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研究生:呂杰融
研究生(外文):LU, CHIEH-JUNG
論文名稱:結合有限元素法與簡化分析模型應用於微電子元件設計
論文名稱(外文):Coupled Finite Element Method and Simplified Method Applied to Micro-electronic Components Design
指導教授:劉德騏
指導教授(外文):LIU, DE-SHIN
口試委員:羅本喆鐘卓良劉建聖林派臣陳永松
口試委員(外文):LWO, BEN-JECHUNG, CHO-LIANGLIU, CHIEN-SHENGLIN, PAI-CHENCHEN, YONG-SONG
口試日期:2017-07-06
學位類別:博士
校院名稱:國立中正大學
系所名稱:機械工程系研究所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2017
畢業學年度:105
語文別:中文
論文頁數:124
中文關鍵詞:內引腳接合有限元素法電磁固耦合簡化模型
外文關鍵詞:Inner Lead Bonding (ILB)Finite Element Analysis (FEA)Coupled electromagnetic-structuralSimplify structure method
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良好的內引腳接合技術在先進製程中扮演重要的角色。本論文在實驗部分提出一非接觸式溫度量測方法,成功取得內引腳壓合時的環境溫度與接合處溫度相關資料;在有限元素模擬方面,也提出一內引腳壓合簡化模型分析方法,藉由實驗取得的溫度資料,先行分析內引腳壓合時的整體溫度分佈,再配合不同溫度分佈區間,輸入對應該溫度區間的材料參數,便可重現出內引腳壓合時真實應力分佈狀況。本分析方法不但準確度高,同時亦減少分析所需的時間及複雜度,對於縮短產線研發時間有著顯著的幫助。
另一方面,本論文針對手機相機模組中的彈片提出利用逆向工程的方式建立其有限元素模型。同時針對彈片的運作方式提出兩種數值模型分析方式,簡化結構分析法與電磁固耦合法。首先針對彈片幾何計算出合適剛性並在設計上對應磁路模組所需彈片尺寸,以避免運作過程中產生應力集中現象,且能符合所使用材料的安全係數不產生永久變型。其次利用參數分析提升該彈片的效能,達到使用較少電流即可輕易推動完成對焦的省電性,同時不失去對焦精準度,符合各相機模組出廠前的規範。
本論文更進一步利用所提出的改良型有限元素模型進行電子封裝製程及彈片參數設計研究,如此不但能縮短分析時間,同時還能保有相當程度之準確度,相信可為產線研發人員提供一新式的研發手法及思路。

One of the key factors to design a reliable eutectic Au-Sn solder joints used in flip-chip-on-film (FCOF) packaging is the bonding temperature distribution at the interface of gold bump and copper lead on the inner lead bonding (ILB) process. Accordingly, this study proposes a method based on a non-contact Infrared (IR) spot sensor for determining the inner lead (IL) interface temperature. The experimental results are used to construct an ANSYS simplify finite element (FE) model of the FCOF system to simulate temperature-dependent ILB process. A good agreement is observed between the numerical and experimental results for the deformed profile of the polyimide film /copper lead following the bonding process and the variation of the bump sinking value with the bonding force. Finally, the numerical results are used to construct a FCOF/ILB parameter design chart for selecting the bonding force required to obtain a given gap size and bump sinking value in the FCOF/ILB process.
On the other hand, the metal springs in the Auto-Focus (AF) module should combine high stiffness with a good actuation response and a light weight. The present study utilizes a reverse engineering approach to construct three-dimensional finite element models of the top and bottom springs in the VCM mechanism. In performing the simulations, the actuation force is computed using two different analysis methods, namely a simplify structure method and a coupled electromagnetic-structural method. It is shown that the simplify structure method has the advantages of a lower computational complexity and a more comprehensive modeling capability. A further series of simulations is thus to examine the effects of the spring shape parameters on the reaction force developed by the spring stiffness. The simulation results obtained for different spring shape parameter settings are summarized in the form of a parameter design chart for predicting the reaction force given known values of the spring rib length and spring thickness.

目錄
目錄 VII
表目錄 IX
圖目錄 XI
第一章 緒論 1
1-1 研究動機 1
1-2 研究目的 2
1-3 文獻回顧 4
1-3-1 FCOF結構特性結構和原理 4
1-3-2 FCOF製程上溫度熱傳參數影響 7
1-3-3 音圈馬達的結構和原理 9
1-3-4 彈片專利 11
1-4 文獻回顧總結 18
1-5 論文架構與流程 20
第二章 內引腳壓合溫度量測實驗 23
2-1 內引腳壓合的穩態溫度量測 26
2-2 內引腳壓合的暫態溫度量測 30
第三章 簡化分析模型應用於內引腳壓合 35
3-1 壓合參數 37
3-1-1 壓合力量(Bonding force) 37
3-1-2 凸塊下沉量(Sinking value) 38
3-1-3 灌膠間隙(Edge gap) 39
3-2 建立FCOF/ILB簡化數值模型 40
3-3 FCOF/ILB模型之熱傳結果與討論 43
3-4 FCOF/ILB簡化模型壓合分析 46
3-4-1 FCOF/ILB簡化模型材料參數界定及輸入 46
3-4-2 FCOF/ILB模型收斂性分析 50
3-4-3 FCOF/ILB簡化模型驗證 51
3-4-4 COF/ILB最佳化製程參數條件之探討 54
第四章 簡化模型應用於彈片結構分析 57
4-1 VCM制動原理 58
4-1-1 電磁力原理 58
4-1-2 勞倫茲原理 59
4-1-3 磁性能參數 60
4-2 彈片設計準則 62
4-2-1 姿態差 63
4-2-2 對焦剛性與支撐剛性 64
4-2-3 虎克定律於彈片之應用 65
4-2-4 優化分析 67
4-3 VCM彈片數值模型之建立 70
4-3-1 彈片數值模型建立-高解析度彈片影像取得 71
4-3-2 彈片數值模型建立-影像轉換及修正輸出 75
4-3-3 彈片數值模型分析-電磁固耦合分析法 80
4-3-4 彈片數值模型分析-簡化模型分析法 82
4-4 彈片數值模型分析結果討論 84
4-4-1 邊界條件設定與收斂性驗證 84
4-4-2 分析結果討論 94
4-5 彈片外型尺寸最佳化參數探討 104
第五章 結論與未來規劃 113
5-1 結論 113
5-2 未來規劃 116
參考文獻 119


[1]IDC Worldwide Quarterly Mobile Phone Tracker, “Worldwide Smartphone Growth Forecast to Slow from a Boil to a Simmer as Prices Drop and Markets Mature,” 2014.
[2]C. I. Chen, C. Y. Ni, C. M. Chang, S. C Wu, and D. S. Liu, “Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder,” IEEE Trans. Electron. Packag. Manuf., vol. 31, no. 4, 2008.
[3]C. Jang, S. Han, H. Kim, and S. Kang, “A Numerical Failure Analysis on Lead Breakage Issue of Ultra Fine Pitch Flip Chip-on-Flex and Tape Carrier Packages During Chip/Film Assembly Process,” Microelectronics Reliability, vol. 46, pp. 487-495, 2006.
[4]C. Jang, S. Han, J. Ryu, S. Cho, and H. Kim, “Issues in Assembly Process of Next-Generation Fine-Pitch Chip-on-Flex Packages for LCD Applications,” IEEE Transactions on Advanced Packaging, vol. 1, no. 30, pp. 2-10, 2007.
[5]D. S. Liu, Y. C. Chao, C. H. Lin, G. S. Shen, and H. S. Liu, “Numerical Study on the Bonding Tool Position, Tip Profile and Planarity Angle Influence on TAB/ILB Interconnection Reliability,” Microelectronics Reliability, vol. 43, pp. 935-943, 2003.
[6]K. Oshige, and K. Nakanishi, “Development of A Physical Simulation System of ILB Process,” Advance in Electronic Packaging ASME, vol. 1, pp.501-507, 1992.
[7]H. Takahara, S. Ishibashi, S. Ishizawa, H. Hirata, N. Koshoubu, and H. Tsunetsugu, “Optoelectronic Chip on Film (OE-COF) Packaging Technology,” Electron. Commun. Jpn., vol. 85, no. 2, pp. 59-66, 2002.
[8]H. Okamoto and T. B. Massalski, Eds., “Phase Diagram of Binary Gold Alloys,” Metals Park, OH: ASM International, pp. 278-289, 1987.
[9]M. Pecht, and X. Wu, “Characterization of Polyimides Used in High Density Interconnects,” IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 17, no. 4, 1994.
[10]J. H. Lau, D. W. Rice, and C. G. Harkins, “Thermal Stress Analysis of Tape Automated Bonding Packages and Interconnection,” IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 13, no. 1, pp. 182-187, 1990.
[11]C. Y. Ni, K. S. Yoon, H. J. Ahn, and C. I. Chen, “Recipe Optimization and Design Software Development of Tap Carrier Package(TCP)Inner Lead Bonding(ILB),” IEEE Trans. Electron. Packag. Manuf., vol. 28, no. 2, 2005.
[12]C. Y. Ni, C. I. Chen, K. S. Yoon, and H. J. Ahn, “An Accommodative Approach Designed for TCP Gold-to-Gold Inner Lead Bonding,” IEEE Trans Electron Pack Manufact, vol.29, no.2, pp. 91-98, 2006.
[13]H. Jung, T. Lee, J. Baek, and H. Kim, “Optimization of TAB Inner Lead Bonding Process,” in Proc. 20th Ann. IEEE SEMI-THERM Semiconductor, pp. 129-135, 1996.
[14]C. Jang, S. Han, H. Kim, and S. Kang, “A Numerical Failure Analysis on Lead Breakage Issue of Ultra Fine Pitch Flip Chip-on-Flex and Tape Carrier Packages During Chip/Film Assembly Process,” Microelectron. Rel., vol. 46, pp. 487-495, 2006.
[15]李鴻飛,「利用磁預壓力之微型音圈馬達自動對焦器設計」,國立中正大學機械研究所,碩士論文,2014。
[16]S. Manabu, and Y. Morimasa, “Lens drive device,” PAJ 2002-365514, 2002.
[17]S. Manabu, S. Naoki, Y. Morimasa, and C. Yosuke, ‘‘Lens driving apparatus,’’ PAJ2005-128405, 2005.
[18]C. S. Liu and P. D. Lin, ‘‘miniaturized low-power VCM actuator for auto-focusing applications,’’ Optics express 16.4 pp. 2533-2540, 2008.
[19]辜炳翰,‘‘影像穩定模組穩定成像裝置,’’ TW I461825B,2014。
[20]Y. Nagasaki, ‘‘Voice Coil Motor,’’ US 7787046B2, 2010.
[21]郭利德,‘‘相機模組’’, TW I477877B,2015。
[22]R. J. Topliss, ‘‘Vcm Ois Actuator Module,’’ U.S. Patent No. 20140009631A1, 2014.
[23]M. SUGAWARA, ‘‘Lens Holder Driving Device Including Fracture Preventing Member for Suspension Wires,’’ U.S. Patent No. 20130016428A1, 2013.
[24]K. Atsumi, N. Kashima, Y. Maehara, T. Mitsuhashi, T. Komatsu, and N. Ochiai, “Inner lead bonding techniques for 500-lead dies having a 90-mm lead pitch,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, no. 1, pp. 222-228, 1990.
[25]葉書伸,「探討COF-ILB成型過程共晶接合技術與散熱可靠度之研究」,國立中正大學機械工程研究所,博士論文,2011。
[26]D. Kim, and C. C. Lee, “Fluxes Flip-Chip Sn-Au Solder Interconnect on Thin Si Wafers and Cu Laminated Polyimide Films”, Materials Science and Engineering A, vol. 416, no. 1-2, pp. 74-79, 2006.
[27]D. S. Liu, Y. C. Chao, and C. H. Wang “Study of Wire Bonding Looping Formation in The Electronic Packaging Process Using The Three Dimensional Finite Element Method,” Finite Elements in Analysis and Design, vol. 40, Issue 3, pp. 263-286, 2004.
[28]A. A. O. Tay, and B. C. Seah, “Finite Element Simulation of Wire Looping During Wirebonding,” Advances in Electronic Packaging, ASME, EEP-Vol. 19-1, pp. 399-406, 1997.
[29]D. S. Liu, S. S. Yeh, C. T. Kao, H. C. Shen, G. S. Shen, and H. H. Liu, “Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process,” IEEE Transactions on Advanced Packaging, vol. 32, no. 3, 2009.
[30]D. S. Liu, and Y. C. Chao, “Effects of Dopant, Temperature and Strain Rate on the Mechanical Properties of Micrometer Gold Bonding Wire,” TMS Journal of Electronic Materials, vol. 32, no.3, pp. 159-165, 2003.
[31]D. S. Liu, Z. W. Zhuang, S. S. Yeh, P. Y. Huang, and H. H. Liu, “Experimental and Numerical Investigation into the Influence of Chip-on-Film Package on Component Operating Temperature in Natural Convection” IEEE Trans. Device Mater. Rel., vol. 14, no.2, pp.757-765, 2014.
[32]葉柏園,「音圈馬達之順應運動控制器設計與實作」,國立臺灣科技大學機械工程研究所,碩士論文,2011。
[33]肖明,「高精度透鏡驅動器的設計」,西安電子科技大學,碩士學位論文,2008。
[34]張昫揚,「長行程奈米定位系統研究」,國立中興大學機械工程研究所,碩士論文,2002。
[35]謝松佑,「以電磁推進機構設計與控制之三維精密定位平台」,國立臺灣師範大學機電科技研究所,碩士論文,2007。
[36]C19900HP-GSH鈦銅拉伸試驗數據,JX日礦日石金屬,取自:http://www.nmm.jx-group.co.jp/products/rolling_foil/c1990hp.html
[37]Michell, A. G. M., ‘‘The limits of economy of material in frame-structures,’’ Philosophical Magazine, Series 6, 8, pp. 589-597, 1904.
[38]Schmit, L. A., ‘‘Structural design by systematic synthesis,’’ Proceedings, 2nd ASCE Conference on Electronic Computation, pp. 105-122, 1960.
[39]Bendsøe, M. P., and Kikuchi, N., "Generating Optimal Topologies in Structural Design Using a Homogenization Method," Comput. Methods in Appl. Mech. Eng., vol.71, pp. 197-224, 1988.
[40]姜冠禎,「拓樸最佳化設計系統整合之研究」,國立中正大學機械工程研究所,碩士論文,2000。
[41]Bissal, A., Eriksson, A., Magnusson, J. and Engdahl,G., “Hybrid Multi-Physics Modeling of an Ultra-Fast Electro-Mechanical Actuator,” Actuators, vol. 4, pp.314-335, 2015.
[42]C. W. Chiu, P. C. P. Chao, and D. Y. Wu, "Optimal Design of Magnetically Actuated Optical Image Stabilizer Mechanism for Cameras in Mobile Phones Via Genetic Algorithm," IEEE Trans. Magn., vol. 43, pp. 2582-2584, 2007.
[43]謝長霖,「具L型線圈特徵之音圈馬達手機相機模組設計」,國立中正大學機械研究所,碩士論文,2016。
[44]陳詩翰,「有限元素應用於手機相機模組彈片分析」,國立中正大學機械研究所,碩士論文,2016。

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