臺灣博碩士論文加值系統

利用具不同特性(密度、熱傳導率、熱膨脹係數及孔隙率)之普通、堇青石、氧化鋁及碳化矽陶瓷作為導熱膠膜之填料，且以無電鍍法將奈米金屬銅和銀塗佈在各式陶瓷表面上，以增加填料之熱傳導率。XRD光譜圖顯示，使用無電鍍法塗佈在陶瓷上的奈米銅和銀之粒徑大小分別為17-22和23-28 nm，即使具有孔洞之普通及碳化矽陶瓷亦可以利用無電鍍法在表面塗佈奈米金屬顆粒。由FE-SEM發現奈米顆粒塗佈在各式陶瓷時會產生團聚和堆疊現象，然而，銅和銀粒子皆塗佈至陶瓷上。熱傳導係數提升之另一影響因素為陶瓷之熱膨脹係數及熱傳導係數，由於熱能傳輸大部分於顆粒表面，所以氧化鋁陶瓷在323和343 K的熱膨脹可增加熱傳導途徑。在303-343 K下，添加塗佈10%銅和3.4%銀的氧化鋁陶瓷至導熱黏膠之熱傳導係數為0.419-0.458 W/mK，而導熱黏膠膜之熱傳導係數僅有0.200 W/mK。在銅和銀雙金屬塗佈在普通陶瓷表面，最佳濃度為10%銅和3.4%銀，且雙金屬層厚度為~30 nm。

Ordinary, cordierite, alumina, and silicon carbide ceramics different from density, thermal conductivity, thermal expansion, and pore are utilized to be fillers for the thermal pad. Copper (Cu) and silver (Ag) nanoparticles can be coated on the surface of various ceramics with electroless to promote the thermal conductivity. By X-ray diffraction (XRD), grain sizes of Cu and Ag nanoparticles coated on various ceramics are 17-22 and 23-28 nm, respectively. Even porous ordinary and silicon carbide ceramics can also be coated metal nanoparticles on the surface. We found that aggregation of nanoparticles stack up on the surface of various ceramics by field-emission scanning electron microscope (FE-SEM). However, coated Cu and Ag disperse well on ceramics. The effect of temperature on thermal conductivity is depended on thermal conductivity and thermal expansion of ceramic. Due to heat transport on surfaces of particles, expansion of alumina ceramic can increase pathways at 323 and 343 K. The thermal conductivity of alumina ceramic coated 10% of Cu and 3.4% of Ag in the thermal pad are 0.419-0.458 W/mK at 303-343 K. Note that the thermal conductivity of thermal pad is only 0.200 W/mK. Optimal of coated metal concentrations are 10% of Cu and 3.4% of Ag on ordinary ceramic. Moreover, the thickness of bimetal layer is ~30 nm.

摘要 i
Abstract ii
謝誌 iii
目錄 iv
圖目錄 vii
表目錄 x
第一章、前言 1
1.1研究緣起 1
1.2研究目的 2
1.3研究內容 3
第二章、文獻回顧 5
2.1產業對於熱界面材料的需求 5
2.1.1 熱傳遞現象 8
2.1.2 接觸熱阻 10
2.1.3 熱界面材料的種類 14
2.1.4熱界面材料之成份及特性需求 20
2.2 廢棄陶瓷 23
2.2.1 陶瓷的特性及應用 23
2.3 塗佈技術 28
2.3.1 化學氣相沉積法 28
2.3.2 磁控濺鍍法 30
2.3.3 溶膠凝膠法 32
2.3.4 無電鍍技術 35
第三章 實驗材料、設備與方法 39
3.1 實驗樣品製備流程 39
3.1.2 無電鍍法塗佈銅在陶瓷表面 39
3.1.3無電鍍法塗佈銀及共同塗佈銅和銀在陶瓷表面 41
3.1.4 含揮發液之市售導熱黏膠的固體含量 45
3.1.5添加已塗佈金屬之陶瓷在導熱黏膠之製備 46
3.2 實驗藥品及設備 47
3.2.1 實驗藥品 47
3.2.2 實驗設備 48
3.3分析儀器 49
3.3.1 X光繞射儀 49
3.3.2 原子吸收光譜儀 50
3.3.3 感應偶合電漿質譜儀 50
3.3.4 比表面積分析儀 51
3.3.5 場效發射式掃描電子顯微鏡 52
3.3.6 X射線光電子能譜儀 53
3.3.7 熱傳導係數分析儀 53
第四章 結果與討論 55
4.1改質之廢棄普通和碳化矽陶瓷的熱傳導機制研究 55
4.2溫度對改質之廢棄氧化鋁和堇青石陶瓷的熱傳導影響 71
4.3添加塗佈不同濃度之銅銀陶瓷在導熱膠之熱傳導機制 89
4.4添加塗佈多種銅晶粒尺寸之普通陶瓷在導熱膠的熱傳導性影響 99
4.5塗佈銅和銀雙金屬之普通陶瓷以單或雙粒徑添加至導熱膠之熱傳導機制研究 108
第五章　結論與建議 117
5.1結論 117
5.2 建議 120
參考文獻 121
附錄 126

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