(44.192.112.123) 您好!臺灣時間:2021/03/09 00:08
字體大小: 字級放大   字級縮小   預設字形  
回查詢結果

詳目顯示:::

我願授權國圖
: 
twitterline
研究生:劉懂
研究生(外文):Liu, Dong
論文名稱:熱固性塑膠透鏡平板成形之研究
論文名稱(外文):Study on Molding of Thermosetting Plastic Lens Sheet
指導教授:陳仁浩
指導教授(外文):Chen, Ren-Haw
口試委員:徐瑞坤鄭中緯
口試委員(外文):Hsu, Ray-QuenCheng, Chung-Wei
口試日期:2017-07-24
學位類別:碩士
校院名稱:國立交通大學
系所名稱:機械工程系所
學門:工程學門
學類:機械工程學類
論文種類:學術論文
論文出版年:2017
畢業學年度:105
語文別:中文
論文頁數:77
中文關鍵詞:熱固性熱壓
外文關鍵詞:thermosethot embossing
相關次數:
  • 被引用被引用:1
  • 點閱點閱:53
  • 評分評分:系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔系統版面圖檔
  • 下載下載:0
  • 收藏至我的研究室書目清單書目收藏:1
目錄
摘要 I
Abstract III
致謝 V
目錄 VI
圖目錄 IX
表目錄 XII
第一章 緒論 1
1.1研究背景 1
1.2文獻回顧 2
1.3研究動機與目的 6
1.4研究方法 7
第二章 理論基礎 9
2.1透鏡陣列平板之功能 9
2.2高分子材料基本性質 10
2.2.1高分子材料分類 10
2.2.2高分子材料的熱學特性 11
2.2.3高分子材料的流變特性介紹 12
2.2.4熱固性高分子材料的交聯固化特性 15
2.2.5熱固性丙烯酸系樹脂的材料性質 18
2.3熱固性塑膠的熱壓成形基礎原理 21
第三章 熱固性光學塑膠成形實驗 23
3.1熱壓設備 23
3.2熱壓實驗流程 33
3.3半球透鏡收縮率量測 37
3.3.1透鏡陣列平板尺寸簡介 37
3.3.1半球透鏡收縮率與轉印率量測 38
3.3.2量測儀器介紹 39
第四章 實驗結果分析與討論 41
4.1熱固性光學塑膠的熟化實驗 41
4.1.1模溫對成形的影響 41
4.1.2冷卻對成形的影響 49
4.1.3合適之成形參數值 54
4.2透鏡直徑收縮率量測與討論 57
4.3透鏡高度轉印率量測與討論 64
第五章 結論與未來展望 71
5.1結論 71
5.2未來展望 73
參考文獻 74
參考文獻
[1] C. Hopmann and T. Fischer, "New plasticising process for increased precision and reduced residence times in injection moulding of micro parts," CIRP Journal of Manufacturing Science and Technology, vol. 9, pp. 51-56, 2015.

[2] Serope Kalpakjian and Steven R.Schmid, "Manufacturing engineering and technology, " Prentice Hall, Singapore, 2010.

[3] 謝俊雄, 塑膠工程學, 文京圖書有限公司, 台灣, 1976.

[4] C. Y. Khor, M. Z. Abdullah, Z. M. Ariff, and W. C. Leong, "Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package," International Communications in Heat and Mass Transfer, vol. 39, no. 5, pp. 670-680, 2012.

[5] A. Harkous, G. Colomines, E. Leroy, P. Mousseau, and R. Deterre, "The kinetic behavior of Liquid Silicone Rubber: A comparison between thermal and rheological approaches based on gel point determination," Reactive and Functional Polymers, vol. 101, pp. 20-27, 2016.

[6] L. Meunier, G. Chagnon, D. Favier, L. Orgéas, and P. Vacher, "Mechanical experimental characterisation and numerical modelling of an unfilled silicone rubber," Polymer Testing, vol. 27, no. 6, pp. 765-777, 2008.

[7] C. C. Kuo and Y. R. Chen, "Rapid optical inspection of bubbles in the silicone rubber," Optik - International Journal for Light and Electron Optics, vol. 124, no. 13, pp. 1480-1485, 2013.

[8] N. S. Ong, Y. H. Koh, and Y. Q. Fu, "Microlens array produced using hot embossing process, " Microelectronic Engineering, vol. 60, no. 3, pp.365-379, 2002.

[9] M. Packianather, C. Griffiths, and W. Kadir, "Micro Injection Moulding Process Parameter Tuning," Procedia CIRP, vol. 33, pp. 400-405, 2015.

[10] M. Sahli, C. Millot, C. Roques-Carmes, C. Khan Malek, and J. C. Gelin, "On the use of hot embossing for the reproduction of the surface topography of mould microreliefs," pp. 293-296, 2006.

[11] D. R. Gunasegaram, I. M. Bidhendi, N.J. McCaffrey, "Modelling the casting process of plastic ophthalmic lenses, " International Journal of Machine Tools and Manufacture, 40, 5, pp. 623-639 , 2000.

[12] H. D. Rowland and W. P. King, "Polymer deformation and filling modes during microembossing," Journal of Micromechanics and Microengineering, vol. 14, no. 12, pp. 1625-1632, 2004.
[13] S. J. Hwang, and Y. S. Chang, "P-V-T-C Equation for Epoxy Molding Compound, " IEEE Transactions on Components and Packaging Technologies, 29, pp. 112-117, 2006.

[14] 劉士榮, 高分子流變學, 滄海書局, 台灣, 2010.

[15] J. Tamil, S.H. Ore, K.Y. Gan, Y.Y. Bo, G. Ng, P.T. Wah, et al.,
"Molding flow modeling and experimental study on void control for flip chip package panel molding with molded underfill technology,"
J Microelectron Electron Packaging, 9, pp. 19-30, 2012.

[16] K. M. B. Jansen et al., "Modeling and characterization of molding compound properties during cure," Microelectronics Reliability, vol. 49, no. 8, pp. 872-876, 2009.

[17] S. J. Hwang and Y. S. Chang, "Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal state," Journal of Polymer Science Part B: Polymer Physics, vol. 43, no. 17, pp. 2392-2398, 2005.

[18] 林威宇, " 動態壓力控制對微結構熱壓特性的影響暨加工過程中聚丙烯的結晶特性的初步探討, " 碩士論文, 國立交通大學, 台灣, 2003.

[19] 林上評, " 創新型LED全晶圓含透鏡封裝製程及微結構複合透鏡模具製作探討, " 碩士論文, 國立台灣大學, 台灣, 2014.

[20] 洪欣治, " 陣列式鏡頭影像品質提升之探討, " 碩士論文, 國立中山大學, 台灣, 2015.

[21] 盧冠霈, " 熱固性塑膠透鏡平板成型過程數值模擬分析, "碩士論文,國立交通大學, 台灣,2017
連結至畢業學校之論文網頁點我開啟連結
註: 此連結為研究生畢業學校所提供,不一定有電子全文可供下載,若連結有誤,請點選上方之〝勘誤回報〞功能,我們會盡快修正,謝謝!
QRCODE
 
 
 
 
 
                                                                                                                                                                                                                                                                                                                                                                                                               
第一頁 上一頁 下一頁 最後一頁 top
系統版面圖檔 系統版面圖檔