Au反應偶
4-4.3 Sn-20Zn/Au與Sn-40Zn/Au反應偶
4-4.4 Sn-xZn/Cu(x=1、5、9、20與40 wt%)反應偶
第五章、結論
參考文獻
參考文獻
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