臺灣博碩士論文加值系統

由於現今科技的進步，使得半導體封裝測試廠的製程須不斷改進，以因應變化迅速的市場。為了提升企業本身的競爭力、應對快速進步的技術和不斷提高的品質需求，在製程上需時常改善並創新。然而，各製程都有獨立的標準作業程序(Standard Operation Procedure, SOP)規範，這對企業生產高品質的產品是非常重要的。隨著技術快速進步與品質要求不斷增加，製程亦需時常創新與改善，以提升企業本身的競爭力。對大型公司而言，製程是產品製造的核心，良好的製程方法可應對大量的存貨生產，與各種客製化的產品訂單。
本研究以雷射刻印機刻印2D條碼為主軸，主要是由於晶圓代工廠設計的各種晶片，以及封裝測試廠的間接物料越來越多樣化。為了維持原來的服務水準，在多樣化及各種存貨需要更多的儲存空間下，需投入額外物料管理作業的人力，使得生產成本大量增加。2D條碼系統搭配自動化設備上之條碼機與終端資料庫整合，可以減少物的料管理與人力的消耗，當然也會大大的提升產能。

The technology nowadays has made rapid progress, the process of semiconductor packaging are changed rapidly which is caused by market requirement, of course, the semiconductor packaging plant is among them. However, every process has its own SOP (Standard Operation Procedure) which is very important to create high quality production for every company. With the rapid progress of technology and the exaltation of quality requirements, process must be innovated and improved constantly, because it immediately concerns the company competitiveness. The process is the core of manufacturing for every company because of having good process means that can deal with a mount of production and customized orders.
We’re researching laser engraving machine engraving 2D barcode in this study, the indirect materials in semiconductor packaging plant will become more and more which is caused by wafer foundry design. With the diverse productions and storage space of inventory, companies need to cost a lot money and manpower to maintain the original level of service. The 2D barcode system with combination of terminal database integration and automated barcode machine can reduce the management of materials and manpower consumption, and also enhance the production capacity greatly.

目錄
摘要..........................................I
Abstract....................................II
謝誌........................................III
目錄.........................................IV
表目錄.......................................VII
圖目錄......................................VIII
第1章 緒論.....................................1
1.1研究動機....................................1
1.2研究目的....................................1
1.3研究目標....................................2
1.4封裝製程發展史...............................2
1.4.1政府對半導體發展之政策.......................2
1.4.2國內半導體產業發展階段.......................3
1.4.3我國半導體產業發展現況.......................5
第2章 封裝、綠光雷射與通訊協定介紹.................11
2.1 IC封裝製程簡介..............................11
2.1.1為何IC需要封裝.............................11
2.1.2製程說明..................................12
2.1.3 BGA封裝介紹..............................16
2.1.4 BGA與傳統 IC之比較........................21
2.2綠光雷射....................................22
2.2.1綠光雷射的振盪原理..........................22
2.2.2綠光雷射刻印機的特性.........................23
2.2.3金屬的雷射吸收率............................25
2.3半導體廠自動化之通訊協定SECS I/II & GEM.........27
2.3.1 SECS 通訊之SECS Message（Stream Function）.28
2.3.2 SECS Message之資料結構.....................31
2.3.3滿足SECS II之必要條件........................32
2.3.4主機與機台的對話模式..........................33
2.3.5話中插話....................................34
2.3.6設備控制用通訊協定GEM.........................34
第3章 設計概念與使用元件............................38
3.1機構設計......................................39
3.1.1基板堆疊區...................................40
3.1.2真空夾持定位平台..............................41
3.1.3平台移載翻轉軸................................42
3.1.4 CCD檢測定位軸...............................43
3.1.5入料流道.....................................44
3.1.6出料流道.....................................45
3.1.7入料Y軸.....................................46
3.1.8出料Y軸.....................................47
3.1.9雷射刻印組...................................48
3.2整體設計......................................49
3.3作業流程圖....................................50
3.4軟體介面說明...................................51
3.5使用設備......................................64
3.5.1伺服馬達....................................65
3.5.2伺服馬達驅動器...............................66
3.5.3感應馬達....................................67
3.5.4薄型氣缸....................................68
3.5.5旋轉型氣缸..................................69
3.5.6磁偶式無桿型氣缸.............................70
3.5.7雙軸氣缸....................................71
3.5.8 Color Sensor..............................72
3.5.9 Color Sensor 放大器模組.....................73
3.5.10綠光雷射刻印機...............................74
3.5.11 2D Barcode Reader........................76
3.5.12真空產生器..................................78
3.5.13直動常閉型流體控制閥..........................79
3.5.14 2馬力鼓風機................................80
3.5.15定位用 CCD..................................81
第4章 結果與討論...................................82
4.1伺服馬達參數設定.................................82
4.2雷射刻印參數設定.................................82
4.3良率檢測判定....................................83
第5章結論 .........................................86
第6章未來與展望....................................86
參考文獻..........................................87
作者簡介..........................................88

參考文獻
[1]陳鴻基/王俊程，1999，台灣資訊產業傳 ，中華徵信所。
[2]施敏/梅凱瑞，2008，半導體製程概論，林鴻志編譯，國立交通大學出版社。
[3]蕭宏，2014，半導體製程技術導論(第三版)，全華圖書公司。
[4]基恩斯股份有限公司，綠光雷射刻印機基本資訊介紹，http://www.keyence.com.tw/products/marker/green-laser/index.jsp。
[5]陳以撒，2006，機電整合（修訂四版）3.6.3交流伺服電動機(AC servo motor)，全華圖書公司。
[6]Global Information & Control Committee, 1999 , “Standard for SEMI Equipment Communication Standard Message Service,” SEMI E13.
[7]Global Information & Control Committee, 1999 ,“SEMI equipment communications standard 1 message transfer,” SEMI E4-0699.
[8]Global Information & Control Committee, 1998 ,“SEMI equipment communications standard 2 message content,” SEMI E5-0299.
[9]Global Information & Control Committee, 2000 ,“Generic model for communications and control of manufacturing equipment,” SEMI E30-0600.
[10]Global Information & Control Committee, 1999 ,“Specification for Cassette Transfer Parallel I/O Interface,” SEMI E23.