臺灣博碩士論文加值系統

電子構裝技術發展目前朝向輕、薄、短小的方向前進。主要的封裝目的是提供一個電力傳送、訊號傳遞、熱的去除及電路的保護的途徑。而各個電子元件運作時所產生的熱，也必需在構裝的設計上來考慮，以保持電子產品的操作溫度在合理的範圍內，電子產品才能有效的運作並維持產品的可靠度。本研究的主要目的在於探討高功率電子元件，在模壓封膠過程中從高溫170℃降至室溫時，由於材料彼此的性質與收縮率不同，使內部產生殘留內應力並導致構裝元件翹曲及損壞問題，這將導致諸如導腳偏離、焊錫接觸不良、斷裂和無信號等問題。本研究將測量高功率元件封膠冷卻後的翹曲程度，並以有限元法之分析軟體模擬驗證翹曲量。搭配田口品質工程法，以封膠熱膨脹係數、晶片厚度、焊層厚度及導線架材質的作為四個控制參數因子，找出降低元件熱應力因素及最佳化組合的搭配。最後將最佳化結果與原始構裝比較確認有效性，驗證本研究方法能提升產品之性能，提供後續業者一個參考依據。

The electronics packaging technology is now moving in a light, thin and short direction. The main package is intended to provide a means of power transmission, signal transmission, thermal removal and circuit protection.
The heat generated by the operation of each electronic component must also be considered in the design of the assembly to keep the operating temperature of the electronic product within a reasonable range so that the electronic product can operate effectively and maintain the reliability of the product. The main purpose of the study is to explore the high-power electronic: when the pressure sealant is cooled from the high temperature of 170℃ to room temperature, due to the differences in material properties and shrinkage, internal residual stress is generated and warping or damage to the constituent elements happen, which lead to various problems such as pin deviation, solder contact failure, breakage, and no signal. In this study, we intend to measure the warpage of high power element sealant after cooling, and verify the warpage by finite element method.

摘要 i
Abstract ii
目錄 iii
表目錄 vii
圖目錄 viii
符號說明 xi
第一章 緒論 1
1.1.前言 1
1.2.電子構裝介紹 3
1.2.1.電子構裝層次 3
1.2.2.封裝技術的演變與種類 5
1.3.電子構裝流程 9
1.4.研究動機與目的 14
1.5.文獻回顧 15
1.6.論文架構 19


第二章基礎理論介紹與研究方法 21
2.1.構裝元件理論基礎 21
2.1.1.有限元素法介紹 21
2.1.2.熱傳導理論原理 24
2.1.3.有限元素法軟體使用之熱傳方法介紹 28
2.2.熱應力理論 32
2.3.田口工程理論基礎 34
2.3.1.田口法基本介紹 34
2.3.2.品質特性與理想機能 36
2.4.研究方法介紹 39
2.4.1.封膠原理與製程參數 39
2.4.2.構裝尺寸與材料特性說明 42
2.4.3.表面翹曲量測與數值分析 44
第三章 幾何建立與FEM有限元素法分析 47
3.1.繪製3D結構模型與模擬軟體應用 47
3.1.1. 構裝幾何模組建立 47
3.1.2.ANSYS 分析軟體介紹 47
3.2.電子構裝熱應力模擬分析 49
3.2.1.前處理設定 49
3.2.2.網格收斂建立與質量分析 49
3.2.3.系統設定與邊界條件 51
3.2.4.運算求解 52
3.2.5.後處理分析 52
第四章 田口品質法模擬之分析與結果討論 57
4.1. 以田口方法建立分析流程 57
4.1.1.實驗因子選擇 57
4.1.2.實驗直交表的選用 59
4.2.田口實驗結果 59
4.2.1.使用田口法建立模型之模擬結果 59
4.2.2.構裝中晶片熱應力分析及控制因子之 S/N比 62
4.3.模擬結果分析與討論 64
4.3.1.原始構裝體熱應力模擬分析 64
4.3.2.田口法熱應力模擬分析 65
4.4. 導線架應力模擬分析與討論 67
4.5. 最佳化設計分析與討論 70
第五章 結論與未來展望 74
5.1.結論 74
5.2.未來展望 75
參考文獻 76

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