本研究根據之前所發展的接觸轉印與遮罩植入式顯影劑技術(Contact transferred and Mask Embedded Lithography)，分別於平面與曲面的玻璃基板上進行週期性陣列式次微米抗反射結構，增加其光學效益。實驗步驟首先是於基板表面上轉印奈米金屬點陣列，並利用這些金屬點作為蝕刻遮罩，對基板進行乾式蝕刻製程完成次微米抗反射結構製作，利用這些結構外型造成漸變折射率效果，減少光學反射、增加基板穿透率、消除眩光現象等。本研究同時搭配有限元素軟體COMSOL Multiphysics®進行結構尺寸與光學參數的分析，輔助設計所需抗反射結構的尺寸。
實驗製程上，先以高分子材料(PDMS)對矽模仁翻模獲得實驗所需的軟性模仁，接著利用金屬轉印方式於平面光學玻璃上佈值週期300nm、線寬200nm之六角最密堆積排列奈米金屬點陣列，後續利用感應耦合電漿離子蝕刻系統(ICP)進行乾式蝕刻，調整蝕刻氣體流量、射頻功率與蝕刻時間，成功於平面玻璃上蝕刻出上寬200 nm、下寬290 nm、高度由 120 nm、150 nm、180 nm、200 nm的半椎狀外貌，完成次微米抗反射結構製作。並利用分光光譜儀量測此單面抗反射結構的光學玻璃穿透率，其最大穿透率增益效果約3.4%。接著利用軟性模仁易撓曲貼附凹凸表面的特性，於曲率25.8 mm，直徑12.7 mm曲面平凸透鏡上進行抗反射結構製作，目的在不影響透鏡原本的成像品質下，增加光學穿透率、並減少眩光的產生。本實驗技術再於搭配金屬轉印與乾式蝕刻製程，能輕易的製作奈米等級的結構達到抗反射效果，此成果應用層面甚廣，例如手機、相機的鏡頭、顯示器、提升太陽能電池效率等。

This paper fabricates anti-reflection nanostructures on planar and curved glass substrates based on contact transferred and masked embedded Lithography (CMEL). It utilizes UV-PDMS molds replicated from silicon molds to transfer metallic and patterned nano-disks to a thin photoresist film coated on a glass substrate. These arrayed metallic nano-disked are used as the etching barrier in dry etching process. After O_2 plasma and CF_4 plasma etching, nanostructures can be successfully fabricated on glass substrates. These truncated conical nanostructures are hexagonally arrayed with a center-to-center pitch of 300 nm, 150 nm in height, 200 nm in upper pillar diameter, and 290 nm in bottom pillar diameter. By spectrophotometer, the transmittance of glass with single sided anti-reflection increase 3.4 %. Furthermore, using the flexible UV-PDMS mold to contact a curved glass substrate, anti-reflection nanostructures are formed by CMEL process to increase the optical transmission and obtain anti-glare effect on the curved glass surface. Applications of this work can be found in a broad range of optical system such as camera or cellphone lenses, optical lenses, absorption enhancement of solar cell, and improving transmittance of optical systems.

摘要 I
Abstract III
誌謝 IX
目錄 X
圖目錄 XIII
表目錄 XVI
第一章 緒論 1
1.1 前言 1
1.2 文獻回顧 2
1.2.1抗反射結構外型 2
1.2.2平面抗反射結構製程方法 3
1.2.3曲面抗反射結構製程方法 6
1.3 論文架構 10
第二章　次微米結構模擬與設計 11
2.1 次微米圖形與COMSOL介紹 11
2.2 模型建立與邊界條件設定 11
2.3 參數與尺寸設定 13
2.4 模擬結果 14
第三章　實驗架構與設備 16
3.1 介紹 16
3.2 壓印模仁製備 17
3.2.1 Si模仁製備 17
3.2.2 PDMS軟性模仁製備 20
3.3 接觸轉印與遮罩植入式顯影技術 23
3.3.1 壓印基板準備 23
3.3.2 雙層抽真空轉印系統 26
3.4 離子電漿乾式蝕刻 29
3.4.1 電漿蝕刻機介紹 29
3.4.2 電漿蝕刻機蝕刻製程 30
3.4.3 平面次微米結構蝕刻與量測 32
3.4.4 曲面次微米結構蝕刻與量測 33
3.4.5 結論 37
第四章　光學量測與模擬分析 38
4.1 平面玻璃穿透光譜量測與討論 38
4.2 曲面玻璃光學量測與討論 42
第五章　結論與未來展望 49
5.1 結論 49
5.2 未來展望 50
參考文獻 52

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