隨著科技業與電子產業的蓬勃發展，球柵陣列封裝技術(Ball Grid Array；BGA)的應用，已漸漸成為半導體產業中重要的製程技術。而目前針對球高或是共面度的檢測中，經常使用雷射掃描、結構光柵或是電子顯微鏡等高成本的技術來量測，以上所耗費的時間與金錢成本往往造成龐大的負擔，也較無法在實際產線上使用。以目前存在立體視覺技術決定了物體表面深度或高度，然而使用技術的同時，也需要考慮表面紋理特徵來擷取特徵點，進而完成後續量測錫球高度。因此本研究應用多目立體視覺於球柵陣列封裝之精密量測系統，結合工業相機、光學鏡頭、光源設備與XY線性滑軌與影像處理軟體建構一套BGA三維突起量測系統。

With the flourishing electronic industry and optical industry, the ball grid array technology had gradually played important role in Semiconductor Industry. Currently ,Somebody are used to laser-detect, structured light, electron microscope in measurement ,which spend a lot of time and money to cause severe problems that could not on-line. Now ,the stereo vision is used to determine the height and depth of an object, in the same way ,it must consider texture with feature selected ,which complete to measure height of the solder ball. Therefore, the purpose of this study is to develop measurement system ,which combine cameras ,CCD, optical equipment ,XY table ,and software.

摘 要 i
ABSTRACT ii
誌 謝 iii
目 錄 iv
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 研究背景與動機 1
1.2 研究目的 2
1.3 研究範圍與限制 3
1.4 研究架構 3
第二章 文獻探討 5
2.1 機器視覺量測介紹 5
2.2 利用立體視覺進行量測 7
2.3 多台相機校正 10
2.4 立體視覺與匹配 11
2.5 立體影像轉換點雲資訊 12
第三章 研究方法 14
3.1 硬體機構設置 14
3.1.1 校正硬體設備 15
3.1.2 光學系統設備 16
3.2 軟體系統開發 18
3.2.1 針孔面形相機投影幾何 21
3.2.2 立體視覺影像 28
3.2.3 點雲資料分析 32
第四章 實驗結果與分析 39
4.1 相機校正實驗 39
4.1.1 校正影響因素 45
4.2 立體視覺匹配實驗 48
4.2.1 立體匹配參數比較 48
4.3 點雲處理 62
4.3.1 點雲垂直濾波參數 64
4.3.2 點雲區分物件 65
4.3.3 錫球高度偵測 66
4.4 實驗數據與分析 68
第五章 結論與未來研究方向 79
5.1 結論 79
5.2 研究貢獻 80
5.3 未來研究與建議 80
參考文獻 81

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