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研究生:劉振宇
研究生(外文):Cheng-Yu Liu
論文名稱:低溫基板黏接鍵合應用於砷化鎵微碟共振腔垂直耦合
論文名稱(外文):Vertically Coupled GaAs Microdisk Resonators by Low Temperature Adhesive Wafer Bonding
指導教授:毛明華毛明華引用關係
指導教授(外文):Ming-Hua Mao
口試委員:林浩雄黃鼎偉
口試委員(外文):Hao-Hsiung LinDing-Wei Huang
口試日期:2015-07-30
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:電子工程學研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2015
畢業學年度:103
語文別:中文
論文頁數:47
中文關鍵詞:微碟共振腔垂直耦合基板鍵合砷化鎵波導
外文關鍵詞:MicrodiskVertical couplingWafer bondingGaAsWaveguide
相關次數:
  • 被引用被引用:2
  • 點閱點閱:69
  • 評分評分:
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:0
  在本篇論文中,我們使用苯環丁烯進行低溫基板黏接鍵合,將具有氮化矽波導的砷化鎵樣品黏接鍵合到矽基板上,並使用檸檬酸蝕刻液選擇性蝕刻砷化鎵/砷化鋁鎵,移除了砷化鎵基板,然後製作出與波導垂直耦合的微碟共振腔。
  我們進行了直徑50μm的微碟共振腔和波導之水平相對位置變化與耦合行為的探討,我們從穿透頻譜得到其模態間距約為3nm,由於其模態間距較小,模態結構複雜,頻譜難以分析。
  因此我們製作了直徑20μm的微碟共振腔,並進行其與波導水平相對位置變化與耦合行為的探討,從穿透頻譜得到其模態間距約為9.41nm,並且找到最高的Q值出現在重疊3.7μm時,其Q值達到17800。


  In this thesis, we bonded a GaAs sample with SiNx waveguides onto a Si substrate by a low temperature adhesive wafer bonding method with benzocyclobutene. Then, we removed the GaAs substrate using citric acid to selectively etch GaAs against the AlGaAs layer. Thus, we successfully fabricated GaAs microdisks vertically coupled with SiNx waveguides.
  We investigated the coupling behavior due to different lateral positions between waveguides and microdisks of 50μm in diameter. The free spectral range is about 3nm, which is rather small and results in a complicated modal structure.
  Therefore, we fabricated microdisks of 20μm in diameter and discuss its coupling behavior when the lateral position between the microdisk and the waveguide is changed. The free spectral range is increased to 9.41nm. The lateral position with highest quality factor of 17800 is achieved when the microdisk overlaps with the waveguide by 3.7μm.


目錄
口試委員會審定書 i
誌謝 ii
摘要 iii
Abstract iv
第一章緒論 1
1.1積體光路簡介 1
1.2波導與微型共振腔簡介 2
1.3垂直耦合與水平耦合 3
1.4低溫基板黏接鍵合技術 5
1.5 研究動機 7
第二章理論分析 8
2.1波導 8
2.2迴音廊模態 10
2.3品質因子 14
第三章實驗製程 15
3.1材料選用 15
3.2實驗製程 15
第四章穿透頻譜量測分析 21
4.1量測架構 21
4.2波導和共振腔之耦合與其水平相對位置探討 22
4.2.1 直徑50μm的微碟共振腔之探討 23
4.2.2直徑20μm的微碟共振腔之探討 28
第五章結果與討論 44
5.1結果討論 44
5.2未來方向 45
參考文獻 46

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