臺灣博碩士論文加值系統

　　近年來，隨著電子產品追求輕薄、可撓曲之趨勢下，玻璃基板亦朝向薄型化、可撓曲方向發展。相較於其他可撓性基板材料，超薄玻璃基板具有優異的化學穩定性、氣密性、抗濕性、高透光率、高彎曲性及低表面粗糙度等優點，而使其將成為可撓式基板理想之替代品，且隨著印刷電子技術的大幅進展，若能再搭配卷對卷凹版轉印製程，將有助於大量生產，降低製造成本。超薄玻璃雖具可撓性但仍因具有玻璃之硬脆特性，其彎曲強度及彎曲疲勞壽命仍須予以深入探討，亦為本論文之主要目標。
　　首先，本論文將厚度為50μm及100μm之超薄玻璃基板分別經由機械切割、皮秒雷射切割及化學濕蝕刻三種切割製程裁切後，透過兩點/三點彎曲實驗量測及彎曲強度公式計算出不同切割製程下之極限彎曲強度，並對各切割製程與不同厚度超薄玻璃基板之極限彎曲強度進行比較，以找出最適合超薄玻璃基板之厚度及切割製程。
接著，為了提升超薄玻璃基板之彎曲強度，本論文亦透過光學顯微鏡及場發射掃瞄式電子顯微鏡對玻璃切割邊緣及斷面進行觀察分析，以探討影響極限彎曲強度之原因，並應用工研院之雷射劈裂修補技術來消除超薄玻璃基板邊緣上之缺陷。
　　最後，本論文將印有金屬電極之超薄玻璃基板進行切割，並以自製的兩點彎曲測試平台進行疲勞實驗，探討於不同的曲率半徑、溫度、頻率下之疲勞壽命與破壞機制，另藉由有限單元分析軟體ANSYS®進行超薄玻璃基板試片之彎曲應力分析，並配合兩點彎曲疲勞測試平台之疲勞實驗結果，建構出其S-N曲線。
　　本論文之研究成果除有助於掌握不同厚度之超薄玻璃基板於不同切割製程下之極限彎曲強度外，並可提供相關研究人員於設計可撓性產品及評估其彎曲壽命時之參考。

　　In recent years, consumers’ eager demand of flexible products with great lightweight, miniaturization and flexible feature has nowadays driven the characteristic of ultra-thin glass substrate toward high thinning and flexibility. Ultra-thin glass holds many advantages over other flexible substrate materials for flexible electronics or printed electronics, including excellent chemical stability, hermeticity, moisture resistance, high optical transmission, low surface roughness and long-term stability. It has increasingly become a ideal substitute of substrate material in various microelectronics applications. With the advances in printed electronics technology, if ultra-thin glass can apply in roll-to-roll gravure offset printing process, which will useful in continuous mass production and reduce the manufacturing costs. Despite of the great flexibility capacity of ultra-thin glass, glass itself is generally a brittle and fragile material. Thus, to explore its ultimate flexural strength and flexural fatigue life is essential, they also are the main target in this thesis.
　　Firstly, the ultra-thin glass substrate with thicknesses of 50μm and 100μm are cut by three kinds of cutting processes, namely mechanical dicing, pico-second laser dicing and wet etching. To measure and caculate the ultimate flexural strength of an ultra-thin glass substrate under different cutting processes by two-point / three-point bending test and bending strength formula. Compare the ultimate bending strength of ultra-thin glass substrate with different thickness between each cutting process to find the suitable thickness and cutting process for ultra-thin glass substrate.
　　Then, in order to improve the bending strength of the ultra-thin glass substrate, the quality of the cutting edges and cross-sections of the glass cutting are observed and analyzed by optical microscope and field emission scanning electron microscope to investigate the reasons for impact of the ultimate bending strength. And the laser peeling proposed by Industry Technology Research Institute, Taiwan, is further applied for eliminating micro edge cracks/flaws of the ultra-thin glass substrate.
　　Finally, this thesis cut the ultra-thin glass substrate which is printed with metal electrode and using a self-designed two-point tester for fatigue experiments, to explore the effects of different radius of curvature, temperature and frequency on fatigue life and its damage mechanism. The finite element analysis software ANSYS is used to bending stress analysis of ultra-thin glass specimens. The S-N curve is constructed by the fatigue test results of the self-designed two-point tester and the results of the finite element analysis
　　The results of this paper will help to understand the ultimate bending strength of ultra-thin glass substrate under different cutting processes with different thicknesses and provide the reference for the flexible products design when evaluate its bending life.

摘要 I
ABSTRACT III
目錄 V
表目錄 IX
圖目錄 X
第一章、 導論 1
1.1 研究動機 1
1.2 文獻回顧 3
1.3 研究目標 7
第二章、 含金屬電極之超薄玻璃基板 9
2.1 卷對卷凹版轉印簡介 9
2.2 切割製程介紹 10
2.2.1 機械切割 10
2.2.2 化學濕蝕刻切割 11
2.2.3 皮秒雷射切割 12
2.2.4 雷射劈裂修補 13
第三章、 研究方法 14
3.1 彎曲強度分析 14
3.1.1 三點彎曲 14
3.1.2 兩點彎曲 14
3.2 有限單元法接觸分析 15
3.3 疲勞理論 16
3.3.1 S-N曲線 17
3.4 Chauvenet準則 17
第四章、 實驗方法 19
4.1 實驗設備 19
4.1.1 微拉力萬用測試儀 19
4.1.2 光學顯微鏡 19
4.1.3 兩點彎曲疲勞測試平台 19
4.1.4 掃描式電子顯微鏡 21
4.2 實驗流程 21
4.2.1 三點彎曲實驗 22
4.2.2 兩點彎曲實驗 23
4.2.3 彎曲疲勞實驗 23
4.3 有限單元分析模型 24
4.3.1 三點彎曲 24
4.3.2 兩點彎曲 25
第五章、 結果與討論 26
5.1 各切割製程下之斷面 26
5.2 極限彎曲強度 27
5.2.1 三點彎曲 27
5.2.2 兩點彎曲 30
5.3 雷射劈裂 30
5.3.1 雷射劈裂之斷面 31
5.3.2 雷射劈裂之極限彎曲強度 32
5.4 有限單元分析 32
5.4.1 三點彎曲 32
5.4.2 兩點彎曲 33
5.5 彎曲疲勞實驗 33
5.5.1 100μm之超薄玻璃基板試片 34
5.5.2 50μm之超薄玻璃基板試片 35
5.5.3 頻率與溫度對疲勞壽命之影響 36
5.5.4 線寬之影響 37
第六章、 結論與未來展望 39
參考文獻 42
附表 47
附圖 51

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