臺灣博碩士論文加值系統

電子元件的可靠度仰賴良好的結構穩定性，本論文主要研究不同的免水洗助焊劑與CUF(Capillarity underfill)產品的可靠度分析，並同時探討研究免水洗助焊劑材料特性與填充材料(Underfill)之匹配性。本研究將比較各材料在未混合前的差異性，再者利用同樣的填充材料與免水洗助焊劑的互相配置，藉由覆晶黏晶封裝製程後，進行預先處理測試(Pre-condition test)、多重迴焊測試(Multiple reflow test)、溫度循環測試(Temperature cycling test)、高加速溫濕度測試(Highly accelerated stress test)，並分析及其結果比較。

Reliability of electrical component depends on good structure stability. This paper focuses on the reliability analysis of CUF product with different non-clean flux, and also to explore the interaction between non-clean flux and the underfill. The study will compare different material properties before mixed. Moreover, using the same underfill material to match with different non-clean flux, proceed flip-chip packaging process, pre-condition test, multi-reflow test, temperature cycling test, highly accelerated stress test, and compare their analyze result.

目 錄
摘要.....................................................................................................................I
Abstract...............................................................................................................II
致謝...................................................................................................................III
目錄...................................................................................................................IV
圖目錄...............................................................................................................VI
表目錄............................................................................................................VIII
第一章 緒論 1
1.1 前言 1
1.2覆晶製程介紹 2
1.3產品可靠度測試 3
1.3.1預先處理測試(Preconditon Test) 3
1.3.2 多重迴焊測試(Multiple Reflow Test) 4
1.3.3溫度循環測試 (Temperature Cycling test-TCT) 4
1.3.4高加速溫濕度試驗 (Highly Accelerated Stress test-HAST ) 5
1.4助焊劑原材介紹 5
1.4.1助焊劑重要性 5
1.4.2助焊劑功能 6
1.4.3助焊劑的成分 6
1.4.4助焊劑的種類 7
1.5研究動機 8
1.6論文架構 9
第二章　免水洗助焊劑介紹 10
2.1 免水洗的概念 10
2.2免水洗材料的要求 10
2.3免水洗焊接製程 11
2.4免清洗的優勢 14
第三章 實驗方法 15
3.1 實驗規劃 15
3.2 機台介紹 17
3.3 實驗流程 22
第四章 實驗結果及分析 23
4.1 免水洗助焊劑應用於實際製程之可行性比較 23
4.1.1熱重量分析測試 23
4.1.2黏度測試 24
4.1.3相容性測試 25
4.1.4潤濕性測試 25
4.2 應用於封裝毛細填充膠(CUF)產品之可靠度測試 26
4.2.1預先處理測試 26
4.2.2多重迴焊測試 29
4.2.3溫度循環測試 30
4.2.4高加速溫濕度測試 35
第五章 總結 43
5.1 結論 43
5.2未來研究方向 43
參考文獻 44

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