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研究生:謝康明
研究生(外文):HendrikHartono
論文名稱:以熱氧化法於銅線上生成氧化銅奈米線
論文名稱(外文):Growth of Copper Oxide Nanowires on a Copper Wire via Thermal Oxidation
指導教授:吳明勳吳明勳引用關係林大惠林大惠引用關係
指導教授(外文):Ming-Hsun WuTa-Hui Lin
學位類別:碩士
校院名稱:國立成功大學
系所名稱:機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2016
畢業學年度:104
語文別:英文
論文頁數:92
中文關鍵詞:氧化銅奈米線熱氧化法銅線熱重分析掃描電子顯微鏡能量色散X-射線光譜
外文關鍵詞:Copper oxide nanowirethermal oxidationcopper wirethermogravimetric analysisSEM-EDS
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在本研究,熱氧化法的溫度,時間以及氧氣濃度對氧化銅奈米線生長的影響在銅線表面上進行了研究。利用掃描式電子顯微鏡(SEM)拍攝氧化銅奈米線圖像的密度,直徑與長度。氧化過程中的增重在熱重量分析進行定量。在氧化銅增重數據發現,在溫度低於500 oC,銅線表面上的氧化銅奈米線生長相對緩慢,氧化速率高於此溫度時漸漸增加。SEM照片顯示,氧化銅奈米線較長在高溫,但是,奈米線的密度比較低在600 oC。另一方面,氧化時間沒有顯著影響奈米線的長度,但影響奈米線密度的分佈。使用不同的氧氣濃度奈米線的幾何形狀沒有顯著變化。熱重分析獲得銅線重量增加服從拋物線氧化速率法。阿瑞尼斯曲線能大致被分為三個區域:高溫區域(550 oC到700 oC),中溫度區(400 oC到550 oC),以及低溫度區域(325 oC到400 oC)。
氧化銅還原為銅在化學鏈燃燒應用的初步結果已獲得在本研究。在本實驗顯示化學放熱反應發生在約700 oC。這可能是化學鏈燃燒良好的條件。
In this study, the influences of temperature, duration and oxygen concentration on the growth of copper oxide nanowires on the surface of a copper wire through thermal oxidation method were studied. Scanning electron microscope (SEM) images were taken to reveal the density, diameter and length of the nanowires. The weight gain during the oxidation process were quantified with thermogravimetric analysis. It was found that nanowire growth on the copper wire surface was relatively slow for temperatures below 500 oC, and the oxidation rate increased monolithically above this threshold temperature. SEM images showed that the CuO nanowires were longer at high temperatures, however, the density of the nanowires was lower at 600 oC comparing to 400 oC and 500 oC. Oxidation duration, on the other hand, did not significantly affect the length of nanowire, but the distribution of the nanowire density. There were no significant changes on nanowires geometry using different oxygen concentration. Weight gain of Cu wire was obtained from thermogravimetric analysis and obeys parabolic oxidation rate law. The Arrhenius plots are able to be roughly classified into three regions: high temperature region (550 oC to 700 oC), intermediate temperature region (400 oC to 550 oC), and low temperature region (325 oC to 400 oC).
Abstract i
摘要 ii
Acknowledgements iii
Table of Contents iv
List of Tables vi
List of Figures vii
Nomenclature xi
Chapter 1 Introduction 1
1.1 Motivation 1
1.2 Literature Review 3
1.3 Objectives 15
1.4 Thesis Outline 15
Chapter 2 Methodology 16
2.1 Overview 16
2.2 Heating Furnace 16
2.3 Thermogravimetric Analyzer (TGA) 18
2.4 Scanning Electron Microscope (SEM) 23
2.5 Energy Dispersive X-ray Spectrometer (EDS) 23
2.6 X-ray Diffractometer (XRD) 25
2.7 Copper Wires and Sample Preaparation 26
2.8 Methods for Obtaining NW Geometry and Density 27
Chapter 3 Results and Discussion 30
3.1 Influence of Oxidation Temperature 30
3.1.1 Surface Morphology 30
3.1.2 Material Characterization 39
3.2 Influence of Oxidation Duration 39
3.2.1 Surface Morphology 39
3.2.2 Material Characterization 45
3.3 Influence of Oxygen Concentration 51
3.3.1 Surface Morphology 51
3.4 Oxidation Kinetics of Copper 51
3.4.1 TGA Measurements 51
3.4.2 Results 59
3.5 Summary 63
Chapter 4 Conclusions and Future Works 64
4.1 Conclusions 64
4.2 Future Works 65
References 66
Appendix 73
A. Preliminary Results of Copper Oxide Reduction for Chemical-Looping Combustion. 73
B. Nanowire Peak Finder Source Code 83
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