跳到主要內容

臺灣博碩士論文加值系統

(44.200.169.3) 您好!臺灣時間:2022/12/04 09:52
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果 :::

詳目顯示

我願授權國圖
: 
twitterline
研究生:黃建翔
研究生(外文):Jian-Siang Huang
論文名稱:雷射隱形切割藍寶石基板研究
論文名稱(外文):An Investigation on Laser Stealth dicing cut on Sapphire Substrates
指導教授:徐祥禎徐祥禎引用關係
指導教授(外文):Hsiang-Chen Hsu
學位類別:碩士
校院名稱:義守大學
系所名稱:機械與自動化工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2015
畢業學年度:103
語文別:中文
論文頁數:61
中文關鍵詞:皮秒雷射藍寶石基板參數設計深寬比夾治具
外文關鍵詞:picosecond Lasersapphire substratedesign of experimentstealth dicing
相關次數:
  • 被引用被引用:2
  • 點閱點閱:925
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:2
本研究目的在於使用皮秒雷射切割藍寶石基板(Sapphire Substrate),包含隱形切割LED使用之藍寶石晶圓(Sapphire Wafer)和智慧手持裝置的藍寶石玻璃(Sapphire Glass),探討雷射的基礎研究與應用開發。雷射切割實驗的參數設計是以切割功率(power)、脈衝重複率(pulse repetition rate)、切割速度(speed)、焦距位置(defocus)、指數(index)組合搭配,並使用掃描式電子顯微鏡(SEM)觀察皮秒雷射對於藍寶石材料加工後的切割道線寬(kerf width)、切割深度(depth)、深寬比(aspect ratio)與熱影響(heat effect)。實驗結果顯示功率與脈衝重複率對藍寶石基板的深寬比有較重要的影響,焦距位置、指數則較無關聯。切割速度在特殊情況下,尤以翹曲的藍寶石晶圓,需要特別設計的夾治具來固定與平整,發現切割速度影響隱形切割的結果。本研究進行系列的實作實驗,得到最佳化的製程參數,提供產業界應用。

In this research, an advanced picosecond Laser has been applied to machine sapphire substrate, such as sapphire wafer and sapphire glass, to investigate the fundamental theorem as well as industrial application on Laser technique. Parameters used on design of experiment (DOE) are power, pulse repetition rate, speed, defocus and index. The quality of machined surface, such as kerf width, depth, aspect ratio as well as heat effects has been carefully investigated by scanning electron microscope (SEM). Among those DOE parameters power and pulse repetition rate play important roles in lasering sapphire substrate and the cutting speed is the key factor in stealth dicing (SD) in warped sapphire wafer with special self-designed fixture. Parameters of defocus and index show irrelevant to depth of cut and kerf width. The insight of pico second Laser technology has been explored in this paper. A series of comprehensive experiments has been conducted and the results can be easily applied to the optimal design rules.

摘要 I
Abstract II
誌 謝 III
總目錄 IV
圖目錄 VI
表目錄 VIII
第一章 緒論 1
1-1前言 1
1-2研究目的1
1-3文獻回顧3
1-4論文架構9
第二章 雷射原理10
2-1雷射 10
2-1-1雷射的歷史10
2-2雷射光的基本現象11
2-3雷射光的特性12
2-4原子的能階[18]13
2-4-1原子的結構13
2-4-2原子能階13
2-5居量反轉15
2-6共振腔[19]16
2-6-1共振腔基本結構16
2-6-2雷射振盪的過程17
2-6-3共振腔穩定條件18
2-7活性介質20
2-8雷射的運作與分類21
2-9 Q開關(Q switch)22
2-10鎖模技術(Mode locking)22
第三章 皮秒雷射與雷射加工23
3-1皮秒雷射[21] 23
3-2雷射加工條件25
3-3雷射切槽加工(Laser grooving process)26
3-4隱形切割加工(Stealth dicing process)27
3-5測量儀器28
3-6實驗步驟與實驗流程29
第四章 實驗結果與討論31
4-1前言 31
4-2能量實驗(Energy experiments)31
4-3脈衝重複率實驗(Pulse repetition rate experiments )34
4-4隱形切割實驗(Stealth dicing experiments)37
4-4-1解決材料翹曲問題 39
4-4-2切割速度對Sapphire wafer的影響40
4-5藍寶石玻璃(Sapphire Glass)43
第五章 結論與未來展望46
5-1結論 46
5-2未來展望47
文獻參考48

[1] K. Koyama,H. Aida,S.W. Kim,K. Ikejiri,T. Doi,T. Yamazaki. 2014 .“Growth of thick GaN layers on laser-processed sapphire substrate by hydride vapor phase epitaxy”,Journal of Crystal Growth,Volumes 403,pp.38-42
[2] H. Aida,N. Aota,H. Takeda,K. Koyama. 2012 .“Control of initial bow of sapphire substrates for III-nitride epitaxy by internally focused laser processing”,Journal of Crystal Growth,Volumes 361,pp.135-141
[3] M.S. Akselrod,F.J. Bruni. 2012 .“Modern trends in crystal growth and new applications of sapphire”, Journal of Crystal Growth,Volumes 360,pp.134-145
[4] L. Kuna,C. Sommer,F. Reil,J.R. Krenn,P. Hartmann,P. Pachler,H. Hoschopf,F.P. Wenzl. 2012 .“Femtosecond laser processing as a versatile tool for advanced solid state lighting sources: From efficacy enhancement to colour temperature control”,Applied Surface Science,Volumes 258,pp.9213-9217
[5] S. Zhou,B. Cao,S. Liu,H. Ding. 2012 .“Improved light extraction efficiency of GaN-based LEDs with patterned sapphire substrate and patterned ITO”,Optics & Laser Technology, Volumes 44,pp.2302-2305
[6] H. Park,K.J. Byeon,J.J. Jang,O. Nam,H. Lee. 2011 .“Enhancement of photo- and electro-luminescence of GaN-based LED structure grown on a nanometer-scaled patterned sapphire substrate”, Microelectronic Engineering, Volumes 88,pp.3207-3213
[7] http://www.disco.co.jp/
[8] A. Shamir,A.A. Ishaaya. 2013 .“Large volume ablation of Sapphire with ultra-short laser pulses”,Applied Surface Science,Volumes 270, pp.763-766
[9] F. Dausinger,H. Hügel,V. Konov. 2002 .“Micro-machining with ultrashort laser pulses: From basic understanding to technical applications, International Conference on Advanced Laser Technologies,Volumes 5147
[10] H. Varel,M. Wähmer,A. Rosenfeld,D. Ashkenasi,E.E.B. Campbell. 1998 .“Femtosecond laser ablation of sapphire: time-of-flight analysis of ablation plume”,Applied Surface Science,Volumes 127-129,pp.128-133
[11] R. Stoian, H. Varel,A. Rosenfeld ,D. Ashkenasi,R. Kelly,E.E.B. Campbell. 2000 .“Ion time-of-flight analysis of ultrashort pulsed laser-induced processing of Al2O3”,Applied Surface Science,Volumes 165,pp.44-45
[12] T.C. Chen,R.B. Darling. 2008 .“Laser micromachining of the materials using in microfluidics by high precision pulsed near and mid-ultraviolet Nd:YAG lasers”, journal of materials processing technology,Volumes 198,pp.248-253
[13] J. Han,C. Li,M. Zhang,H. Zuo,S. Meng. 2009 .“An investigation of long pulsed laser induced damage in sapphire”, Optics & Laser Technology,Volumes 41,pp.339-344
[14] R. Vilar,S.P. Sharma,A. Almeida,L.T. Cangueiro,V. Oliveira. 2014 .“Surface morphology and phase transformations of femtosecond laser-processed sapphire”,Applied Surface Science,Volumes 288,pp.313-323
[15] G. Savriama,V. Jarry,L. Barreau,C. Boulmer-Leborgne,N. Semmar. 2014 .“A novel patterning effect during high frequency laser micro-cutting of hard ceramics for microelectronics applications”,Applied Surface Science, Volumes 302,pp.163-168
[16] W.Z. Tawfik,S.J. Bae,S.W. Ryu,T. Jeong,J.K. Lee. 2014 . “Effect of residual compressive stress on near-ultraviolet InGaN/GaN multi-quantum well light-emitting diodes” Optical Materials,Volumes 38,pp.131-136
[17] 陳柏勳,「皮秒雷射應用於硬脆材料切割之探討」,義守大學機械與自動化工程學系碩士論文,民國一O一年七月。
[18] 張國順,”現代雷射製造技術”,新文京開發出版股份有限公司,初版,2008/01。
[19] 楊國輝、黃宏彥,”雷射原理與量測概論”,五南文化事業機構,2008/12
[20] 榮伯鈞,「先進雷射技術應用於半導體之劃線製成研究」,義守大學機械與自動化工程學系碩士論文,民國一O三年七月。
[21] 吳士傑、趙偉克、周毓麒,「皮秒雷射與電子材料微加工之應用」,機械工業雜誌323 期,2010/02。
[22] 閻吉祥,”雷射原理與技術”,新文京開發出版股份有限公司,初版,2007/09。
[23] 杜聰敏,”超快雷射應用於玻璃切割之探討”,義守大學機械與自動化工程學系碩士論文,2010/07。
[24] 吳宗憲,”CO2雷射加工藍寶石基板之研究”,國立雲林科技大學機械工程系碩士文

QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top