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研究生:林承宥
研究生(外文):Chang-Yu Lin
論文名稱:多層印刷電路板走線之電磁輻射快速預測方法
論文名稱(外文):Fast EMI Analysis for Multilayer PCB Routing
指導教授:吳瑞北
口試委員:吳宗霖王文山林丁丙劉家驄
口試日期:2015-06-26
學位類別:碩士
校院名稱:國立臺灣大學
系所名稱:電信工程學研究所
學門:工程學門
學類:電資工程學類
論文種類:學術論文
論文出版年:2015
畢業學年度:103
語文別:中文
論文頁數:68
中文關鍵詞:電磁干擾接地彈跳雜訊空腔共振器模型接地連通柱
外文關鍵詞:cavity resonator modelelectromagnetic interference(EMI)ground bounceshorting vias
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本論文主要內容是針對多層結構的印刷電路板所造成的電磁干擾問題做分析與探討。主要可以分成兩個部分。
第一個部分為板邊輻射的部分,由於許多訊號層所產生的接地彈跳雜訊,使得電磁波在板內來回傳播反射,並在邊緣產生等效的磁流,進而產生遠場輻射。本論文除了利用空腔振盪器模型結合市售模擬軟體SIwave來預測板邊輻射外,也提出了利用接地連通柱在板邊加一圈的方法來抑制板邊輻射並給予最佳化設計。
第二個部份是表面輻射,首先利用電磁理論的方法推導出單一微帶線之遠場輻射方程式,並利用SIwave取得端電壓和端座標,即可得到最後整個空間的電磁輻射效應。再結合天線陣列因子的概念可以得到一般印刷電路板走線的遠場總輻射估計,另外此方法的時間也較市售模擬軟體SIwave與HFSS來得快速。此外,也適用於一般常見的差模訊號線與共模訊號線。
最後,整合表面輻射和板邊輻射,並利用全波模擬軟體和GHz橫向電磁波傳輸室量測來驗證其分析之準確性及接地連通柱設計。


This thesis focuses on the problems of Electromagnetic Interference(EMI)of multilayer Printed Circuit Board ( PCB ), and it can be separated into two parts.
First part is edge radiation which is mostly contributed to the ground bounce noise of PCB arising from current flowing through vias or the signal trace crossing slot lines. The electromagnetic waves reflecting back and forth from edges of the substrate generate a standing wave, which creates effective magnetic currents causing serious EMI issues. Here, the cavity resonator model is used to predict the edge radiation. This thesis also proposed using stitching vias around the PCB to suppress the edge radiation, thereby leading to the optimal design of shorting vias is given.
Second part is surface radiation. Based on electromagnetic theory, a closed-form formula for far field radiation by a straight microstrip transmission line section is derived. The far field information can be obtained by combining SIwave, which gives the node voltage and location information of routing. The total radiation prediction of general PCB routing can also be obtained by applying the concept of array factor in antenna theory. The simulation time of this method is faster than HFSS and SIwave and furthermore, this method can be applied in common differential and common-mode signals.
Finally, this thesis integrates the surface and edge radiation. Full-wave simulation and GTEM Cell measurement are used to validate the accuracy of the proposed analysis and shorting via design.


目  錄
摘  要 ii
Abstract iii
目 錄iv
圖  例 vi
表  格 x
第一章 研究動機與簡介 1
1-1 研究動機 1
1-2 文獻回顧與探討 2
1-3 章節概要 3
1-4 貢獻 4
第二章 多層印刷電路板輻射場理論背景 5
2-1 空腔共振模型之遠場輻射分析 5
2-2 格林函數基本闡述 7
2-3 利用短路連通柱抑制板邊輻射之介紹 9
第三章 多層印刷電路板板邊輻射分析與抑制 14
3-1 多層電路板的簡化 14
3-2 三層印刷電路板知共模與差模模態總輻射功率分析 15
3-3 電磁模擬與理論分析驗證 19
3-4 印刷電路板堆疊方式對板邊輻射討論 25
第四章 多層印刷電路板微帶線走線之表面輻射分析 30
4-1 微帶線走線之輻射分析 30
4-2 電磁模擬與理論驗證 35
4-3 一對耦合並排微帶線遠場輻射分析與模擬驗證 38
4-4 實際一對訊號結構之模擬驗證 41
4-5 實際DDR3走線模擬驗證與時間比較 46
第五章 模擬結果與量測比較討論 50
5-1 GTEM實際量測與模擬的修正 50
5-2 表面輻射的模擬與量測 56
5-3 結合表面輻射與板邊輻射的模擬與量測 58
第六章 結論與未來工作 64
6-1 結論 64
6-2 未來工作 65
參考文獻 66


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