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研究生:施岳池
研究生(外文):SHIH,YUE-CHIH
論文名稱:微撓性垂直式探針機械特性分析及測試方法
論文名稱(外文):Mechanical Feature Analysis And Test Method The Micro Flexible Vertical Type Probes
指導教授:王海王海引用關係
指導教授(外文):WANG,HAI
口試委員:陳俊生彭坤增劉晉奇
口試委員(外文):Chen,Chun ShengPeng,Kun ChengJin-Chee, Liu
口試日期:2015-03-24
學位類別:碩士
校院名稱:明志科技大學
系所名稱:機械工程系機械與機電工程碩士班
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2015
畢業學年度:103
語文別:中文
論文頁數:97
中文關鍵詞:微機電製程微型燒錄探針
外文關鍵詞:MEMS Manufacturing ProcessMicro Burner Probes
相關次數:
  • 被引用被引用:1
  • 點閱點閱:276
  • 評分評分:
  • 下載下載:36
  • 收藏至我的研究室書目清單書目收藏:0
本研究延續歷代學長之微撓性垂直式探針最佳化設計及製程優化之研究,並且目前已成功將前三代MEMS微機電系統製程之微撓性垂直式探針研究議題於最佳化設計及製程改善帶入至機械特性分析及燒錄測試研究,並架設探針燒錄測試設備及測試平台,建立探針機械特性測試方法及相關實驗項目。

論文研究前先針對探針端及固定端光罩設計上之瑕疵做改善,使得MEMS微機電製程中可順利進行不破壞光阻,提高光阻模型的平坦度、電鑄完成後的探針之剝離率;並且針對MEMS微機電製程上之實驗參數及製作流程做優化改善。

完成MEMS微機電系統製程取下微撓性垂直式探針後將進行探針燒錄測試,於探針接觸力測試實驗中察覺探針受力後各區段變形量均集中在Y方向探針長度上,故於製作IC測試固定座時增加導孔片之設計以方形導孔及圓形導孔來引導探針燒錄方向,且於有無使用導套之探頭偏位量實驗中驗證其優化率約65%。無使用導套之偏位量測試於26次中才取得10筆有效數據;使用導套後將探針接觸率優化率為100%,故整體優化率會較65%再高上許多。

In this study, Owing to the probe size were micro, we employed the MEMS process. For the sake of the uniformity of all probes mechanical property test, we designed the mask including three different size of probe in one MEMS process. The goal of this study is to find the ideal MEMS process, all manufacturing parameters were conducted and evaluated in order to develop a prototype of a micro probe card.

We have improved probes fabrication from those manufacturing parameters experiments that included three categories, first was to flatten the photoresist spreading model by two-stage spinning operation, second was to improve the stripping shortcoming of electroforming metal from wafer seed layer, third was to reduce the ratio of probes shape incomplete. We also proposed the mechanism of probes mechanical property test, it included mechanical behavior test and fatigue test.

Finally, according to specific micro burner IC, the study fabricates flexible micro-probe cards and applies Voice Coil Motor (VCM), Load cell and micro-ohmmeter to research on fatigue life testing, probe mechanical properties and electrical characteristics of the probe testing method with regard to flexible probe.

明志科技大學碩士學位論文指導教授推薦書 i
明志科技大學碩士學位論文口試委員會審定書 ii
誌謝 iii
中文摘要 iv
Abstract v
目錄 vi
表目錄 viii
圖目錄 ix
第一章 緒論 1
1.1 研究背景及動機 1
1.2 探針卡發展概述 2
1.3 相關文獻探討 11
1.4 研究目的及其重要性 17
第二章 探針尺寸外形設計及結構理論 18
2.1 探針尺寸外形設計 18
2.2 探針結構理論 20
第三章 探針端及固定端光罩製作 21
3.1 燒錄IC選用 21
3.2 光罩製作參數 23
3.3 探針配置規劃 25
3.4 探針端與固定端光罩設計要點 27
第四章 探針製程實驗參數 29
4.1 製程設備及光阻溶劑 30
4.2 鈦鎳Wafer前處理製程 32
4.3 探針端KMPR光阻製程 34
4.4 精密電鍍製程 42
4.5 固定端SU-8光阻製程 44
第五章 燒錄測試設備及架構 50
5.1 燒錄組件架構 51
5.2 探針燒錄設備 54
5.3 量測儀器 57
第六章 燒錄測試方法及實驗項目 61
6.1 燒錄測試方法 61
6.2 量測尺寸定義 64
6.3 實驗項目 68
第七章 結論與未來展望 91
7.1 結論 91
7.2 未來研究方向 93
參考文獻 94

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