臺灣博碩士論文加值系統

本文發展一新型零阿貝誤差三軸十二吋晶圓檢測平台。此晶圓檢測平台由花崗岩座、xyz載台還有垂直探頭定位系統構成。花崗岩座包含了安裝xyz載台的花崗岩底座與安裝垂直探頭定位系統的花崗岩龍門。xy載台在設計上採用了共平面概念與box-in-box概念。共平面與box-in-box概念能使晶圓表面、y軸平台驅動面與x軸平台驅動面這三個面在同一z平面上。每個載台的移動是由獨立的雷射干涉儀來量測，且這三軸雷射的交點位於晶圓表面。除此之外，垂直量測探頭的量測點位於此三軸雷射交點,本文發展之三軸晶圓檢測平台的量測系統在三個軸向都符合阿貝原理，因此本系統爲一零阿貝誤差的量測系統。此檢測平臺的移動範圍達到 300mm x 300mm x 5mm，符合十二吋晶圓的量測需求。爲了達到高精密定位，x軸氣浮平臺與y軸氣浮平臺的平行度與垂直度的校正在此晶圓檢測平台上非常重要。本文採用一種利用雷射與五角棱鏡的光學校正法作爲校正方法。此大範圍檢測平臺利用有限元素法來分析關鍵結構變形量與共振頻率，並利用衝擊槌與LDV進行共振頻率的量測。

This thesis developed a new Abbe error free 12" 3D wafer inspection stage. The wafer inspection stage consists of a granite frame, an xyz stage and a vertical probe positioning stage. The granite frame consists of a granite base for mounting the xyz stage and a granite gantry for mounting the vertical probe positioning stage. The xy stage is designed with the co-planar concept and box-in-box concept. The co-planar concept and box-in-box concept make the three elevations of the wafer surface, y-stage guide surface and x-stage guide surface are on the same z-plane. The movement of each stage is sensed by an individual laser interferometer, and the intersection point of the three axes of laser interferometers is located on the top of the wafer surface. In addition, the focus point of the vertical optical probe coincides with this intersection point of the three axes of laser interferometers. Therefore, the measuring system of the developed 3D wafer inspection stage fulfills the Abbe principle in 3 directions, and is an Abbe error free measuring system. The measuring range of this wafer inspection stage is 300mm x 300mm x 5mm, which fits the dimension of 12-inch wafers. To achieve high-precision positioning, both parallelism calibration and perpendicularity calibration of x-direction guides and y-direction guides are important in this wafer inspection stage. A calibration method using laser and pentaprisms is presented in this thesis. For this long travel range stage, the finite element method (FEM) is applied to analyze the structural deformation and vibration natural frequencies, the natural frequencies are measured by using impact hammer and Laser Doppler Vibrometer (LDV).

口試委員會審定書 i
誌謝 ii
中文摘要 iii
ABSTRACT iv
CONTENTS v
LIST OF FIGURES viii
LIST OF TABLES xiii
Chapter 1 Introduction 1
1.1 Background and Motivation 1
1.2 Paper Review 2
1.3 Research Objective 9
1.4 Thesis Outline 10
Chapter 2 Design Related Theorem 12
2.1 Abbe Theorem 12
2.2 Coplanar Design Concept 13
2.3 Abbe Free in 3-dimension 14
2.4 Structural Analysis Theorems of Finite Element Method 15
2.4.1 Static Analysis in Finite Element Analysis 16
2.4.2 Natural Frequency and Mode Shape in Finite Element Analysis 16
2.5 Component Theorems of Coplanar Motion Stage 17
2.5.1 Air Bearing 17
2.5.2 Linear Motor 20
2.6 Principle of Vibration Sensor 22
2.7 Parallelism and Orthogonality Calibration 24
Chapter 3 Wafer Inspection Stage Structure and Key Technologies 27
3.1 Basic Structure 27
3.2 Coplanar XYZ Stage 30
3.2.1 Z-stage 30
3.2.2 Coplanar XY Stage 33
3.3 Granite Gantry and Granite Base 36
3.4 Laser Positioning System 39
3.5 Measuring Probe System 41
3.6 Kinematics Mounts for Reference Mirror 42
3.7 Parallelism and Orthogonality Calibration 44
3.8 Parameter Design of Wafer Inspection Stage 56
Chapter 4 Structural Analysis of Wafer Inspection Stage 60
4.1 Velocity Calculations of X- and Y- stage 60
4.1.1 Weight of driving elements on wafer inspection stage 60
4.1.2 Velocity Calculation of Y-stage 61
4.1.3 Velocity Calculation of X-stage 64
4.2 Structural Static Analysis and Convergence Test 66
4.2.1 FEM Models 66
4.2.2 Self-weight Analysis and Convergence Test of the XYZ Stage 67
4.2.3 Self-weight Analysis and Convergence Test of Z-reference Mirror 70
4.3 Modal Analysis and Modal Test of wafer inspection stage 72
4.3.1 Modal Analysis of Wafer Inspection Stage 72
4.3.2 Modal Test of Wafer Inspection Stage 75
Chapter 5 Conclusions and Suggestions 79
5.1 Conclusions 79
5.2 Suggestions 79
REFERENCES 81
Appendix A Parametric Model Generation Program 84
Appendix B ANSYS Parametric Analysis Program 88
Appendix C Velocity Calculation using Aerotech Motor sizer Software 98
Vitae 105

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