臺灣博碩士論文加值系統

現今，可穿戴式與可攜帶式的科技已經吸引廣大的關注，如通信、傳感器和媒體因其具有多功能特性，可以集結成輕薄的設備。可攜式與可穿戴式設備已在微電子產業中快速的發展，達到多功能與微小化的科技。因此軟性印刷電路板扮演重要角色，因其具有可撓曲特性以減少封裝體積。在軟性印刷電路板中，聚醯亞胺為優秀的材料，其有諸多特點如質量輕、耐熱性佳、良好的耐腐蝕性以極高的玻璃轉移溫度，能適合於高溫操作環境。然而聚醯亞胺為非導體基材，表面金屬化過程是必要的以提供電子傳輸路徑。
藉由全濕式製程(Wet method)方法，將聚醯亞胺基材直接金屬化，以取代濺鍍法的高真空操作環境其無法達到節省成本的效益。聚醯亞胺之鎳金屬化第一步驟為KOH處理形成聚醯亞胺酸鹽，隨後以NiCl2進行離子交換、NaBH4進行鎳粒子觸媒之還原，接著無電鍍鎳沉積與電鍍銅，爾後迴銲與熱處理，模擬電子產品在高溫之環境其可靠度。
本研究中，以兩種PI進行探討比較，一為商用PI，另一為改質PI，為中興大學林慶炫老師開發之帶有特殊官能基之PI，特色為能在較低濃度的鹼溶液處理下，進行均勻表面金屬化，可降低製程成本。實驗第一部分探討改質PI與商用PI，經過鹼處理後之PAA層和Ni/PI之界面特性，以及後續電鍍銅後之拉力值表現與Cu/Ni/PI之原子擴散現象，再進行迴銲與老化處理後，其界面擴散行為，第二部分以商用PI，採用不同濃度鹼處理開環，探討開環之界面形貌對拉力值的影響。開環程度藉由全反射式傅立葉轉換紅外光譜儀分析，KOH鹼處理開環前後，PI表面親水特性藉由接觸角測量儀分析，Cu/Ni/PI之界面微結構與原子擴散行為藉由穿透式電子顯微鏡觀察，金屬層與PI層之間之接附強度以拉力測試機測試。

Recently, wearable and portable technologies have attracted considerable attention because multiple functions such as communication, sensor and media, can be integrated in a small and light-weight device. The rapid development of wearable and portable devices has driven the microelectronic industries to develop new technologies to meet the demands of scale miniaturization and multi-functionality. Therefore, the flexible printed circuit board (FPCB) plays an important role in the development of wearable and portable devices due to its high flexibility in reducing packaging volume. Polyimide (PI) is a superior material as a substrate of FPCB and has many advantages such as light-weight, high thermal stability, good anti-corrosion properties and higher glass transition temperature (Tg), which is more sustainable in a high-temperature operational environment. PI is non-conductive, so metallization is necessary to offer electrical transmission routes on its surface.
Direct metallization of polyimide (PI) using wet method can replace the high-vacuum sputtering to achieve the cost-down goal. Nickel (Ni) metallization of PI was performed firstly by a KOH treatment to form potassium salts of polyamic acid, followed by an ion exchange reaction with NiCl2, the reduction of catalytic Ni nanoparticles by NaBH4, the electroless deposition of a Ni film, and finally electroplating copper. The start-up imide-ring opening reaction plays a crucial role in activating inert PI for subsequent Ni implanting and deposition.
In this study, two PI substrates were investigated and compared, one is a commercial PI and the other is a modified PI. There are two parts of experiments. One is interfacials microstructure characterizations of two type of PI, and the other is the effect of KOH concentration on the peel strength examination of the commercial PI. The ring-opening condition was examined using an attenuated total reflection-Fourier transform infrared spectroscope (ATR-FTIR). The contact angle of the PI film before and after KOH treatment was measured by a contact angle instrument using water drop. The interfacial microstructures of Cu/Ni/PI and atomic diffusion were investigated using a transmission electron microscopy (TEM). Adhesion strength between the metallization layer and the PI film was measured using a pull-off tester.

摘要 i
Abstract ii
目錄 iii
圖目錄 v
表目錄 x
第一章 緒論 1
1-1 前言 1
1-2 研究動機 3
第二章 文獻回顧 4
2-1 軟性印刷電路板 4
2-1-1 軟性印刷電路板介紹 4
2-1-2 軟性印刷電路板材料與市場趨勢 4
2-2 聚醯亞胺 7
2-2-1 聚醯亞胺之製程 7
2-2-2 聚醯亞胺之特性 7
2-3 聚醯亞胺表面處理 8
2-3-1 乾式製程(Dry methods) 8
2-3-2 濕式製程(Wet methods) 9
2-4 表面奈米粒子金屬化 19
2-4-1 奈米粒子 19
2-4-2 奈米粒子金屬化 19
2-5 無電電鍍 30
2-5-1 無電電鍍基本原理 30
2-5-2 無電電鍍鎳基本原理 30
2-6 擴散阻障層 31
第三章 實驗方法 33
3-1 材料與藥品 33
3-1-1 Polyimide材料 33
3-1-2 藥品 34
3-2 設備與儀器 35
3-3 儀器原理 36
3-3-1 全反射式傅立葉轉換紅外光譜儀(Attenuated Total Reflection-Fourier Transform Infrared Spectroscope, ATR-FTIR) 36
3-3-2 接觸角測量儀(Contact angle measurement) 37
3-3-3 穿透式電子顯微鏡(Transmission Electron Microscope, TEM) 38
3-3-4 掃描式電子顯微鏡(Scanning electron microscope, SEM) 39
3-3-5 多功能拉力測試機(pull-off tester) 40
3-4 實驗流程 41
3-4-1 Polyimide film 金屬化 41
3-4-2 電鍍銅沉積 42
第四章 結果與討論 43
Ⅰ、HN Polyimide與帶有特殊官能基Polyimide 43
4-1 金屬化表面形貌 43
4-2 鹼處理開環程度 44
4-2-1 ATR-FTIR結構鑑定 44
4-2-2 水滴接觸角分析(Contact Angle) 45
4-3 TEM剖面分析 47
4-3-1 鹼處理開環反應之界面分析 47
4-3-2 還原生成奈米鎳粒子之界面分析 52
4-3-3 無電電鍍鎳沉積之界面分析 57
4-3-4 電鍍銅沉積之界面分析 60
4-4 拉力測試 68
Ⅱ、HN Polyimide不同濃度開環之探討 70
4-5 不同濃度開環程度 70
4-5-1 ATR-FTIR開環程度 70
4-5-2 水滴接觸角分析(Contact Angle) 71
4-6 金屬化表面形貌 73
4-7 TEM剖面分析 74
4-8 拉力測試 78
第五章 結論 81
參考文獻 83

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