[1] D. B. Tuckerman and R. Pease, High-performance heat sinking for VLSI, Elec-tron Device Letters, IEEE, vol. 2, pp. 126-129, 1981.
[2] W. Qu and I. Mudawar, Analysis of three-dimensional heat transfer in mi-cro-channel heat sinks, International Journal of Heat and Mass Transfer, vol. 45, pp. 3973-3985, 2002.
[3] P.-S. Lee, S. V. Garimella, and D. Liu, Investigation of heat transfer in rectangular microchannels, International Journal of Heat and Mass Transfer, vol. 48, pp. 1688-1704, 2005.
[4] P.-S. Lee and S. V. Garimella, Thermally developing flow and heat transfer in rectangular microchannels of different aspect ratios, international journal of heat and mass transfer, vol. 49, pp. 3060-3067, 2006.
[5] 鄭偉成, 毫米流道熱沉孔內奈米微粒/相變化微膠囊懸浮液之強制對流特性研究, 成功大學機械工程學系學位論文,2000.
[6]S. Choi, Enhancing thermal conductivity of fluids with nanoparticles, ASME-Publications-Fed, vol. 231, pp. 99-106, 1995.
[7] Lee, J., Mudawar, I., Assessment of the Effectiveness of Nanofluids for Sin-gle-Phase and Two-phase Heat Transfer in Micro-channels, International Journalog Heat and Mass Transfer,Vol.50,pp.452-463,2007.
[8] 郭育惟, 毫米流道熱沉內相變化材料奈米膠囊/奈米微粒懸浮液強制對流熱散逸特性之數值模擬, 成功大學機械工程學系學位論文, pp. 1-112, 2014.
[9] P. Keblinski, S. Phillpot, S. Choi, and J. Eastman, Mechanisms of heat flow in suspensions of nano-sized particles (nanofluids), International journal of heat and mass transfer, vol. 45, pp. 855-863, 2002.
[10] J. A. Eastman, S. Phillpot, S. Choi, and P. Keblinski, Thermal transport in nanofluids 1, Annu. Rev. Mater. Res., vol. 34, pp. 219-246, 2004.
[11] J. C. Maxwell, A treatise on electricity and magnetism vol. 1: Clarendon press, 1881.
[12] R. Hamilton and O. Crosser, Thermal conductivity of heterogeneous two-component systems, Industrial & Engineering chemistry fundamentals, vol. 1, pp. 187-191, 1962.
[13] K. Khanafer and K. Vafai, A critical synthesis of thermophysical characteristics of nanofluids, International Jornal of Heat and Mass Trans-fer,vol.54,pp.4410-4428,2011
[14] 魏連晉, 微流道熱沉內奈米流體之強制對流熱傳實驗研究,碩士論文,機械工程所,國立成功大學,1997.[15] Xuan, Y., Li, Q ., Investigation on Convective Heat Transfer and Flow Features of Nanofluids, ASME J. Heat Transfer,Vol.125,pp.151-155,2003.
[16]Setoh, G., Tan, F.L. and Fork,S.C., Experimental studies on the use of a phase change material for cooling mobile phones,International Communications in Heat and Mass Transfer,Vol.37,pp.1403-1410,2010.
[17]Ceron, I., Neila, J. and Khayet, M., Experimental title with phase change mate-rials(PCM) for building use, Energy and buildings, Vol.36,pp.572-578,2011.
[18]Wu, S., Fang, G. and Liu, X., Dynamic discharging characteristics simulation on solar heat storage system with spherical capsules using paraffin as heat storage mate-rial, Renewable Energy,Vol.36,pp.1190-1195,2011
[19]C.J Ho, A continuum model for transport phenomena in convective flow of sol-id-liquid phase change material suspensions, Applied mathematical model-ing,vol.29,pp.805-817,2005.
[20] M. Harhira, S. K. Roy, and S. Sengupta, Natural convective heat transfer from a vertical flat plate with phase change material suspensions, Journal of Enhanced Heat Transfer,vol.4,1997.
[21]C. J. Ho and F. J. Tu, Visualization and prediction of natural convection of water near its density maximum in a tall rectangular enclosure at high rayleigh numbers, Journal of Heat Transfer,vol.123,p.84,2001.
[22]C. J. Ho and F. Lin, Numerical simulation of three-dimensional incompressible flow by a new formulation, International Jonrnal for Numerical Methods in Fluids, vol.23,pp.1073-1084,1996.
[23]C. Popiel and J. Wojtkowiak Simple formulas for thermophysical properties of liquid water for heat transfer caculations(from 0C to 150C),Heat Transfer Engineer-ing,vol.19,pp.87-101,1998.
[24]C. Ho, A continuum model for transport phenomena in convective flow of sol-id–liquid phase change material suspensions, Applied mathematical modelling, vol. 29, pp. 805-817, 2005.
[25]C.-J. Ho, J. Lin, and S. Chiu, Heat transfer of solid–liquid phase-change material suspensions in circular pipes: effects of wall conduction, Numerical Heat Transfer, Part A, vol. 45, pp. 171-190, 2004.