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研究生:林承業
研究生(外文):Cheng-YehLin
論文名稱:濺鍍氣體通量對含氫碳氮鍍層(a-CNx:H)之機械性質及磨潤性質之影響
論文名稱(外文):Effect of Flow Rate of Sputtering Gas on Mechanical and Tribological Properties of Hydrogenous Carbon Nitride(a-CNx:H) Prepared by DC Magnetron Sputtering
指導教授:蘇演良
指導教授(外文):Yen - Liang Su
學位類別:碩士
校院名稱:國立成功大學
系所名稱:機械工程學系
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2017
畢業學年度:105
語文別:中文
論文頁數:126
中文關鍵詞:磁控濺鍍碳氮鍍膜(a-CNx)濺鍍氣體磨潤性質耐蝕性
外文關鍵詞:Magnetron SputteringAmorphous Carbon Nitride(a-CNx)TribologySputtering GasCorrosion resistance
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本研究採用非平衡磁控濺鍍在高速鋼以及矽晶片上濺鍍含氫碳氮鍍膜,並探討鍍膜的機械性質、磨潤性質、耐腐蝕性以及鑽削等應用層面。
實驗主要分為兩個階段:第一階段為在相同濺鍍參數下探討不同氮氬比對鍍層的影響;第二階段為添加濺鍍氣體於碳氮鍍層及含氫類鑽碳鍍層中,以分析不同氣體通量對鍍層的影響,最後將第二階段磨潤性質最佳之鍍層濺鍍於微鑽針上,並進行鑽削印刷電路板實驗,以評估其在工業上的應用表現。
第一階段的碳氮鍍層氮氬比控制在0.25~0.36之間會有最佳的機械與抗磨耗性質。第二階段通入乙炔後可降低鍍層的磨耗率,其中通入4 sccm乙炔的鍍層(CNH4)有最低的磨耗率0.175(10-6 mm3/Nm);另一方面通入氮氣未能提高含氫類鑽碳鍍層的機械與抗磨耗性質,CH08鍍層有全系列鍍層中最低的磨耗率0.053 (10-6 mm3/Nm)以及摩擦係數0.08。將CH08以及CNH8鍍層披覆於微鑽針均可有效減少磨耗面積,此外所有鍍層的耐蝕性皆優於未濺鍍原材。
This study discusses the mechanical and tribological properties of hydrogenous carbon nitride coatings deposited by unbalanced DC magnetron sputtering using nitrogen-argon mixture gas and graphite as the source. In this experiment, coatings are deposited on HSS and Si wafer with different flow rate of sputtering gas. This investigation includes two stages. First, We change the nitrogen/argon ratio. Second, we change the flow rate of acetylene. In the first stage, carbon nitride where nitrogen/argon ratio is controlled among 0.25 to 0.36 shows the best mechanical performances and lowest wearing rate. In the second stage, the wearing rate could be reduced by introducing the acetylene. The lowest wear rate 0.175(10-6 mm3/Nm) is obtained when the 4 sccm of acetylene flow rate is introduced. The micro-drillers which coated with hydrogenous carbon nitride coatings could effectively reduce the wearing area. Besides that, the anti-corrosion of all coatings were better than the uncoated ones.
口試證明 I
摘要 II
Abstract III
致謝 XII
總目錄 XIII
附錄目錄 XV
圖目錄 XVI
表目錄 XIX
第一章 緒論 1
第二章 理論探討與文獻回顧 2
2-1 非平衡磁控濺鍍特點 2
2-2 碳氮鍍膜性質 2
2-3 氮氬比例對碳氮鍍膜性質的影響 2
2-4 添加乙炔對碳氮鍍膜性質的影響 2
2-5 添加氮氣對含氫類鑽碳鍍膜性質的影響 3
2-6 小結 3
第三章 實驗方法與步驟 4
3-1 實驗目的 4
3-2 實驗流程 4
3-3 鍍膜濺鍍流層以及實驗步驟 7
3-3-1 鍍層參數與鍍膜流程 7
3-3-2 底材成份 9
3-3-3 薄膜結構分析 9
3-3-4 薄膜成分分析 10
3-3-5 表面粗糙度分析 10
3-3-6 硬度試驗 10
3-3-7 附著性試驗 11
3-3-8 磨耗實驗 12
3-3-9 PCB微鑽削實驗 13
3-3-10電化學腐蝕實驗 15
3-3-12高溫氧化實驗 15
3-3-13實驗設備 16
第四章 實驗結果與討論 18
4-1 第一階段:改變靶材配置對CN-Ti鍍層影響 18
4-1-1 成分分析 18
4-1-2 結構分析 19
4-1-3 薄膜SEM斷面 21
4-1-4 機械性質分析 23
4-1-5 磨耗性質分析 26
4-1-6 小結 30
4-2 第二階段:改變氮氣及乙炔通量對C:N:H鍍層影響 31
4-2-1 鍍層成份分析 31
4-2-2 結構分析 33
4-2-3 薄膜SEM斷面 37
4-2-4 機械性質分析 39
4-2-5 磨耗分析 46
4-3 鍍膜對鑽針磨耗性影響 54
4-4 電化學腐蝕實驗 59
4-5 高溫氧化實驗 65
第五章 結論 67
第六章 未來展望與建議 68
第七章 參考文獻 69
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