本技術論文主要以減少光阻的浪費率及成本支出，但在研究構想中會因減量塗佈而產生的不穩定手指狀、塗佈不完整的鋸齒狀及膜厚度不均勻的色差現象，製程中採用稀釋液(OK73)預塗，其用意是潤滑晶圓表面流暢度並改善塗佈缺陷狀況，另一方面進而減少光阻廢液對環境的汙染。
研究中是針對綠色層的負型光阻液進行減量，過程中改變塗佈方式，在條件4中，以中心點利用稀釋液(OK73)快速旋轉以1000 rpm/sec塗佈的方式預塗，再以慢速40 rpm/sec旋轉從中心點往外3公分光阻塗佈後以1250 rpm/sec甩開。其慢速塗佈稀釋液(OK73) 預塗晶圓表面的步驟，一來可改善晶圓表面的乾澀現象，二來可避免光阻減量後出現光阻量不足的鋸齒及色差現象，最後執行膜厚度的量測。對照組的膜厚平均值(Mean)為9319.16及間距差值(Range)為385.65，與實驗組的膜厚平均值(Mean)為9317.15與間距差值(Range)為381.17相近，且在對照組的標準差值與實驗組的標準差值也是最相近。從實驗結果得知條件4的膜厚是最穩定度的(對照組標準差Mean: 16.05、Range:14.15；實驗組標準差Mean: 18.44、Range:12.94)，最後再以玻璃片來驗證穿透率，其對照組的穿透率為92.98%；實驗組中連續用三片的玻璃片來驗證條件4的穩定性，其穿透率為93.17 %、92.79 %、92.97 %。

In order to reduces photoresist waste rate and costs in this technical papers. Because research plan and appear Finger-like instability、poor coating and discolor condition. Both are reduction photoresist endures one. On the other hand, and thereby reducing environmental pollution waste photoresist.
Study is carried out for the negative photoresist decrement green layer, and chance coating condition in the process. Precoating solvent (OK73) do spin speed 1000 rpm/sec and use spin speed 40 rpm/sec slowly coating photoresist from the center out 3 cm distance, and final use spin speed 1250 rpm/sec throw off photoresist. In process add OK73 coating steps on the wafer surface. The first, can improvement condition on wafer surface, second avoid result photo resist poor coating and discolor one. In conclusion, execute film thickness trace on wafer surface. In experiment four, use solvent precoating、spin speed 1250 rpm/sec and volume 4.0ml conditions. The average film thickness data 9319.16 and range 385.65 of the standard (STD), and design of experiments (DOE) data 9317.15, range 831.17 both close. STD and DOE standard deviation both near. We are knows experiment result stable in experiment four. (STD standard deviation average film thickness data 16.05 and range 14.15；DOE standard deviation data 18.44 and range 12.94). The final, use glass wafer traces transmittance. STD transmittance data 92.98 %；DOE use three glasses wafer trace experiment four condition and stable, and transmittance data are 93.17 %、92.79 % and 92.97 %.

摘要......................................Ⅰ
Abstract......................................Ⅱ
誌謝.................................................Ⅲ
目錄.................................................Ⅳ
圖目錄...............................................Ⅵ
表目錄..............................................Ⅸ
第一章 緒論............................1
1-1 微影製程簡介.................................2
1-2 光阻劑的簡介及發展.......................4
1-3 光阻特性........................7
1-4 光阻旋轉塗佈特性....................8
1-5 研究動機與目的...........................11
1-6 研究架構..............................12
第二章 實驗設備與方法...........................13
2-1 實驗設備.................................13
2-2 實驗方法................................16
2-2-1 手臂夾取Nozzle位置點的調整........16
2-2-2 光阻量變動的參數及條件..............18
2-2-3 製程步驟說明與流程分析............23
第三章 結果與討論..............................28
3-1 光阻塗佈製程條件結果......................28
3-2 光阻減量實驗分析結果......................40
3-3 原子力顯微鏡量測結果.......................41
3-4 掃瞄式電子顯微鏡量測結果...................44
3-5 塗佈後檢測..................................45
3-6 顯影後檢測.................................46
3-7 穿透率....................................47
第四章 結論...................................49
參考文獻.........................................50

圖目錄
圖1-1 顏料分散法(蝕刻法)製造彩色濾光片的流程.......2
圖1-2 微影製程之流程.............................4
圖1-3 正負型光阻劑之組成成分.....................5
圖1-4 正負型光阻之原理..........................6
圖2-1 TEL ACT塗佈機..........................13
圖2-2 TEL ACT顯影機..........................13
圖2-3 Canon曝光機............................14
圖2-4 Olympus AFM電子顯微鏡.................14
圖2-5 Olympus CD-SEM光學顯微鏡..............14
圖2-6 膜厚機台................................15
圖2-7 LVmicroZ 穿透率機台.....................15
圖2-8 Nozzle Tip 位置至中心點..................16
圖2-9 手臂在製程過程中移動示意圖.................17
圖2-10 確認RRC Tip位置至中心點.................17
圖2-11 確認光阻噴量(左圖4.0 CC、右圖 4.5 CC)..19
圖2-12 光阻塗佈方式示意圖......................24
圖2-13 49點膜厚量測分佈圖..................24
圖2-14 實驗步驟流程圖.......................26
圖2-15 製程流程圖................................27
圖3-1 5.0CC/1300rpm 製程加工轉速示意圖.........28
圖3-2 5.0CC/1300rpm 的膜厚分佈點...............29
圖3-3 4.5CC/1250rpm 製程加工轉速示意圖.........30
圖3-4 4.5CC/1250rpm 的膜厚分佈點...............30
圖3-5 4.5CC/1300rpm RRC製程加工轉速示意圖.....32
圖3-6 4.5CC/1300rpm RRC製程的膜厚分佈點......32
圖3-7 4.0CC/1250rpm RRC製程加工轉速示意圖....34
圖3-8 4.0CC/1250rpm RRC製程的膜厚分佈點......34
圖3-9 3.5CC/1200rpm RRC製程加工轉速示意圖.....36
圖3-10 3.5CC/1200rpm RRC製程的膜厚分佈點.......36
圖3-11 3.0CC/1150rpm RRC製程加工轉速示意圖.....38
圖3-12 3.0CC/1150rpm RRC製程的膜厚分佈點......38
圖3-13 改善光阻減量塗佈方式.....................41
圖3-14 STD AFM 影像圖.......................42
圖3-15 STD AFM 3D表面成像圖................42
圖3-16 DOE AFM 影像圖....................... 43
圖3-17 DOE AFM 3D表面成像圖.................43
圖3-18 STD CD-SEM 像數線寬...................44
圖3-19 DOE CD-SEM 像數線寬...................45
圖3-20 (左)量不足產生的鋸齒狀;(右)塗佈色差.........45
圖3-21 利用不同光源檢測缺陷......................46
圖3-22 綠色顏色層穿透率分析圖...................48

表目錄
表2-1 化學品性質成分表............................18
表2-2 1300rpm/5.0CC製程實驗參數條件..............19
表2-3 1250rpm/4.5CC製程實驗參數條件..............20
表2-4 1300rpm/4.5CC 製程實驗參數條件..............21
表2-5 1250rpm/4.0CC 製程實驗參數條件..............21
表2-6 1200rpm/3.5CC 製程實驗參數條件..............22
表2-7 1150rpm/3.0CC 製程實驗參數條件..............23
表3-1 實驗組1300rpm/5.0C以10筆樣本數的平均值....29
表3-2 實驗組1250rpm/4.5C以10筆樣本數的平均值....31
表3-3 實驗組1300rpm/4.5C以10筆樣本數的平均值....33
表3-4 實驗組1250rpm/4.0C以10筆樣本數的平均值....35
表3-5 實驗組1200rpm/3.5C以10筆樣本數的平均值....37
表3-6 實驗組1150rpm/3.0C以10筆樣本數的平均值....39
表3-7 STD與DOE實驗結果總表.....................40
表3-8 ACI及ADI檢測塗佈狀況.....................46
表3-9 實驗塗佈後量測的穿透率數值...................47

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