臺灣博碩士論文加值系統

近年來，半導體的發展隨著時間的演變開始邁入10奈米等級的製程，而藉著半導體元件發展的相關產品更新也是日新月異，在市場上的需求以及改變的時程都隨之越縮越短，各大半導體公司為了市場上的需求，所追求的不僅僅是出貨多少跟品質高低，能不能準時以及迅速產出也是目前越來越重視的一塊，因此產品製程週期(cycle time)，也開始變成每天比對的重點項目，此研究主要以設備角度來探討可能造成延遲產品製造的因素，並以半導體公司實際運作為實證，來幫助決策者能針對設備面的零配件妥善安排，避免掉不必要的機台時間浪費，才能達到最後產品時程的要求，並減少產能影響。

In recent years,and related product updates through the semiconductor element is the rapid development of the demand in the market and changes in the time course of the contraction are followed more short, the major semiconductor companies to the market demand, seek not only the number of shipments with the level of quality, on time and can quickly output is currently more important piece, so the product process cycle time, also began to become the focus of the project for more than a day, and in this study to explore the perspective of the device may cause a delay factor in product manufacturing, and semiconductor companies for the actual operation of the demonstration, to help decision makers to make proper arrangements for surface equipment spare parts, to avoid out unnecessary waste of time machine, in order to achieve the final product process requirements, and reduce the impact of productivity

第一章 緒論 1
1.1 研究背景、動機與重要性 1
1.2 研究目的 2
1.3 論文結構 2
第二章 文獻回顧 3
2.1 紫式決策分析架構 3
2.2 半導體現況討論 4
第三章 研究架構 5
3.1 研究架構方法分析 5
3.2 簡易多屬性評估架構 6
第四章 實證研究 7
4.1 實證研究問題之背景與情境說明 7
4.2 實驗設計與參數設定說明 10
4.3 結果整理、呈現與討論 11
第五章 結論 15
5.1 研究貢獻和限制 15
5.2 未來研究方向 15
參考文獻 16

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