臺灣博碩士論文加值系統

隨著電子產品縮小化的驅勢，積體化被動元件如電阻、電感、和電容的需求越來越大，旋轉塗佈玻璃(SOG)材料是一種半導體常用的介電絕緣材料，可以使用塗佈製程以降低製作成本，且其介電特性也很穩定。本論文以研究SOG材料為介電層，在矽基板上製作積體化的薄膜電容。實驗中利用電子顯微鏡(SEM)研究不同烘烤溫度對SOG材料結構的影響以及利用C-V特性量測研究不同SOG製程參數對電容元件之電容特性的影響，由實驗結果得知，SOG烘烤的溫度420℃ 30分鐘可以穫得SOG介電常數3.8。本論文中也同時評估SOG積體化電容對於未來IC封裝製程的應用。

Integrated passive components such as resistors, inductors and capacitors are attracted interest to IC packaging industry for requirement of miniaturizing the size and weight of system assembly. In this paper, we demonstration the fabrication of an integrated capacitor by using SOG (spin on glass) as the insulating material which are expected to enhance the capacitor characteristics; especially to achieve high dielectric constant and to simply the process flow and cost. In this thesis we demonstrated the fabrication of an integrated capacitor using SOG as the dielectric material. The results of SOG dielectric layer characterization by using scanning electron microscopy (SEM), and capacitance-voltage (C-V) characteristic measurement were present. It shows that the relative dielectric constant of the SOG layer can achieve as high as 3.8 by annealed at 420 C0 for 30 minutes. In conclusion, the issues of applications of this integrated SOG capacitor to the development of advanced IC package industry were discussed.
Keyword: SOG (spin on glass)，E-beam or E-Gun Coater，Capacitance，Passive Components

誌謝 I
中文摘要 II
英文摘要 III
目錄 IV
表目錄 VII
圖目錄 VIII
第一章 緒論 1
1.1 研究背景 1
1.2被動元件簡介 3
1.2.1、電容(Capacitor,C) 3
1.3 SMT (Surface Mount Technology) 簡介 5
第二章 SOG材料介紹 15
2. 1 SOG 相關文獻 15
2. 2 SOG 簡介 16
2.3 SOG 材料特性 18
2.4 SOG材料種類 22
第三章 實驗儀器與製程流程 23
3.1 SOG電容製作流程之介紹 23
3.2 積體化電容元件製作流程 26
3.2.1 晶片切割與清洗 26
3.3.2 沈積薄膜 29
3.3.2-1 電子束蒸鍍系統 30
3.2.3 薄膜退火 33
3.2.4 Al/Si合金接觸電極製作 36
3.2.5 Al/Insulation 接觸電極製作 37
3.2.6 SOG(Sol-Gel) 38
3.2.7 定義電容絕緣層 39
3.2.8 定義電容電極 41
第四章 實驗結果與討論 44
4.1 檢測 44
4.1.1 掃描式電子顯微鏡(SEM) 46
第五章 結論與未來展望 53
參考文獻 54

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