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chapter 3 [1]K. Nomura, H. Ohta, A. Takagi, T. Kamiya, M. Hirano, and H. Hosono, Nature 432 (2004), 488. [2]H. Hosono, Solids Journal of Non-Crystalline Solids 352 (2006), 851. [3]E. Fortunato, P. Barquinha, A. Pimentel, A. Goncalves, A. Marques, L. Pereira, and R. Martins, Advanced Materials 17 (2005), 590. [4]M. S. Grover, P. A. Hersh, H. Q. Chiang, E. S. Kettenring, J. F. Wager, and D. A. Keszler, Journal of Physics D: Applied Physics 40 (2007), 1335. [5]H.-H. Hsieh and C.-C. Wu, Applied Physics Letters 91 (2007), 013502. [6]R. Hayashi, M. Ofuji, N. Kaji, K. Takahashi, K. Abe, H. Yabuta, M. Sano, H. Kumomi, K. Nomura, T. Kamiya, M. Hirano, and H. Hosono, Journal of the Society for Information Display 15 (2007), 915. [7]C.-Y. Lin, C.-H. Tsai, H.-T. Lin, L.-C. Chang, Y.-H. Yeh, Z. Pei, Y.-R. Peng, and C.-C. Wu, Organic Electronics 12 (2011), 1777. [8]B. N. Pal, J. Sun, B. J. Jung, E. Choi, A. G. Andreou, and H. E. Katz, Advanced Materials 20 (2008), 1023. [9]A. Kudo, H. Yanagi, K. Ueda, H. Hosono, H. Kawazoe, and Y. Yano, Applied Physics Letters 75 (1999), 2851. [10]R. K. Gupta, K. Ghosh, and P. K. Kahol, Physica E 41 (2009), 617. [11]N. Münzenrieder, C. Zysset, L. Petti, T. Kinkeldei, G. A. Salvatore, and G. Tröster, Solid-State Electronics 87 (2013), 17. [12]M. Lorenz, A. Lajn, H. Frenzel, H. v. Wenckstern, M. Grundmann, P. Barquinha, R. Martins, and E. Fortunato, Applied Physics Letters 97 (2010), 243506. [13]D. H. Lee, K. Nomura, T. Kamiya and H. Hosono, IEEE Electron Device Letters, 32 (2011), 1695. [14]H. Kim, S. Kim, K.-K. Kim, S.-N. Lee, and K.-S. Ahn, Japanese Journal of Applied Physics 50 (2011), 105702. [15]A. Chasin, S. Steudel, K. Myny, M. Nag, T.-H. Ke, S. Schols, J. Genoe, G. Gielen and P. Heremans, Applied Physics Letters 101 (2012), 113505. [16]A. Chasin, M. Nag, A. Bhoolokam, K. Myny, S. Steudel, S. Schols, J. Genoe, G. Gielen, and P. Heremans, IEEE Transactions on Electron Devices 60 (2013), 3407. [17]A. Chipman, Nature 449 (2007), 131. [18]F. Zhang, M. Johansson, M. R. Andersson, J. C. Hummelen, O. Inganäs, Advanced Materials 14 (2002), 662. [19]J. Ouyang, C.-W. Chu, F.-C. Chen, Q. Xu, Y. Yang, Advanced Functional Materials 15 (2005), 203. [20]K. Fehse, K. Walzer, K. Leo, W. Lövenich, A. Elschner, Advanced Materials 19 (2007), 441. [21]Y.-H. Huang, C.-Y. Lu, S.-T. Tsai, Y.-T. Tsai, C.-Y. Chen, W.-L. Tsai, C.-Y. Lin, H.-W. Chang, W.-K. Lee, M. Jiao, C.-C. Wu, Applied Physics Letters 104 (2014), 183302. [22]D. Vaufrey, M. B. Khalifa, J. Tardy, C. Ghica, M. G. Blanchin, C. Sandu, and J. A. Roger, Semiconductor Science and Technology 18 (2003), 253. [23]S. M. Sze, Physics of Semiconductor Devices (1981), New York, Wiley, p. 258. [24]A. Takagi, K. Nomura, H. Ohta, T. Kamiya, M. Hirano, and H. Hosono, Thin Solid Films 486 (2005), 38. [25]T. Kamiya and H. Hosono, NPG Asia Materials 2 (2010), 15. [26]S. M. Sze, Physics of Semiconductor Devices (1981), New York, Wiley, p. 249. [27]D. H. Lee, K. Nomura, T. Kamiya, and H. Hosono, ECS Solid State Letters 1 (2012), Q8-Q10.
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