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Chapter 1
1.J. Coonrod, Different Copper Foils for Different Reasons, in the PCB Magazine. 2012. p. 60-64.
2.C.B. Yates, C.T. Cheng and A.M. Wolski, Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby. 1999, US Patent 5863410.
3.B.M. Luce and B.L. Berdan, Process and apparatus for electroplating copper foil. 1990, US Patent 4898647.
4.P.C. Andricacos, C. Uzoh, J.O. Dukovic, J. Horkans and H. Deligianni, Damascene copper electroplating for chip interconnections. IBM Journal of Research and Development, 1998. 42(5): p. 567-574.
5.K.K.H. Wong, S. Kaja and P.W. DeHaven, Metallization by plating for high-performance multichip modules. IBM Journal of Research and Development, 1998. 42(5): p. 587-596.
6.C.-T. Ko and K.-N. Chen, Wafer-level bonding/stacking technology for 3D integration. Microelectronics Reliability, 2010. 50(4): p. 481-488.
7.K.N. Tu, Reliability challenges in 3D IC packaging technology. Microelectronics Reliability, 2011. 51(3): p. 517-523.
8.K.N. Chen, C.S. Tan, A. Fan and R. Reif, Morphology and Bond Strength of Copper Wafer Bonding. Electrochemical and Solid-State Letters, 2004. 7(1): p. G14-G16.
9.C.M. Liu, H.W. Lin, Y.S. Huang, Y.C. Chu, C. Chen, D.R. Lyu, K.N. Chen and K.N. Tu, Low-temperature direct copper-to-copper bonding enabled by creep on (111) surfaces of nanotwinned Cu. Sci Rep, 2015. 5: p. 9734.
10.H.-Y. Hsiao, C.-M. Liu, H.-w. Lin, T.-C. Liu, C.-L. Lu, Y.-S. Huang, C. Chen and K.N. Tu, Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science, 2012. 336(6084): p. 1007-1010.
11.A. Jourdain, S. Stoukatch, P.D. Moor, W. Ruythooren, S. Pargfrieder, B. Swinnen and E. Beyne. Simultaneous Cu-Cu and Compliant Dielectric Bonding for 3D Stacking of ICs. in 2007 IEEE International Interconnect Technology Conferencee. 2007.
Chapter 2
1.R. Akolkar and U. Landau, Mechanistic Analysis of the "Bottom-Up" Fill in Copper Interconnect Metallization. Journal of the Electrochemical Society, 2009. 156(9): p. D351-D359.
2.Y. Cao, P. Taephaisitphongse, R. Chalupa and A.C. West, Three-additive model of superfilling of copper. Journal of the Electrochemical Society, 2001. 148(7): p. C466-C472.
3.U. Emekli and A.C. West, Simulation of the Effect of Additives on Electrochemical Nucleation. Journal of the Electrochemical Society, 2010. 157(9): p. D479-D485.
4.A. Radisic, O. Luhn, H.G.G. Philipsen, Z. El-Mekki, M. Honore, S. Rodet, S. Armini, C. Drijbooms, H. Bender and W. Ruythooren, Copper plating for 3D interconnects. Microelectronic Engineering, 2011. 88(5): p. 701-704.
5.I. Volov, T. Saito and A.C. West, Investigation of Copper Plating and Additive Interactions in the Presence of Fe3+/Fe2+ Redox Couple. Journal of the Electrochemical Society, 2011. 158(6): p. D384-D389.
6.W.-P. Dow, M.-Y. Yen, S.-Z. Liao, Y.-D. Chiu and H.-C. Huang, Filling mechanism in microvia metallization by copper electroplating. Electrochimica Acta, 2008. 53(28): p. 8228-8237.
7.N.T.M. Hai and P. Broekmann, Smart Hybrid Polymers for Advanced Damascene Electroplating: Combination of Superfill and Leveling Properties. ChemElectroChem, 2015. 2(8): p. 1096-1099.
8.T.M.T. Huynh, F. Weiss, N.T.M. Hai, W. Reckien, T. Bredow, A. Fluegel, M. Arnold, D. Mayer, H. Keller and P. Broekmann, On the role of halides and thiols in additive-assisted copper electroplating. Electrochimica Acta, 2013. 89: p. 537-548.
9.S.K. Kim, D. Josell and T.P. Moffat, Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system - Reduction of overfill bump formation during superfilling. Journal of the Electrochemical Society, 2006. 153(9): p. C616-C622.
10.K. Kondo, T. Matsumoto and K. Watanabe, Role of additives for copper damascene electrodeposition experimental study on inhibition and acceleration effects. Journal of the Electrochemical Society, 2004. 151(4): p. C250-C255.
11.K. Kondo, N. Yamakawa, Z. Tanaka and K. Hayashi, Copper damascene electrodeposition and additives. Journal of Electroanalytical Chemistry, 2003. 559: p. 137-142.
12.T.P. Moffat, D. Wheeler, S.K. Kim and D. Josell, Curvature enhanced adsorbate coverage model for electrodeposition. Journal of the Electrochemical Society, 2006. 153(2): p. C127-C132.
13.V.H. Hoang and K. Kondo, Extreme fast filling of conical shape through-silicon vias in 3 minutes and additive optimization. Electrochimica Acta, 2016. 212: p. 270-276.
14.S.-M. Huang, C.-W. Liu and W.-P. Dow, Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution. Journal of The Electrochemical Society, 2012. 159(3): p. D135-D141.
15.T.P. Moffat, D. Wheeler, S.K. Kim and D. Josell, Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing. Electrochimica Acta, 2007. 53(1): p. 145-154.
16.N.T.M. Hai, J. Furrer, E. Barletta, N. Luedi and P. Broekmann, Copolymers of Imidazole and 1,4-Butandiol Diglycidyl Ether as an Efficient Suppressor Additive for Copper Electroplating. Journal of the Electrochemical Society, 2014. 161(9): p. D381-D387.
17.W.-P. Dow, H.-S. Huang, M.-Y. Yen and H.-C. Huang, Influence of Convection-Dependent Adsorption of Additives on Microvia Filling by Copper Electroplating. Journal of The Electrochemical Society, 2005. 152(6): p. C425-C434.
18.K. Kondo and H. Murakami Crystal Growth of Electrolytic Cu Foil. Journal of The Electrochemical Society, 2004. 151(7): p. C514-C518.
19.T. Chang, Y. Jin, L. Wen, C. Zhang, C. Leygraf, I.O. Wallinder and J. Zhang, Synergistic effects of gelatin and convection on copper foil electrodeposition. Electrochimica Acta, 2016. 211: p. 245-254.
20.W. Peng, G. Yi, F. Cai, T. He and X. Yang. Experimental analysis of pinhole on electrolytic copper foil and its prevention. in 2011 Second International Conference on Mechanic Automation and Control Engineering. 2011.
21.B. Blocken and C. Gualtieri, Ten iterative steps for model development and evaluation applied to Computational Fluid Dynamics for Environmental Fluid Mechanics. Environmental Modelling & Software, 2012. 33: p. 1-22.
22.J. Coonrod, Different Copper Foils for Different Reasons, in the PCB Magazine. 2012. p. 60-64.
23.T. Okubo, T. Sudo, T. Hosoi, H. Tsuyoshi and F. Kuwako. Signal transmission loss on printed circuit board in GHz frequency region. in 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS). 2013.
24.M.Y. Koledintseva, A.G. Razmadze, A.Y. Gafarov, S. De, J.L. Drewniak and S. Hinaga. PCB conductor surface roughness as a layer with effective material parameters. in 2012 IEEE International Symposium on Electromagnetic Compatibility. 2012.
25.C.D. Xu, K.W.E. Cheng, R.S. Raghu and J.F. Liu. Characterization and modeling of copper foil conductor for high frequency power distribution. in 2015 6th International Conference on Power Electronics Systems and Applications (PESA). 2015.
26.B.M. Luce and B.L. Berdan, Process and apparatus for electroplating copper foil. 1990, US Patent 4898647.
27.N. Ibl and K. Schadegg, Surface Roughness Effects in the Electrodeposition of Copper in the Limiting Current Range. Journal of The Electrochemical Society, 1967. 114(1): p. 54-58.
28.Y.I. Yanson and M.J. Rost, Structural accelerating effect of chloride on copper electrodeposition. Angew Chem Int Ed Engl, 2013. 52(9): p. 2454-8.
29.W. Shao, G. Pattanaik and G. Zangari, Influence of Chloride Anions on the Mechanism of Copper Electrodeposition from Acidic Sulfate Electrolytes. Journal of The Electrochemical Society, 2007. 154(4): p. D201.
30.K.R. Hebert, Role of Chloride Ions in Suppression of Copper Electrodeposition by Polyethylene Glycol. Journal of The Electrochemical Society, 2005. 152(5): p. C283-C287.
31.M. Hayase, M. Taketani, K. Aizawa, T. Hatsuzawa and K. Hayabusa, Copper Bottom-up Deposition by Breakdown of PEG-Cl Inhibition. Electrochemical and Solid-State Letters, 2002. 5(10): p. C98-C101.
32.W.-P. Dow, M.-Y. Yen, W.-B. Lin and S.-W. Ho, Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating. Journal of The Electrochemical Society, 2005. 152(11): p. C769-C775.
33.K.R. Hebert, S. Adhikari and J.E. Houser, Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol). Journal of The Electrochemical Society, 2005. 152(5): p. C324-C329.
34.Z.V. Feng, X. Li and A.A. Gewirth, Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study. The Journal of Physical Chemistry B, 2003. 107(35): p. 9415-9423.
35.T.P. Moffat, D. Wheeler and D. Josell Electrodeposition of Copper in the SPS-PEG-Cl Additive System: I. Kinetic Measurements: Influence of SPS. Journal of The Electrochemical Society, 2004. 151(4): p. C262-C271.
36.H. Koichi, W. Yasuhiro, F. Akihiko, U. Daisuke, K. Koichiro, N. Tomoko, S. Masahiko, C. Mitsuyasu, T. Sotaro, S. Jun, H. Muneaki, N. Akira and K. Hiroshi, Copper Plating Method on Flat Surface for High Frequency Signal Transfer. Japanese Journal of Applied Physics, 2005. 44(9R): p. 6719.
37.S.J. Bleiker, A.C. Fischer, U. Shah, N. Somjit, T. Haraldsson, N. Roxhed, J. Oberhammer, G. Stemme and F. Niklaus, High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015. 5(1): p. 21-27.
38.C.B. Yates, C.T. Cheng and A.M. Wolski, Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby. 1999, US Patent 5863410.
Chapter 3
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3.L. Lu, Y. Shen, X. Chen, L. Qian and K. Lu, Ultrahigh Strength and High Electrical Conductivity in Copper. Science, 2004. 304(5669): p. 422-426.
4.K. Lu, L. Lu and S. Suresh, Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale. Science, 2009. 324(5925): p. 349-352.
5.L. Lu, X. Chen, X. Huang and K. Lu, Revealing the Maximum Strength in Nanotwinned Copper. Science, 2009. 323(5914): p. 607-610.
6.D. Jang, C. Cai and J.R. Greer, Influence of Homogeneous Interfaces on the Strength of 500 nm Diameter Cu Nanopillars. Nano Letters, 2011. 11(4): p. 1743-1746.
7.Y. Zhang, Y.S. Li, N.R. Tao and K. Lu, High strength and high electrical conductivity in bulk nanograined Cu embedded with nanoscale twins. Applied Physics Letters, 2007. 91(21): p. 211901.
8.K.-C. Chen, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.N. Tu, Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper. Science, 2008. 321(5892): p. 1066-1069.
9.X.H. Chen, L. Lu and K. Lu, Electrical resistivity of ultrafine-grained copper with nanoscale growth twins. Journal of Applied Physics, 2007. 102(8): p. 083708.
10.T. LaGrange, B.W. Reed, M. Wall, J. Mason, T. Barbee and M. Kumar, Topological view of the thermal stability of nanotwinned copper. Applied Physics Letters, 2013. 102(1): p. 011905.
11.D. Xu, H.P. Chen and K.N. Tu, Improved Interconnect Properties For Nano‐Twinned Copper: Microstructure And Stability. AIP Conference Proceedings, 2010. 1300(1): p. 23-32.
12.H.-Y. Hsiao, C.-M. Liu, H.-w. Lin, T.-C. Liu, C.-L. Lu, Y.-S. Huang, C. Chen and K.N. Tu, Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper. Science, 2012. 336(6084): p. 1007-1010.
13.T.-C. Liu, C.-M. Liu, Y.-S. Huang, C. Chen and K.-N. Tu, Eliminate Kirkendall voids in solder reactions on nanotwinned copper. Scripta Materialia, 2013. 68(5): p. 241-244.
14.W.-L. Chiu, C.-M. Liu, Y.-S. Haung and C. Chen, Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization. Applied Physics Letters, 2014. 104(17): p. 171902.
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16.C. Chen, C.M. Liu, H.w. Lin, Y.S. Huang, Y.C. Chu, D.R. Lyu, K.N. Chen and K.N. Tu. Low-temperature and low-pressure direct copper-to-copper bonding by highly (111)-oriented nanotwinned Cu. in 2016 Pan Pacific Microelectronics Symposium (Pan Pacific). 2016.
17.K. Lu, The Future of Metals. Science, 2010. 328(5976): p. 319-320.
18.C.-T. Ko and K.-N. Chen, Wafer-level bonding/stacking technology for 3D integration. Microelectronics Reliability, 2010. 50(4): p. 481-488.
19.K.N. Tu, Reliability challenges in 3D IC packaging technology. Microelectronics Reliability, 2011. 51(3): p. 517-523.
20.J.B. Goodenough and K.-S. Park, The Li-Ion Rechargeable Battery: A Perspective. Journal of the American Chemical Society, 2013. 135(4): p. 1167-1176.
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24.T.-C. Liu, C.-M. Liu, H.-Y. Hsiao, J.-L. Lu, Y.-S. Huang and C. Chen, Fabrication and Characterization of (111)-Oriented and Nanotwinned Cu by Dc Electrodeposition. Crystal Growth & Design, 2012. 12(10): p. 5012-5016.
25.Y. Hirasawa and N. Takahashi, Method of manfacturing electrodeposited copper foil and electrodeposited copper foil. 2001, EP Patent 1065298.
26.O. Nakano, T. Kataoka, S. Taenaka, N. Uchida and N. Hanzawa, Electrodeposited copper foil. 2003, US Patent 6544663.
27.W. Wang, Y. Dai, J. Li and B. Liu, An Atomic-Level Mechanism of Annealing Twinning in Copper Observed by Molecular Dynamics Simulation. Crystal Growth & Design, 2011. 11(7): p. 2928-2934.
28.J.R. Hancock, -, The frequency of annealing twins in copper and copper-base alloys. The University of Arizona.
29.Y.T. Zhu, X.Z. Liao and X.L. Wu, Deformation twinning in nanocrystalline materials. Progress in Materials Science, 2012. 57(1): p. 1-62.
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33.L. Velasco and A.M. Hodge, The mobility of growth twins synthesized by sputtering: Tailoring the twin thickness. Acta Materialia, 2016. 109: p. 142-150.
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Chapter 4
1.J.A. Switzer, C.-J. Hung, E.W. Bohannan, M.G. Shumsky, T.D. Golden and D.C. Van Aken, Electrodeposition of quantum-confined metal/semiconductor nanocomposites. Advanced Materials, 1997. 9(4): p. 334-338.
2.J.A. Switzer, C.-J. Hung, L.-Y. Huang, E.R. Switzer, D.R. Kammler, T.D. Golden and E.W. Bohannan, Electrochemical Self-Assembly of Copper/Cuprous Oxide Layered Nanostructures. Journal of the American Chemical Society, 1998. 120(14): p. 3530-3531.
3.E.W. Bohannan, L.-Y. Huang, F.S. Miller, M.G. Shumsky and J.A. Switzer, In Situ Electrochemical Quartz Crystal Microbalance Study of Potential Oscillations during the Electrodeposition of Cu/Cu2O Layered Nanostructures. Langmuir, 1999. 15(3): p. 813-818.
4.J. Eskhult, M. Herranen and L. Nyholm, On the origin of the spontaneous potential oscillations observed during galvanostatic deposition of layers of Cu and Cu2O in alkaline citrate solutions. Journal of Electroanalytical Chemistry, 2006. 594(1): p. 35-49.
5.S. Leopold, J.C. Arrayet, J.L. Bruneel, M. Herranen, J.-O. Carlsson, F. Argoul and L. Servant, In Situ CRM Study of the Self-Oscillating Cu-(II)-Lactate and Cu-(II)-Tartrate Systems. Journal of The Electrochemical Society, 2003. 150(7): p. C472-C477.
6.S. Leopold, M. Herranen and J.-O. Carlsson Spontaneous Potential Oscillations in the Cu(II)/Tartrate and Lactate Systems, Aspects of Mechanisms and Film Deposition. Journal of The Electrochemical Society, 2001. 148(8): p. C513-C517.
7.S. Leopold, M. Herranen, J.O. Carlsson and L. Nyholm, In situ pH measurement of the self-oscillating Cu(II)–lactate system using an electropolymerised polyaniline film as a micro pH sensor. Journal of Electroanalytical Chemistry, 2003. 547(1): p. 45-52.
8.E. Mishina, K. Nagai, D. Barsky and S. Nakabayashi, Optical properties of a self-assembled Cu/Cu2O multilayered structure studied in situ during deposition. Physical Chemistry Chemical Physics, 2002. 4(1): p. 127-133.
9.J.A. Switzer, B.M. Maune, E.R. Raub and E.W. Bohannan, Negative Differential Resistance in Electrochemically Self-Assembled Layered Nanostructures. The Journal of Physical Chemistry B, 1999. 103(3): p. 395-398.
10.Y. Wang, Y. Cao, M. Wang, S. Zhong, M.-Z. Zhang, Y. Feng, R.-W. Peng, X.-P. Hao and N.-B. Ming, Spontaneous formation of periodic nanostructured film by electrodeposition: Experimental observations and modeling. Physical Review E, 2004. 69(2): p. 021607.
11.M.Z. Zhang, M. Wang, Z. Zhang, J.M. Zhu, R.W. Peng and N.B. Ming, Periodic structures of randomly distributed Cu/Cu2O nanograins and periodic variations of cell voltage in copper electrodeposition. Electrochimica Acta, 2004. 49(14): p. 2379-2383.
12.S. Zhong, Y. Wang, M. Wang, M.-Z. Zhang, X.-B. Yin, R.-W. Peng and N.-B. Ming, Formation of nanostructured copper filaments in electrochemical deposition. Physical Review E, 2003. 67(6): p. 061601.
13.N.T.M. Hai, J. Furrer, E. Barletta, N. Luedi and P. Broekmann, Copolymers of Imidazole and 1,4-Butandiol Diglycidyl Ether as an Efficient Suppressor Additive for Copper Electroplating. Journal of the Electrochemical Society, 2014. 161(9): p. D381-D387.
14.N.T.M. Hai, F. Janser, N. Luedi and P. Broekmann, Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities. ECS Electrochemistry Letters, 2013. 2(11): p. D52-D54.
15.N.T.M. Hai, J. Odermatt, V. Grimaudo, K.W. Krämer, A. Fluegel, M. Arnold, D. Mayer and P. Broekmann, Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives. The Journal of Physical Chemistry C, 2012. 116(12): p. 6913-6924.
16.T. Nagai, S. Nakanishi, Y. Mukouyama, Y.H. Ogata and Y. Nakato, Periodic and chaotic oscillations of the electrochemical potential of p-Si in contact with an aqueous (CuSO4+HF) solution, caused by electroless Cu deposition. Chaos, 2006. 16(3): p. 037106.
17.S. Nakanishi, S.-i. Sakai, K. Nishimura and Y. Nakato, Layer-by-Layer Electrodeposition of Copper in the Presence of o-Phenanthroline, Caused by a New Type of Hidden NDR Oscillation with the Effective Electrode Surface Area as the Key Variable. The Journal of Physical Chemistry B, 2005. 109(40): p. 18846-18851.
18.N.T.M. Hai, D. Lechner, F. Stricker, J. Furrer and P. Broekmann, Combined Secondary Ion Mass Spectrometry Depth Profiling and Focused Ion Beam Analysis of Cu Films Electrodeposited under Oscillatory Conditions. ChemElectroChem, 2015. 2(5): p. 664-671.
19.Z.V. Feng, X. Li and A.A. Gewirth, Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study. The Journal of Physical Chemistry B, 2003. 107(35): p. 9415-9423.
20.K.R. Hebert, S. Adhikari and J.E. Houser, Chemical Mechanism of Suppression of Copper Electrodeposition by Poly(ethylene glycol). Journal of The Electrochemical Society, 2005. 152(5): p. C324-C329.
21.P. Moreno-García, V. Grimaudo, A. Riedo, M. Tulej, M.B. Neuland, P. Wurz and P. Broekmann, Towards Structural Analysis of Polymeric Contaminants in Electrodeposited Cu films. Electrochimica Acta, 2016. 199: p. 394-402.
Chapter 5
1.O. Nakano, T. Kataoka, S. Taenaka, N. Uchida and N. Hanzawa, Electrodeposited copper foil. 2003, US Patent 6544663.
2.Y. Hirasawa and N. Takahashi, Method of manfacturing electrodeposited copper foil and electrodeposited copper foil. 2001, EP Patent 1065298.
3.C. Chen, K.N. Tu and T. LIU, Electrodeposited Nano-Twins Copper Layer and Method of Fabricating the Same. 2013, US Patent 0122326.
4.C.-C. Chen, C.-H. Yang, Y.-S. Wu and C.-E. Ho, Depth-dependent self-annealing behavior of electroplated Cu. Surface and Coatings Technology, 2016.
5.D. Field, L. Bradford, M. Nowell and T. Lillo, The role of annealing twins during recrystallization of Cu. Acta Materialia, 2007. 55(12): p. 4233-4241.
6.C.-L. Lu, H.-W. Lin, C.-M. Liu, Y.-S. Huang, T.-L. Lu, T.-C. Liu, H.-Y. Hsiao, C. Chen, J.-C. Kuo and K.-N. Tu, Extremely anisotropic single-crystal growth in nanotwinned copper. NPG Asia Materials, 2014. 6(10): p. e135.
7.M. Belhadjamor, M. El Mansori, S. Belghith and S. Mezlini, Anti-fingerprint properties of engineering surfaces: a review. Surface Engineering, 2016: p. 1-32.
Chapter 6
1.C.-T. Ko and K.-N. Chen, Wafer-level bonding/stacking technology for 3D integration. Microelectronics Reliability, 2010. 50(4): p. 481-488.
2.K.N. Tu, Reliability challenges in 3D IC packaging technology. Microelectronics Reliability, 2011. 51(3): p. 517-523.
3.C. Tz-Cheng, Z. Kejun, R. Stierman, D. Edwards and K. Ano. Effect of thermal aging on board level drop reliability for Pb-free BGA packages. in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546). 2004.
4.J.-W. Yoon, S.-W. Kim, J.-M. Koo, D.-G. Kim and S.-B. Jung, Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder. Journal of Electronic Materials, 2004. 33(10): p. 1190-1199.
5.T. Havlik, D. Orac, M. Petranikova, A. Miskufova, F. Kukurugya and Z. Takacova, Leaching of copper and tin from used printed circuit boards after thermal treatment. Journal of Hazardous Materials, 2010. 183(1–3): p. 866-873.
6.K. Zeng, R. Stierman, T.-C. Chiu, D. Edwards, K. Ano and K.N. Tu, Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability. Journal of Applied Physics, 2005. 97(2): p. 024508.
7.K.N. Tu and U. Gösele, Hollow nanostructures based on the Kirkendall effect: Design and stability considerations. Applied Physics Letters, 2005. 86(9): p. 093111.
8.M. Onishi and H. Fujibuchi, Reaction-Diffusion in the Cu–Sn System. Transactions of the Japan Institute of Metals, 1975. 16(9): p. 539-547.
9.Y. Liu, J. Wang, L. Yin, P. Kondos, C. Parks, P. Borgesen, D.W. Henderson, E.J. Cotts and N. Dimitrov, Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper–solder interface. Journal of Applied Electrochemistry, 2008. 38(12): p. 1695-1705.
10.F. Wafula, Y. Liu, L. Yin, S. Bliznakov, P. Borgesen, E.J. Cotts and N. Dimitrov, Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper. Journal of The Electrochemical Society, 2010. 157(2): p. D111-D118.
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12.Y. Yang, H. Lu, C. Yu and Y. Li, Void formation at the interface in Sn/Cu solder joints. Microelectronics Reliability, 2011. 51(12): p. 2314-2318.
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Chapter 7
1.D. Josell and T.P. Moffat, Extreme Bottom-up Filling of Through Silicon Vias and Damascene Trenches with Gold in a Sulfite Electrolyte. Journal of the Electrochemical Society, 2013. 160(12): p. D3035-D3039.
2.D. Josell and T.P. Moffat, Superconformal Cu Electrodeposition from Cu(II)-EDTA Complexed Alkaline Electrolyte. Journal of the Electrochemical Society, 2014. 161(10): p. D558-D563.
3.D. Josell and T.P. Moffat, Superconformal Copper Electrodeposition in Complexed Alkaline Electrolyte. Journal of the Electrochemical Society, 2014. 161(5): p. D287-D292.
4.D. Josell and T.P. Moffat, Bottom-Up Electrodeposition of Zinc in Through Silicon Vias. Journal of The Electrochemical Society, 2015. 162(3): p. D129-D135.
5.D. Josell and T.P. Moffat, Superconformal Bottom-Up Nickel Deposition in High Aspect Ratio Through Silicon Vias. Journal of the Electrochemical Society, 2016. 163(7): p. D322-D331.
6.D. Josell and T.P. Moffat, Superconformal Bottom-Up Gold Deposition in High Aspect Ratio Through Silicon Vias. Journal of the Electrochemical Society, 2017. 164(6): p. D327-D334.
7.D. Josell, M. Silva and T.P. Moffat, Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. Journal of the Electrochemical Society, 2016. 163(14): p. D809-D817.
8.C.H. Lee, J.E. Bonevich, J.E. Davies and T.P. Moffat, Superconformal Electrodeposition of Co and Co-Fe Alloys Using 2-Mercapto-5-benzimidazolesulfonic Acid. Journal of the Electrochemical Society, 2009. 156(8): p. D301-D309.
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14.N.T.M. Hai, J. Odermatt, V. Grimaudo, K.W. Krämer, A. Fluegel, M. Arnold, D. Mayer and P. Broekmann, Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives. The Journal of Physical Chemistry C, 2012. 116(12): p. 6913-6924.
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20.S.-i. Sakai, S. Nakanishi and Y. Nakato, Mechanisms of Oscillations and Formation of Nano-Scale Layered Structures in Induced Co-Deposition of Some Iron-Group Alloys (Ni−P, Ni−W, and Co−W), Studied by an In Situ Electrochemical Quartz Crystal Microbalance Technique. The Journal of Physical Chemistry B, 2006. 110(24): p. 11944-11949.
21.S. Wen and J.A. Szpunar, Cathodic Potential Oscillations of Sn(II) Reduction and Hydrogen Evolution in Acid Stannous Sulfate Solutions. Journal of The Electrochemical Society, 2006. 153(3): p. E45-E51.
22.S. Nakanishi, S.-i. Sakai, T. Nagai and Y. Nakato, Macroscopically Uniform Nanoperiod Alloy Multilayers Formed by Coupling of Electrodeposition with Current Oscillations. The Journal of Physical Chemistry B, 2005. 109(5): p. 1750-1755.
23.K. Fukami, S. Nakanishi, T. Tada, H. Yamasaki, S.-i. Sakai, S. Fukushima and Y. Nakato, Self-Organized Periodic Growth of Stacked Hexagonal Wafers in Synchronization with a Potential Oscillation in Zinc Electrodeposition. Journal of The Electrochemical Society, 2005. 152(7): p. C493-C497.
24.Y.D. Chiu and W.P. Dow, Accelerator Screening by Cyclic Voltammetry for Microvia Filling by Copper Electroplating. Journal of the Electrochemical Society, 2013. 160(12): p. D3021-D3027.
25.Y. Zhang, G. Ding, H. Wang, P. Cheng and R. Liu, Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs). Journal of Micromechanics and Microengineering, 2015. 25(4): p. 045009.
26.T.P. Moffat, J.E. Bonevich, W.H. Huber, A. Stanishevsky, D.R. Kelly, G.R. Stafford and D. Josell, Superconformal Electrodeposition of Copper in 500–90 nm Features. Journal of The Electrochemical Society, 2000. 147(12): p. 4524-4535.
27.S.-M. Huang, C.-W. Liu and W.-P. Dow, Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution. Journal of The Electrochemical Society, 2012. 159(3): p. D135-D141.
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