臺灣博碩士論文加值系統

本實驗主要是利用經過改質後的奈米銅顆粒，搭配不同化學性質的溶劑與分散劑配置成導電銅墨水，其中還會添加乙基纖維素(Ethyl cellulose，EC)改善配方的黏度，再配合刮刀塗佈以及階段性燒結步驟可得到導電銅膜。在此研究中奈米銅顆粒導入不同化學性質的溶劑的目的是為了改善銅墨水本身的分散性與降低燒結溫度。研究中使用、粒徑分析儀、黏度儀、沉降實驗分別用來測定銅墨水在不同溶劑之各溶劑使奈米銅顆粒團聚情形、不同配方之黏度及銅墨水與奈米銅顆粒於溶劑中懸浮時間；再以X光繞射分析儀(XRD)、場發型-掃描電子顯微鏡(FE-SEM) 、四點探針量測儀分別檢測銅膜是否氧化、銅膜高溫燒結情形及銅膜面電阻。
改質後的奈米銅顆粒本身為非導體，但透過調配成導電銅墨水，並經由高溫燒結後的銅膜會形成網狀導電通路，此網狀結構提供了電子轉移的通路。

In this study, the conductive copper ink was prepared by using modified copper nano-particles, mixed with various solvent of different chemical properties. With the addition of ethyl cellulose to improve the viscosity of the conductive ink. The conductive of copper ink were obtained by a doctor blade and multi-step thermal calcination process. In this study, copper nano particle were prepared using the various solvents of different chemical properties in order to improve the dispersion of copper ink and reduce the sintering temperature. Particle size, viscosity and hydrophobic properties of copper ink in different solvents were analyzed by particle size analyzer, viscometer and contact angle meter, respectively. The purpose of this study is to check the film was copper not the copper oxide. The morphology and surface resistance of copper film were analyzed by X-ray diffractometer (XRD), field emission scanning electron microscopy (SEM), four-point probe tester, respectively.
Modified nano copper particles were non-conductor, but the copper would form a network at high sintering temperature. The network structure provides electron transfer path in copper film.

摘要 i
ABSTRACT ii
致謝 iii
總目錄 iv
表目錄 vi
圖目錄 vii
第一章 緒論 1
1.1 前言 1
1.2 研究動機 2
第二章 文獻回顧 3
2.1 奈米科學之簡介 3
2.2 導電墨水之簡介 8
2.3 界面活性劑之簡介 17
2.4 印刷製程之簡介 21
第三章 實驗 24
3.1 實驗藥品 24
3.2 實驗設備 27
3.3 測試與分析儀器 29
3.4 實驗流程 40
3.5 實驗步驟 41
3.6 測試方法 42
第四章 結果與討論 44
Part-A 銅墨水分析 44
4.1 雷射粒徑分析儀 44
4.2 Physica 旋轉流變儀 48
4.3 沉降實驗 52
Part-B 燒結後銅膜分析 60
4.4 場發射式電子顯微鏡(FE-SEM) 60
4.5 X光繞射分析儀(XRD) 70
4.6 四點探針量測儀 76
第五章 結論與未來工作 83
第六章 未來方向 84
參考文獻 85
附錄 88
附錄一、松油醇與己二醇之性質比較 88
附錄二、松油醇與己二醇之黏度比較 89
附錄三、松油醇與己二醇之X光繞射分析圖 91
附錄四、松油醇與己二醇之表面型態分析 93
附錄五、松油醇與己二醇之表面電性分析 95
附錄六、不同溶劑對噴墨之影響 97
附錄七、常見溶劑之溶解度參數 98

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